JP7089381B2 - 基板検査装置、基板処理装置および基板検査方法 - Google Patents

基板検査装置、基板処理装置および基板検査方法 Download PDF

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JP7089381B2
JP7089381B2 JP2018040877A JP2018040877A JP7089381B2 JP 7089381 B2 JP7089381 B2 JP 7089381B2 JP 2018040877 A JP2018040877 A JP 2018040877A JP 2018040877 A JP2018040877 A JP 2018040877A JP 7089381 B2 JP7089381 B2 JP 7089381B2
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JP2019158363A (ja
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友宏 松尾
幸治 中川
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Priority to JP2018040877A priority Critical patent/JP7089381B2/ja
Priority to TW108100622A priority patent/TWI692740B/zh
Priority to KR1020190017192A priority patent/KR102118824B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2018040877A 2018-03-07 2018-03-07 基板検査装置、基板処理装置および基板検査方法 Active JP7089381B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018040877A JP7089381B2 (ja) 2018-03-07 2018-03-07 基板検査装置、基板処理装置および基板検査方法
TW108100622A TWI692740B (zh) 2018-03-07 2019-01-08 基板檢查裝置、基板處理裝置及基板檢查方法
KR1020190017192A KR102118824B1 (ko) 2018-03-07 2019-02-14 기판 검사 장치, 기판 처리 장치 및 기판 검사 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018040877A JP7089381B2 (ja) 2018-03-07 2018-03-07 基板検査装置、基板処理装置および基板検査方法

Publications (2)

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JP2019158363A JP2019158363A (ja) 2019-09-19
JP7089381B2 true JP7089381B2 (ja) 2022-06-22

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JP2018040877A Active JP7089381B2 (ja) 2018-03-07 2018-03-07 基板検査装置、基板処理装置および基板検査方法

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JP (1) JP7089381B2 (ko)
KR (1) KR102118824B1 (ko)
TW (1) TWI692740B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022069967A (ja) * 2020-10-26 2022-05-12 住友重機械工業株式会社 歪曲収差補正処理装置、歪曲収差補正方法、及びプログラム
WO2023095635A1 (ja) * 2021-11-25 2023-06-01 住友重機械工業株式会社 歪曲収差率算出方法及び位置検出装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000100362A (ja) 1998-09-18 2000-04-07 Hitachi Ltd 荷電粒子ビーム走査式自動検査装置
JP2001336926A (ja) 2000-05-25 2001-12-07 Mitsubishi Chemicals Corp 円盤中心の偏差検出方法
JP2002181732A (ja) 2000-12-13 2002-06-26 Saki Corp:Kk 外観検査装置および外観検査方法
US20020186368A1 (en) 2001-06-08 2002-12-12 Eliezer Rosengaus Systems and methods for inspection of specimen surfaces
JP2007147351A (ja) 2005-11-25 2007-06-14 Fuji Xerox Co Ltd 平面度測定装置及び平面度測定方法
JP2009128261A (ja) 2007-11-27 2009-06-11 Takashima Giken Kk 外観検査方法および装置
JP2013148441A (ja) 2012-01-19 2013-08-01 Dainippon Screen Mfg Co Ltd 画像処理方法
JP2016121914A (ja) 2014-12-24 2016-07-07 東京エレクトロン株式会社 温度測定機構、熱処理装置
JP2016156822A (ja) 2015-02-25 2016-09-01 株式会社昭和電気研究所 ウェハ欠陥検査装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63274142A (ja) * 1987-05-06 1988-11-11 Canon Inc 位置合せ装置
JPH10311705A (ja) * 1997-05-12 1998-11-24 Nikon Corp 画像入力装置
JP3385994B2 (ja) * 1998-02-27 2003-03-10 株式会社ニコン 像検出装置
DE19839999C1 (de) * 1998-09-02 2000-05-04 Siemens Ag Verfahren und Vorrichtung zum Kalibrieren eines Verfahrwegs und/oder einer Winkellage einer Haltevorrichtung in einer Einrichtung zur Herstellung von elektrischen Baugruppen sowie Kalibriersubstrat
JP2001283196A (ja) * 2000-03-30 2001-10-12 Nikon Corp 欠陥検査装置および欠陥検査方法
JP2015059875A (ja) * 2013-09-20 2015-03-30 日置電機株式会社 検査結果表示データ生成装置、検査結果表示装置、基板検査システムおよび検査結果表示データ生成方法
JP6423678B2 (ja) * 2014-10-07 2018-11-14 東京エレクトロン株式会社 基板検査装置及びその制御方法
CN107076790B (zh) * 2014-10-29 2019-12-13 日本电产理德股份有限公司 基板检查装置及基板检查方法
JP6450700B2 (ja) * 2016-03-29 2019-01-09 Ckd株式会社 基板検査装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000100362A (ja) 1998-09-18 2000-04-07 Hitachi Ltd 荷電粒子ビーム走査式自動検査装置
JP2001336926A (ja) 2000-05-25 2001-12-07 Mitsubishi Chemicals Corp 円盤中心の偏差検出方法
JP2002181732A (ja) 2000-12-13 2002-06-26 Saki Corp:Kk 外観検査装置および外観検査方法
US20020186368A1 (en) 2001-06-08 2002-12-12 Eliezer Rosengaus Systems and methods for inspection of specimen surfaces
JP2007147351A (ja) 2005-11-25 2007-06-14 Fuji Xerox Co Ltd 平面度測定装置及び平面度測定方法
JP2009128261A (ja) 2007-11-27 2009-06-11 Takashima Giken Kk 外観検査方法および装置
JP2013148441A (ja) 2012-01-19 2013-08-01 Dainippon Screen Mfg Co Ltd 画像処理方法
JP2016121914A (ja) 2014-12-24 2016-07-07 東京エレクトロン株式会社 温度測定機構、熱処理装置
JP2016156822A (ja) 2015-02-25 2016-09-01 株式会社昭和電気研究所 ウェハ欠陥検査装置

Also Published As

Publication number Publication date
KR20190106681A (ko) 2019-09-18
JP2019158363A (ja) 2019-09-19
TW201939442A (zh) 2019-10-01
KR102118824B1 (ko) 2020-06-03
TWI692740B (zh) 2020-05-01

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