JP7121763B2 - 樹脂モールド装置及び樹脂モールド方法 - Google Patents

樹脂モールド装置及び樹脂モールド方法 Download PDF

Info

Publication number
JP7121763B2
JP7121763B2 JP2020023703A JP2020023703A JP7121763B2 JP 7121763 B2 JP7121763 B2 JP 7121763B2 JP 2020023703 A JP2020023703 A JP 2020023703A JP 2020023703 A JP2020023703 A JP 2020023703A JP 7121763 B2 JP7121763 B2 JP 7121763B2
Authority
JP
Japan
Prior art keywords
resin
loader
mold
molding
molding die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020023703A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021126852A (ja
Inventor
高志 斉藤
好美 大橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apic Yamada Corp
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Priority to JP2020023703A priority Critical patent/JP7121763B2/ja
Priority to KR1020200170954A priority patent/KR102408581B1/ko
Priority to CN202110006955.8A priority patent/CN113334667B/zh
Priority to TW110101112A priority patent/TWI786515B/zh
Publication of JP2021126852A publication Critical patent/JP2021126852A/ja
Application granted granted Critical
Publication of JP7121763B2 publication Critical patent/JP7121763B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/10—Thermosetting resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2020023703A 2020-02-14 2020-02-14 樹脂モールド装置及び樹脂モールド方法 Active JP7121763B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020023703A JP7121763B2 (ja) 2020-02-14 2020-02-14 樹脂モールド装置及び樹脂モールド方法
KR1020200170954A KR102408581B1 (ko) 2020-02-14 2020-12-09 수지 몰딩 장치 및 수지 몰딩 방법
CN202110006955.8A CN113334667B (zh) 2020-02-14 2021-01-05 树脂模制装置及树脂模制方法
TW110101112A TWI786515B (zh) 2020-02-14 2021-01-12 樹脂模製裝置及樹脂模製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020023703A JP7121763B2 (ja) 2020-02-14 2020-02-14 樹脂モールド装置及び樹脂モールド方法

Publications (2)

Publication Number Publication Date
JP2021126852A JP2021126852A (ja) 2021-09-02
JP7121763B2 true JP7121763B2 (ja) 2022-08-18

Family

ID=77467595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020023703A Active JP7121763B2 (ja) 2020-02-14 2020-02-14 樹脂モールド装置及び樹脂モールド方法

Country Status (4)

