JP7089381B2 - Board inspection equipment, board processing equipment and board inspection method - Google Patents

Description

The present invention relates to a substrate inspection apparatus for inspecting a substrate, a substrate processing apparatus including the substrate inspection apparatus, and a substrate inspection method for inspecting the substrate.

Inspecting the substrate is performed in various processing steps on the substrate. In the inspection apparatus described in Patent Document 1, the substrate on which the resist film is formed is sequentially exposed and developed, and then the appearance of the substrate is inspected. Specifically, the surface image data is acquired by taking an image of the surface of the substrate to be inspected (hereinafter referred to as an inspection substrate) by the imaging unit. On the other hand, a sample substrate having no defects in appearance is prepared in advance, and surface image data of the sample substrate is acquired. Defects in the inspection board are detected based on the comparison between the gradation value of each pixel of the surface image data of the sample board and the gradation value of each pixel of the surface image data of the inspection board.

Japanese Unexamined Patent Publication No. 2016-219746

In the inspection device of Patent Document 1, the image pickup unit includes one or a plurality of condenser lenses. In this case, the acquired surface image data includes distortion due to lens aberration. Therefore, there may be a discrepancy in the correspondence between each pixel of the surface image data of the sample substrate and each pixel of the surface image data of the inspection board, and it may not be possible to properly detect the defect of the inspection board.

An object of the present invention is a substrate inspection device and a substrate capable of easily generating corrected image data in which distortion due to lens aberration is removed and appropriately inspecting a substrate using the corrected image data. It is to provide a processing apparatus and a substrate inspection method.

(1) The substrate inspection apparatus according to the first invention includes an image data acquisition unit that acquires real image data representing an actual image of one surface of the substrate by imaging a substrate having at least a part having a circular edge , and an actual image data acquisition unit. The board is inspected based on the corrected image data generation unit that generates the corrected image data that represents the original image of one side of the board as the corrected image based on the image data, and the corrected image data generated by the corrected image data generation unit. The corrected image data generation unit includes a first position information acquisition unit that acquires the positions of a plurality of outer peripheral points on the edge of the substrate represented in the actual image as the first outer peripheral position information. A second position information acquisition unit that acquires the original positions of a plurality of outer peripheral points to be represented in the corrected image as second outer peripheral position information, and a first outer periphery acquired by the first position information acquisition unit. Based on the position information and the second outer peripheral position information acquired by the second position information acquisition unit, each pixel of the actual image data representing each part of the board and each pixel of the corrected image data representing each part of the board. A positional relationship specifying unit that specifies the positional relationship of the data, and a pixel value setting unit that sets the value of each pixel of the corrected image data based on the value of each pixel of the actual image data and the relationship specified by the positional relationship specifying unit. including.

In this board inspection device, real image data representing a real image of a board is acquired by taking an image of the board. The actual image data may include distortion due to aberration of the lens used for imaging the substrate (hereinafter, referred to as aberration distortion). Therefore, based on the actual image data, the corrected image data representing the original image of the substrate as the corrected image is generated.

In this case, the positions of the plurality of outer peripheral points represented in the actual image are acquired as the first outer peripheral position information, and the original positions of the plurality of outer peripheral points to be represented in the corrected image are used as the second outer peripheral position information. To be acquired. When aberration distortion is included in the actual image data, a difference occurs between the first and second outer peripheral position information. Therefore, the positional relationship between each pixel of the actual image data and each pixel of the corrected image data is specified based on the first and second outer peripheral position information, and the value of each pixel of the corrected image data is specified based on the positional relationship. Is set. This makes it possible to easily generate corrected image data from which aberration distortion is removed. By using the corrected image data generated in this way, the substrate can be appropriately inspected. Further, since the corrected image data can be generated based on the actual image data obtained by imaging the substrate to be inspected, it is not necessary to separately prepare a special substrate or the like for correction, and the correction is performed. It is not necessary to set the parameters of the above in advance. Therefore, the time and cost required to generate the corrected image data are reduced.

