JP7186617B2 - ポリイミド系高分子ワニスの製造方法、ポリイミド系高分子フィルムの製造方法、及び、透明ポリイミド系高分子フィルム - Google Patents

ポリイミド系高分子ワニスの製造方法、ポリイミド系高分子フィルムの製造方法、及び、透明ポリイミド系高分子フィルム Download PDF

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JP7186617B2
JP7186617B2 JP2018542658A JP2018542658A JP7186617B2 JP 7186617 B2 JP7186617 B2 JP 7186617B2 JP 2018542658 A JP2018542658 A JP 2018542658A JP 2018542658 A JP2018542658 A JP 2018542658A JP 7186617 B2 JP7186617 B2 JP 7186617B2
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polyimide
polymer
film
solvent
varnish
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JPWO2018062296A1 (ja
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宗銘 李
奇明 呂
宇睿 ▲ゴン▼
莉▲ティン▼ ▲フゥァン▼
勝紀 望月
淳一 池内
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Industrial Technology Research Institute ITRI
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2018542658A 2016-09-30 2017-09-27 ポリイミド系高分子ワニスの製造方法、ポリイミド系高分子フィルムの製造方法、及び、透明ポリイミド系高分子フィルム Active JP7186617B2 (ja)

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JP2016194170 2016-09-30
JP2016194170 2016-09-30
PCT/JP2017/035007 WO2018062296A1 (ja) 2016-09-30 2017-09-27 ポリイミド系高分子ワニスの製造方法、ポリイミド系高分子フィルムの製造方法、及び、透明ポリイミド系高分子フィルム

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JP7186617B2 true JP7186617B2 (ja) 2022-12-09

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JP (1) JP7186617B2 (ko)
KR (1) KR102494637B1 (ko)
TW (1) TWI821162B (ko)
WO (1) WO2018062296A1 (ko)

Families Citing this family (8)

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JP6430675B1 (ja) * 2017-06-05 2018-11-28 住友化学株式会社 フィルム、フィルムの光学的均質性の評価方法及びフィルムの製造方法
JPWO2019189483A1 (ja) * 2018-03-28 2021-05-13 住友化学株式会社 透明ポリイミド系高分子と溶媒とを含むワニス
JP2019214657A (ja) * 2018-06-12 2019-12-19 旭化成株式会社 透明ポリイミドワニス及びフィルム
WO2020067558A1 (ja) * 2018-09-29 2020-04-02 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体及びそれから生じるポリイミド並びにフレキシブルデバイス
JP6595080B1 (ja) * 2018-12-19 2019-10-23 住友化学株式会社 光学フィルム、フレキシブル表示装置、及び樹脂組成物
JP2020111713A (ja) * 2019-01-16 2020-07-27 旭化成株式会社 ポリイミドワニス及びポリイミドフィルム、並びにこれらの製造方法
JP7277208B2 (ja) * 2019-03-28 2023-05-18 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルムの製造方法及び金属張積層板の製造方法
WO2023276093A1 (ja) * 2021-06-30 2023-01-05 昭和電工マテリアルズ株式会社 樹脂組成物、半導体装置の製造方法

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JP2002088242A (ja) 2000-09-13 2002-03-27 Kanegafuchi Chem Ind Co Ltd ポリイミド樹脂組成物及びポリイミドフィルム状成形体
JP2003246870A (ja) 2001-12-17 2003-09-05 Toray Ind Inc 二軸配向ポリエステルフィルム
JP2005325332A (ja) 2004-01-09 2005-11-24 E I Du Pont De Nemours & Co 水分収着耐性を有するポリイミド組成物およびそれに関連する方法
JP2006232911A5 (ko) 2005-02-23 2008-03-06
JP2009270023A (ja) 2008-05-08 2009-11-19 Kaneka Corp ポリイミド前駆体の製造方法およびその製造方法を用いて得られるポリイミド
WO2012081644A1 (ja) 2010-12-15 2012-06-21 宇部興産株式会社 ポリイミドシームレスベルト、その製造方法、ポリイミド前駆体溶液組成物
JP2014114429A (ja) 2012-01-12 2014-06-26 New Japan Chem Co Ltd 溶剤可溶性ポリイミド樹脂
JP2015017232A (ja) 2013-07-12 2015-01-29 株式会社日本触媒 コーティング用含フッ素ポリイミド樹脂組成物、それから得られるフィルム及びコーティング膜
JP2016054734A (ja) 2014-09-05 2016-04-21 株式会社日本触媒 含フッ素ポリイミドを含む酸素ガス透過性の細胞培養用基材、該基材を備えた細胞培養用容器、及び、該基材を用いた細胞培養方法

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WO2014098042A1 (ja) * 2012-12-17 2014-06-26 三菱化学株式会社 熱可塑性ポリイミド
JP6313749B2 (ja) * 2013-04-04 2018-04-18 三井化学株式会社 ポリアミド酸、及びこれを含むワニス、並びにポリイミドフィルム
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Publication number Priority date Publication date Assignee Title
JP2002088242A (ja) 2000-09-13 2002-03-27 Kanegafuchi Chem Ind Co Ltd ポリイミド樹脂組成物及びポリイミドフィルム状成形体
JP2003246870A (ja) 2001-12-17 2003-09-05 Toray Ind Inc 二軸配向ポリエステルフィルム
JP2005325332A (ja) 2004-01-09 2005-11-24 E I Du Pont De Nemours & Co 水分収着耐性を有するポリイミド組成物およびそれに関連する方法
JP2006232911A5 (ko) 2005-02-23 2008-03-06
JP2009270023A (ja) 2008-05-08 2009-11-19 Kaneka Corp ポリイミド前駆体の製造方法およびその製造方法を用いて得られるポリイミド
WO2012081644A1 (ja) 2010-12-15 2012-06-21 宇部興産株式会社 ポリイミドシームレスベルト、その製造方法、ポリイミド前駆体溶液組成物
JP2014114429A (ja) 2012-01-12 2014-06-26 New Japan Chem Co Ltd 溶剤可溶性ポリイミド樹脂
JP2015017232A (ja) 2013-07-12 2015-01-29 株式会社日本触媒 コーティング用含フッ素ポリイミド樹脂組成物、それから得られるフィルム及びコーティング膜
JP2016054734A (ja) 2014-09-05 2016-04-21 株式会社日本触媒 含フッ素ポリイミドを含む酸素ガス透過性の細胞培養用基材、該基材を備えた細胞培養用容器、及び、該基材を用いた細胞培養方法

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KR20190060811A (ko) 2019-06-03
JPWO2018062296A1 (ja) 2019-07-18
WO2018062296A1 (ja) 2018-04-05
TW201817834A (zh) 2018-05-16
KR102494637B1 (ko) 2023-02-02
TWI821162B (zh) 2023-11-11

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