Country Link
JP (1) JP7121763B2 (zh)
KR (1) KR102408581B1 (zh)
CN (1) CN113334667B (zh)
TW (1) TWI786515B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023105331A (ja) * 2022-01-19 2023-07-31 アピックヤマダ株式会社 樹脂封止装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005305954A (ja) 2004-04-26 2005-11-04 Towa Corp 光素子の樹脂封止成形方法
JP2013251422A (ja) 2012-06-01 2013-12-12 Apic Yamada Corp Ｌｅｄチップ実装用基板、ｌｅｄパッケージ、金型、並びに、ｌｅｄチップ実装用基板及びｌｅｄパッケージの製造方法
JP2016072576A (ja) 2014-10-02 2016-05-09 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法
JP2018174200A (ja) 2017-03-31 2018-11-08 第一精工株式会社 半導体パッケージの樹脂封止装置、及び半導体パッケージの樹脂封止方法
JP2018202740A (ja) 2017-06-02 2018-12-27 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置
JP2019093593A (ja) 2017-11-21 2019-06-20 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置及び樹脂成形品の製造方法
JP2019145548A (ja) 2018-02-16 2019-08-29 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3970823A (en) * 1974-12-05 1976-07-20 Beta Corporation Of St. Louis Electric heater
JPH09155911A (ja) 1995-12-05 1997-06-17 Apic Yamada Kk 樹脂モールド装置の等圧ユニット交換構造
JP4031881B2 (ja) * 1998-12-08 2008-01-09 アピックヤマダ株式会社 樹脂封止装置
JP4253490B2 (ja) * 2002-10-16 2009-04-15 第一精工株式会社 半導体装置封止装置
JP4153769B2 (ja) * 2002-10-16 2008-09-24 第一精工株式会社 樹脂封止装置
JP4262468B2 (ja) 2002-10-30 2009-05-13 アピックヤマダ株式会社 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具
JP2012020446A (ja) * 2010-07-13 2012-02-02 Apic Yamada Corp 樹脂モールド装置
JP5551018B2 (ja) * 2010-08-24 2014-07-16 住友重機械工業株式会社 封止装置及び封止方法
JP5693931B2 (ja) * 2010-11-25 2015-04-01 アピックヤマダ株式会社 樹脂モールド装置
JP5824765B2 (ja) * 2011-01-11 2015-12-02 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置並びに供給ハンドラ
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
JP2013184413A (ja) * 2012-03-08 2013-09-19 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP2014117888A (ja) * 2012-12-17 2014-06-30 Sumitomo Heavy Ind Ltd 樹脂封止装置
JP5985402B2 (ja) * 2013-01-08 2016-09-06 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
SG11201508166RA (en) * 2013-05-29 2015-12-30 Apic Yamada Corp Resin molding apparatus and resin molding method
JP2016215532A (ja) * 2015-05-22 2016-12-22 ニッコー・マテリアルズ株式会社 積層装置および積層方法
JP6612172B2 (ja) * 2016-04-25 2019-11-27 Ｔｏｗａ株式会社 樹脂成形装置、樹脂成形方法、樹脂成形品の製造方法及び製品の製造方法
JP2017212419A (ja) * 2016-05-27 2017-11-30 Ｔｏｗａ株式会社 樹脂封止品製造方法及び樹脂封止装置
JP6371816B2 (ja) * 2016-11-02 2018-08-08 東芝メモリ株式会社 半導体装置の製造方法、半導体製造装置
JP6804410B2 (ja) * 2017-08-09 2020-12-23 Ｔｏｗａ株式会社 搬送機構、樹脂成形装置、成形対象物の成形型への受け渡し方法、及び樹脂成形品の製造方法
TWI787411B (zh) * 2018-02-16 2022-12-21 日商山田尖端科技股份有限公司 樹脂模製裝置
JP6936177B2 (ja) * 2018-03-23 2021-09-15 アピックヤマダ株式会社 樹脂モールド装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005305954A (ja) 2004-04-26 2005-11-04 Towa Corp 光素子の樹脂封止成形方法
JP2013251422A (ja) 2012-06-01 2013-12-12 Apic Yamada Corp Ｌｅｄチップ実装用基板、ｌｅｄパッケージ、金型、並びに、ｌｅｄチップ実装用基板及びｌｅｄパッケージの製造方法
JP2016072576A (ja) 2014-10-02 2016-05-09 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法
JP2018174200A (ja) 2017-03-31 2018-11-08 第一精工株式会社 半導体パッケージの樹脂封止装置、及び半導体パッケージの樹脂封止方法
JP2018202740A (ja) 2017-06-02 2018-12-27 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置
JP2019093593A (ja) 2017-11-21 2019-06-20 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置及び樹脂成形品の製造方法
JP2019145548A (ja) 2018-02-16 2019-08-29 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法

Also Published As

Publication number Publication date
JP2021126852A (ja) 2021-09-02
TWI786515B (zh) 2022-12-11
KR20210103925A (ko) 2021-08-24
KR102408581B1 (ko) 2022-06-14
CN113334667A (zh) 2021-09-03
TW202130485A (zh) 2021-08-16
CN113334667B (zh) 2023-03-07

Similar Documents

Publication Publication Date Title
WO2023013150A1 (ja) 圧縮成形装置及び圧縮成形方法
TWI787411B (zh) 樹脂模製裝置
TWI750369B (zh) 樹脂模製模具及樹脂模製裝置
US20080020510A1 (en) Fabrication method of semiconductor device
TW202221802A (zh) 樹脂密封裝置及樹脂密封方法
JP7562146B2 (ja) 樹脂封止装置及び樹脂封止方法
JP7121763B2 (ja) 樹脂モールド装置及び樹脂モールド方法
JP7312452B2 (ja) 樹脂モールド装置及び樹脂モールド方法
JP4327985B2 (ja) 樹脂封止装置
WO2024047916A1 (ja) 樹脂封止装置及び樹脂封止方法
JP2004140047A (ja) 樹脂封止装置
WO2023105841A1 (ja) 樹脂封止装置及び封止金型
WO2024161680A1 (ja) 圧縮成形装置及び圧縮成形方法
WO2023139825A1 (ja) 樹脂封止装置
JP7562145B2 (ja) 圧縮成形装置
TWI853274B (zh) 壓縮成形裝置
WO2023144856A1 (ja) 樹脂封止装置、封止金型、及び樹脂封止方法
JP7468906B2 (ja) 樹脂封止装置
WO2024161681A1 (ja) 圧縮成形に用いられる封止樹脂及びその形成方法
JP2019145549A (ja) 樹脂モールド装置
WO2023105840A1 (ja) 樹脂封止装置及び封止金型
WO2022269968A1 (ja) 圧縮成形装置及び圧縮成形方法
WO2023149016A1 (ja) 樹脂封止装置及び樹脂封止方法
JP2023123172A (ja) 樹脂封止装置及び樹脂封止方法
JP2024139406A (ja) 圧縮成形装置及び圧縮成形方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210810

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220520

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220524

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220714

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220802

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220805

R150 Certificate of patent or registration of utility model

Ref document number: 7121763

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150