(2) The substrate inspection apparatus according to the second invention includes an image data acquisition unit that acquires real image data representing an actual image of one surface of the substrate by imaging a substrate having at least a circular outer peripheral portion. Inspection of the board based on the corrected image data generation unit that generates the corrected image data that represents the original image of one side of the board as the corrected image based on the actual image data, and the corrected image data generated by the corrected image data generation unit. The corrected image data generation unit includes a first position information acquisition unit that acquires the positions of a plurality of outer peripheral points on the outer peripheral portion of the substrate represented in the actual image as the first outer peripheral position information. The second position information acquisition unit that acquires the original positions of the plurality of outer peripheral points to be represented in the corrected image as the second outer peripheral position information, and the first position information acquisition unit acquired by the first position information acquisition unit. Each pixel of the actual image data representing each part of the board and each of the corrected image data representing each part of the board based on the outer peripheral position information of the Pixel value setting that sets the value of each pixel of the corrected image data based on the relationship specified by the positional relationship specifying unit that specifies the positional relationship with the pixels, the value of each pixel of the actual image data, and the positional relationship specifying unit. The positional relationship specifying unit , including the unit, specifies the positional relationship by regression analysis using the first outer peripheral position information and the second outer peripheral position information. In this case, the positional relationship between each pixel of the actual image data and each pixel of the corrected image data can be easily specified.

(3) The first outer peripheral position information includes a plurality of first outer peripheral coordinates representing the positions of the plurality of outer peripheral points in the actual image, and the second outer peripheral position information includes the positions of the plurality of outer peripheral points in the corrected image. The positional relationship specifying part is corrected with the coordinates of each pixel of the actual image data by regression analysis using the plurality of first outer peripheral coordinates and the plurality of second outer peripheral coordinates. A relational expression expressing the relation with the coordinates of each pixel of the image data may be specified as a positional relation. In this case, the pixel of the real image data corresponding to the pixel of the corrected image data can be easily specified by using the specified relational expression, and the pixel of the corrected image data is based on the value of the pixel of the real image data. You can set the value.

(4) The second position information acquisition unit acquires the coordinates of the plurality of virtual outer peripheral points corresponding to the plurality of outer peripheral points set on the unit circle in the virtual coordinate system as the plurality of third outer peripheral coordinates. A plurality of second outer peripheral coordinates may be acquired based on a plurality of first outer peripheral coordinates and a plurality of third outer peripheral coordinates.

In this case, by using the coordinates of the virtual outer peripheral points set on the unit circle, it is possible to acquire a plurality of second outer peripheral coordinates without performing complicated calculation, image analysis, or the like.

(5) The substrate inspection apparatus according to the third invention includes an image data acquisition unit that acquires real image data representing an actual image of one surface of the substrate by imaging a substrate having at least a circular outer peripheral portion. Inspection of the board based on the corrected image data generation unit that generates the corrected image data that represents the original image of one side of the board as the corrected image based on the actual image data, and the corrected image data generated by the corrected image data generation unit. The corrected image data generation unit includes a first position information acquisition unit that acquires the positions of a plurality of outer peripheral points on the outer peripheral portion of the substrate represented in the actual image as the first outer peripheral position information. The second position information acquisition unit that acquires the original positions of the plurality of outer peripheral points to be represented in the corrected image as the second outer peripheral position information, and the first position information acquisition unit acquired by the first position information acquisition unit. Each pixel of the actual image data representing each part of the board and each of the corrected image data representing each part of the board based on the outer peripheral position information of the Pixel value setting that sets the value of each pixel of the corrected image data based on the relationship specified by the positional relationship specifying unit that specifies the positional relationship with the pixels, the value of each pixel of the actual image data, and the positional relationship specifying unit. The image data acquisition unit includes a substrate holding unit, an image pickup unit that captures an image of the substrate by a line sensor extending in the first direction, and a substrate held by the substrate holding unit with respect to the image pickup unit. The first direction is the third direction in each of the real image and the corrected image, including the substrate holding part and the moving part that moves at least one of the imaging parts so as to move relatively in the second direction. Corresponding, the second direction corresponds to the fourth direction, the first outer peripheral position information represents the position of each outer peripheral point in the third direction as the first position, and each outer peripheral point in the fourth direction. The position of is represented as the second position, the second outer peripheral position information represents the position of each outer peripheral point in the third direction as the third position, and the position of each outer peripheral point in the fourth direction is the fourth. The fourth position of the plurality of outer peripheral points represented as a position and represented by the second outer peripheral position information is set to be the same as the second position of the plurality of outer peripheral points represented by the first outer peripheral position information. To .

