JP7219991B2 - 半導体装置の製造装置および製造方法 - Google Patents

半導体装置の製造装置および製造方法 Download PDF

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Publication number
JP7219991B2
JP7219991B2 JP2021553366A JP2021553366A JP7219991B2 JP 7219991 B2 JP7219991 B2 JP 7219991B2 JP 2021553366 A JP2021553366 A JP 2021553366A JP 2021553366 A JP2021553366 A JP 2021553366A JP 7219991 B2 JP7219991 B2 JP 7219991B2
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JP
Japan
Prior art keywords
chip
holding surface
substrate
inclination angle
semiconductor device
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JP2021553366A
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English (en)
Japanese (ja)
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JPWO2022130472A1 (https=
Inventor
悠二 永口
耕平 瀬山
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Shinkawa Ltd
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Shinkawa Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07113—Means for calibration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07223—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2021553366A 2020-12-14 2020-12-14 半導体装置の製造装置および製造方法 Active JP7219991B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/046618 WO2022130472A1 (ja) 2020-12-14 2020-12-14 半導体装置の製造装置および製造方法

Publications (2)

Publication Number Publication Date
JPWO2022130472A1 JPWO2022130472A1 (https=) 2022-06-23
JP7219991B2 true JP7219991B2 (ja) 2023-02-09

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JP2021553366A Active JP7219991B2 (ja) 2020-12-14 2020-12-14 半導体装置の製造装置および製造方法

Country Status (6)

Country Link
US (1) US12568792B2 (https=)
JP (1) JP7219991B2 (https=)
KR (1) KR102695597B1 (https=)
CN (1) CN114981938B (https=)
TW (1) TWI810742B (https=)
WO (1) WO2022130472A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024176665A (ja) * 2023-06-09 2024-12-19 株式会社新川 実装装置および実装装置が備えるボンディングヘッドの変位検出方法
TW202538898A (zh) * 2024-01-26 2025-10-01 日商東京威力科創股份有限公司 處理系統及處理方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308597A (ja) 2000-04-25 2001-11-02 Toray Eng Co Ltd チップ実装装置およびチップ実装装置における平行度調整方法
JP2007157970A (ja) 2005-12-05 2007-06-21 Sony Corp ボンディング方法及びボンディング装置
JP2014022633A (ja) 2012-07-20 2014-02-03 Fuji Mach Mfg Co Ltd 部品実装機
WO2014098174A1 (ja) 2012-12-21 2014-06-26 株式会社新川 フリップチップボンダ及びボンディングステージの平坦度並びに変形量補正方法
WO2016024364A1 (ja) 2014-08-13 2016-02-18 株式会社新川 実装装置および測定方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2539071B2 (ja) * 1990-03-15 1996-10-02 富士通株式会社 位置合わせ装置
JP3323395B2 (ja) 1995-03-24 2002-09-09 松下電器産業株式会社 フラットパネルディスプレイへのｉｃ部品の接合方法
US6737663B2 (en) * 2002-05-22 2004-05-18 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for detecting tilt angle of a wafer platform
JP2005142537A (ja) * 2003-10-15 2005-06-02 Bondotekku:Kk 縦振接合方法及び装置
TWI309444B (en) * 2006-05-23 2009-05-01 Advanced Semiconductor Eng Die pick-up apparatus
JP5004891B2 (ja) * 2008-07-25 2012-08-22 ボンドテック株式会社 傾斜調整機構およびこの傾斜調整機構の制御方法
CN103021898B (zh) * 2012-12-17 2016-03-02 华中科技大学 测量芯片与基板相对倾角测量方法及系统
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
CN112805816B (zh) * 2018-10-15 2024-11-22 株式会社高迎科技 用于检查的装置、方法及记录用于检查的命令的记录介质
KR102870850B1 (ko) * 2020-09-25 2025-10-13 삼성전자주식회사 본딩 헤드를 포함하는 반도체 제조 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308597A (ja) 2000-04-25 2001-11-02 Toray Eng Co Ltd チップ実装装置およびチップ実装装置における平行度調整方法
JP2007157970A (ja) 2005-12-05 2007-06-21 Sony Corp ボンディング方法及びボンディング装置
JP2014022633A (ja) 2012-07-20 2014-02-03 Fuji Mach Mfg Co Ltd 部品実装機
WO2014098174A1 (ja) 2012-12-21 2014-06-26 株式会社新川 フリップチップボンダ及びボンディングステージの平坦度並びに変形量補正方法
WO2016024364A1 (ja) 2014-08-13 2016-02-18 株式会社新川 実装装置および測定方法

Also Published As

Publication number Publication date
TW202240733A (zh) 2022-10-16
US20230154775A1 (en) 2023-05-18
US12568792B2 (en) 2026-03-03
CN114981938B (zh) 2025-11-07
CN114981938A (zh) 2022-08-30
WO2022130472A1 (ja) 2022-06-23
JPWO2022130472A1 (https=) 2022-06-23
KR102695597B1 (ko) 2024-08-19
KR20220088636A (ko) 2022-06-28
TWI810742B (zh) 2023-08-01

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