JP7121763B2 - 樹脂モールド装置及び樹脂モールド方法 - Google Patents

樹脂モールド装置及び樹脂モールド方法 Download PDF

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Publication number
JP7121763B2
JP7121763B2 JP2020023703A JP2020023703A JP7121763B2 JP 7121763 B2 JP7121763 B2 JP 7121763B2 JP 2020023703 A JP2020023703 A JP 2020023703A JP 2020023703 A JP2020023703 A JP 2020023703A JP 7121763 B2 JP7121763 B2 JP 7121763B2
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Japan
Prior art keywords
resin
loader
mold
molding
molding die
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Application number
JP2020023703A
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English (en)
Japanese (ja)
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JP2021126852A (ja
Inventor
高志 斉藤
好美 大橋
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Apic Yamada Corp
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Apic Yamada Corp
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Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Priority to JP2020023703A priority Critical patent/JP7121763B2/ja
Priority to KR1020200170954A priority patent/KR102408581B1/ko
Priority to CN202110006955.8A priority patent/CN113334667B/zh
Priority to TW110101112A priority patent/TWI786515B/zh
Publication of JP2021126852A publication Critical patent/JP2021126852A/ja
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Publication of JP7121763B2 publication Critical patent/JP7121763B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/10—Thermosetting resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2020023703A 2020-02-14 2020-02-14 樹脂モールド装置及び樹脂モールド方法 Active JP7121763B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020023703A JP7121763B2 (ja) 2020-02-14 2020-02-14 樹脂モールド装置及び樹脂モールド方法
KR1020200170954A KR102408581B1 (ko) 2020-02-14 2020-12-09 수지 몰딩 장치 및 수지 몰딩 방법
CN202110006955.8A CN113334667B (zh) 2020-02-14 2021-01-05 树脂模制装置及树脂模制方法
TW110101112A TWI786515B (zh) 2020-02-14 2021-01-12 樹脂模製裝置及樹脂模製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020023703A JP7121763B2 (ja) 2020-02-14 2020-02-14 樹脂モールド装置及び樹脂モールド方法

Publications (2)

Publication Number Publication Date
JP2021126852A JP2021126852A (ja) 2021-09-02
JP7121763B2 true JP7121763B2 (ja) 2022-08-18

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JP2020023703A Active JP7121763B2 (ja) 2020-02-14 2020-02-14 樹脂モールド装置及び樹脂モールド方法

Country Status (4)

Country Link
JP (1) JP7121763B2 (ko)
KR (1) KR102408581B1 (ko)
CN (1) CN113334667B (ko)
TW (1) TWI786515B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023105331A (ja) * 2022-01-19 2023-07-31 アピックヤマダ株式会社 樹脂封止装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005305954A (ja) 2004-04-26 2005-11-04 Towa Corp 光素子の樹脂封止成形方法
JP2013251422A (ja) 2012-06-01 2013-12-12 Apic Yamada Corp Ｌｅｄチップ実装用基板、ｌｅｄパッケージ、金型、並びに、ｌｅｄチップ実装用基板及びｌｅｄパッケージの製造方法
JP2016072576A (ja) 2014-10-02 2016-05-09 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法
JP2018174200A (ja) 2017-03-31 2018-11-08 第一精工株式会社 半導体パッケージの樹脂封止装置、及び半導体パッケージの樹脂封止方法
JP2018202740A (ja) 2017-06-02 2018-12-27 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置
JP2019093593A (ja) 2017-11-21 2019-06-20 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置及び樹脂成形品の製造方法
JP2019145548A (ja) 2018-02-16 2019-08-29 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法

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US3970823A (en) * 1974-12-05 1976-07-20 Beta Corporation Of St. Louis Electric heater
JPH09155911A (ja) 1995-12-05 1997-06-17 Apic Yamada Kk 樹脂モールド装置の等圧ユニット交換構造
JP4031881B2 (ja) * 1998-12-08 2008-01-09 アピックヤマダ株式会社 樹脂封止装置
JP4153769B2 (ja) * 2002-10-16 2008-09-24 第一精工株式会社 樹脂封止装置
JP4253490B2 (ja) * 2002-10-16 2009-04-15 第一精工株式会社 半導体装置封止装置
JP4262468B2 (ja) 2002-10-30 2009-05-13 アピックヤマダ株式会社 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具
JP2012020446A (ja) * 2010-07-13 2012-02-02 Apic Yamada Corp 樹脂モールド装置
JP5551018B2 (ja) * 2010-08-24 2014-07-16 住友重機械工業株式会社 封止装置及び封止方法
JP5693931B2 (ja) * 2010-11-25 2015-04-01 アピックヤマダ株式会社 樹脂モールド装置
JP5824765B2 (ja) * 2011-01-11 2015-12-02 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置並びに供給ハンドラ
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
JP2013184413A (ja) * 2012-03-08 2013-09-19 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP2014117888A (ja) * 2012-12-17 2014-06-30 Sumitomo Heavy Ind Ltd 樹脂封止装置
JP5985402B2 (ja) * 2013-01-08 2016-09-06 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
CN105283294B (zh) * 2013-05-29 2017-08-25 山田尖端科技株式会社 树脂模制装置和树脂模制方法
JP2016215532A (ja) * 2015-05-22 2016-12-22 ニッコー・マテリアルズ株式会社 積層装置および積層方法
JP6612172B2 (ja) * 2016-04-25 2019-11-27 Ｔｏｗａ株式会社 樹脂成形装置、樹脂成形方法、樹脂成形品の製造方法及び製品の製造方法
JP2017212419A (ja) * 2016-05-27 2017-11-30 Ｔｏｗａ株式会社 樹脂封止品製造方法及び樹脂封止装置
JP6371816B2 (ja) * 2016-11-02 2018-08-08 東芝メモリ株式会社 半導体装置の製造方法、半導体製造装置
JP6804410B2 (ja) * 2017-08-09 2020-12-23 Ｔｏｗａ株式会社 搬送機構、樹脂成形装置、成形対象物の成形型への受け渡し方法、及び樹脂成形品の製造方法
TWI787411B (zh) * 2018-02-16 2022-12-21 日商山田尖端科技股份有限公司 樹脂模製裝置
JP6936177B2 (ja) * 2018-03-23 2021-09-15 アピックヤマダ株式会社 樹脂モールド装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005305954A (ja) 2004-04-26 2005-11-04 Towa Corp 光素子の樹脂封止成形方法
JP2013251422A (ja) 2012-06-01 2013-12-12 Apic Yamada Corp Ｌｅｄチップ実装用基板、ｌｅｄパッケージ、金型、並びに、ｌｅｄチップ実装用基板及びｌｅｄパッケージの製造方法
JP2016072576A (ja) 2014-10-02 2016-05-09 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法
JP2018174200A (ja) 2017-03-31 2018-11-08 第一精工株式会社 半導体パッケージの樹脂封止装置、及び半導体パッケージの樹脂封止方法
JP2018202740A (ja) 2017-06-02 2018-12-27 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置
JP2019093593A (ja) 2017-11-21 2019-06-20 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置及び樹脂成形品の製造方法
JP2019145548A (ja) 2018-02-16 2019-08-29 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法

Also Published As

Publication number Publication date
TW202130485A (zh) 2021-08-16
KR20210103925A (ko) 2021-08-24
CN113334667A (zh) 2021-09-03
KR102408581B1 (ko) 2022-06-14
TWI786515B (zh) 2022-12-11
CN113334667B (zh) 2023-03-07
JP2021126852A (ja) 2021-09-02

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