In this case, the actual image data is acquired by continuously imaging the substrate by the imaging unit while the substrate is moved in the second direction by the moving unit. Since the image pickup unit captures the substrate by the line sensor extending in the first direction, in the actual image, aberration distortion occurs only in the third direction corresponding to the first direction, and the second direction corresponds to the second direction. Aberration distortion does not occur in the direction of 4. Therefore, the fourth position of each outer peripheral point in the corrected image is set to be the same as the second position. Thereby, the aberration distortion in the third direction can be appropriately removed based on the first position of each outer peripheral point in the actual image and the third position of each outer peripheral point in the corrected image.

(6) The second position information acquisition unit identifies and specifies the original shape of the outer peripheral portion of the substrate based on the second position of at least one outer peripheral point represented by the first outer peripheral position information. The third position of the plurality of outer peripheral points in the corrected image may be specified based on the formed shape.

In this case, since aberration distortion does not occur in the fourth direction in the actual image, the original shape of the outer peripheral portion of the substrate can be appropriately specified and specified based on the second position of each outer peripheral point. The third position of each outer peripheral point can be appropriately specified based on the formed shape.

(7) The substrate processing apparatus according to the fourth invention includes a film forming portion for forming a treated film on the substrate and the above-mentioned substrate inspection apparatus for inspecting the substrate after the processed film is formed by the film forming portion. ..

In this substrate processing apparatus, the substrate is inspected by the above-mentioned substrate inspection apparatus. Therefore, the corrected image data including the aberration distortion can be easily generated, and the substrate can be appropriately inspected based on the corrected image data. Further, since the corrected image data can be generated based on the actual image data obtained by imaging the substrate to be inspected, it is not necessary to prepare a special substrate or the like for correction, and the correction is performed. There is no need to set parameters etc. in advance. Therefore, the time and cost required to generate the corrected image data are reduced.

(8) The substrate inspection method according to the fifth invention includes a step of acquiring real image data representing an actual image of one surface of the substrate by imaging a substrate having at least a part having a circular edge , and the actual image data. A step of generating corrected image data including a step of generating corrected image data representing an original image of one surface of the substrate as a corrected image and a step of inspecting the board based on the generated corrected image data. Is a step of acquiring the positions of a plurality of outer peripheral points on the edge of the substrate represented in the actual image as the first outer peripheral position information, and the original positions of the plurality of outer peripheral points to be represented in the corrected image. Based on the step to be acquired as the outer peripheral position information of 2, and each pixel of the actual image data representing each part of the substrate and each pixel of the corrected image data representing each part of the substrate based on the first and second outer peripheral position information. It includes a step of specifying the positional relationship of the image data and a step of setting the value of each pixel of the corrected image data based on the value of each pixel of the actual image data and the specified relationship.

According to this substrate inspection method, the actual image data representing the actual image of the substrate is acquired by imaging the substrate. The positions of the plurality of outer peripheral points represented in the actual image are acquired as the first outer peripheral position information, and the original positions of the plurality of outer peripheral points to be represented in the corrected image are acquired as the second outer peripheral position information. .. When aberration distortion is included in the actual image data, a difference occurs between the first and second outer peripheral position information. Therefore, the positional relationship between each pixel of the actual image data and each pixel of the corrected image data is specified based on the first and second outer peripheral position information, and the value of each pixel of the corrected image data is specified based on the positional relationship. Is set. This makes it possible to easily generate corrected image data from which aberration distortion is removed. By using the corrected image data generated in this way, the substrate can be appropriately inspected. Further, since the corrected image data can be generated based on the actual image data obtained by imaging the substrate to be inspected, it is not necessary to separately prepare a special substrate or the like for correction, and the correction is performed. It is not necessary to set the parameters of the above in advance. Therefore, the time and cost required to generate the corrected image data are reduced.
(9) The substrate inspection method according to the sixth invention includes a step of acquiring real image data representing an actual image of one surface of the substrate by imaging a substrate having at least a circular outer peripheral portion, and actual image data. The corrected image data is generated, including a step of generating corrected image data representing an original image of one surface of the substrate as a corrected image based on the above, and a step of inspecting the board based on the generated corrected image data. The steps are a step of acquiring the positions of a plurality of outer peripheral points on the outer peripheral portion of the substrate represented in the actual image as the first outer peripheral position information, and the original positions of the plurality of outer peripheral points to be represented in the corrected image. As the second outer peripheral position information, and each pixel of the actual image data representing each part of the substrate and each of the corrected image data representing each part of the substrate based on the first and second outer peripheral position information. A step of specifying the positional relationship, including a step of specifying the positional relationship with the pixels and a step of setting the value of each pixel of the corrected image data based on the value of each pixel of the actual image data and the specified relationship. Includes specifying the positional relationship by regression analysis using the first outer peripheral position information and the second outer peripheral position information.
(10) The substrate inspection method according to the seventh invention includes a step of acquiring real image data representing an actual image of one surface of the substrate by imaging a substrate having at least a circular outer peripheral portion, and actual image data. The corrected image data is generated, including a step of generating corrected image data representing an original image of one surface of the substrate as a corrected image based on the above, and a step of inspecting the board based on the generated corrected image data. The steps are a step of acquiring the positions of a plurality of outer peripheral points on the outer peripheral portion of the substrate represented in the actual image as the first outer peripheral position information, and the original positions of the plurality of outer peripheral points to be represented in the corrected image. As the second outer peripheral position information, and each pixel of the actual image data representing each part of the substrate and each of the corrected image data representing each part of the substrate based on the first and second outer peripheral position information. Acquiring the actual image data, including a step of specifying the positional relationship with the pixels and a step of setting the value of each pixel of the corrected image data based on the value of each pixel of the actual image data and the specified relationship. The steps are to hold the substrate by the substrate holding unit, to image the substrate by the line sensor included in the imaging unit in the first direction, and to image the substrate by the substrate holding unit relative to the imaging unit. Including moving at least one of the substrate holding unit and the imaging unit by the moving unit so as to move in the second direction, the first direction is the third direction in each of the actual image and the corrected image. Corresponding, the second direction corresponds to the fourth direction, the first outer peripheral position information represents the position of each outer peripheral point in the third direction as the first position, and each outer peripheral point in the fourth direction. The position of is represented as the second position, the second outer peripheral position information represents the position of each outer peripheral point in the third direction as the third position, and the position of each outer peripheral point in the fourth direction is the fourth. The fourth position of the plurality of outer peripheral points represented as a position and represented by the second outer peripheral position information is set to be the same as the second position of the plurality of outer peripheral points represented by the first outer peripheral position information. To.

According to the present invention, it is possible to easily generate corrected image data in which distortion due to lens aberration is removed, and it is possible to appropriately inspect the substrate using the corrected image data.

It is external perspective view of the substrate inspection apparatus which concerns on this embodiment. It is a schematic side view which shows the internal structure of the substrate inspection apparatus of FIG. It is a schematic diagram for demonstrating aberration distortion. It is a figure which shows the example of the real image of the substrate represented by the acquired real image data. It is a block diagram which shows the functional structure of a board inspection apparatus. It is a flowchart which shows the correction image data generation processing. It is a figure for conceptually explaining a corrected image data generation process. It is a figure for conceptually explaining a corrected image data generation process. It is a figure for conceptually explaining a corrected image data generation process. It is a figure for conceptually explaining a corrected image data generation process. It is a flowchart of a defect determination process. It is a schematic block diagram which shows the whole structure of the substrate processing apparatus which includes the substrate inspection apparatus.

Hereinafter, the substrate inspection apparatus, the substrate processing apparatus, and the substrate inspection method according to the embodiment of the present invention will be described with reference to the drawings. In the following description, the substrate is a semiconductor substrate, a substrate for FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for an optical magnetic disk, and the like. A photomask substrate, a ceramic substrate, a solar cell substrate, or the like. Further, the substrate used as an inspection target in the present embodiment has one surface (main surface) and the other surface (back surface), and a film having a predetermined pattern is formed on the one surface. Examples of the film formed on one surface of the substrate include a resist film, an antireflection film, and a resist cover film.

[1] Configuration of the Board Inspection Device FIG. 1 is an external perspective view of the board inspection device according to the embodiment of the present invention, and FIG. 2 is a schematic side view showing the internal configuration of the board inspection device of FIG. .. As shown in FIG. 1, the substrate inspection device 200 includes a housing 210, a light projecting unit 220, a reflection unit 230, an image pickup unit 240, a substrate holding device 250, a moving unit 260, a notch detection unit 270, a control device 400, and a display unit. Includes 410.

A slit-shaped opening 216 for transporting the substrate W is formed on the side portion of the housing 210. The light projecting unit 220, the reflecting unit 230, the imaging unit 240, the substrate holding device 250, the moving unit 260, and the notch detecting unit 270 are housed in the housing 210.

The light projecting unit 220 includes, for example, one or a plurality of light sources, and emits band-shaped light diagonally downward. The light from the light projecting unit 220 has a long horizontal cross section extending in the direction D1. The reflecting unit 230 includes, for example, a mirror. The image pickup unit 240 includes an image pickup element in which a plurality of pixels are arranged in a line in the direction D1, and one or a plurality of condenser lenses. In this example, a CCD (charge-coupled device) line sensor is used as the image pickup device. A CMOS (complementary metal oxide semiconductor) line sensor may be used as the image pickup device.

As shown in FIG. 2, the substrate holding device 250 is, for example, a spin chuck and includes a driving device 251 and a rotation holding unit 252. The drive device 251 is, for example, an electric motor and has a rotating shaft 251a. The rotation holding portion 252 is attached to the tip of the rotation shaft 251a of the drive device 251 and is rotationally driven around the vertical shaft while holding the substrate W to be inspected.

The moving unit 260 includes a pair of guide members 261 (FIG. 1) and a moving holding unit 262. The pair of guide members 261 are provided so as to extend linearly in parallel with each other. The movement holding unit 262 is configured to be movable along a plurality of guide members 261 while holding the substrate holding device 250. The moving holding unit 262 moves along the direction D2 while the board holding device 250 holds the board W, so that the board W passes below the light projecting unit 220 and the reflecting unit 230. The direction D2 is orthogonal to the above direction D1 on the horizontal plane. Direction D1 is an example of the first direction and direction D2 is an example of the second direction.

The notch detection unit 270 is, for example, a reflective photoelectric sensor including a light projecting element and a light receiving element, and emits light toward the outer peripheral portion of the substrate W while the substrate W to be inspected is rotated by the substrate holding device 250. At the same time, it receives the reflected light from the substrate W. The notch detection unit 270 detects the notch of the substrate W based on the amount of received light reflected from the substrate W. A transmissive photoelectric sensor may be used as the notch detection unit 270.

The control device 400 (FIG. 1) includes, for example, a CPU and a memory, or a microcomputer, and controls a light projecting unit 220, an image pickup unit 240, a substrate holding device 250, a moving unit 260, a notch detection unit 270, and a display unit 410. The display unit 410 displays a determination result of the presence or absence of a defect in the substrate W to be inspected. Details of the control device 400 will be described later.

The image pickup operation of the substrate W in the substrate inspection apparatus 200 of FIG. 1 will be described. The substrate W to be inspected is carried into the housing 210 through the opening 216 and is held by the substrate holding device 250. Subsequently, while the substrate W is rotated by the substrate holding device 250, light is emitted to the peripheral edge portion of the substrate W by the notch detection unit 270, and the reflected light is received by the notch detection unit 270. As a result, the notch of the substrate W is detected, and the orientation of the substrate W is determined. After that, the substrate holding device 250 adjusts the rotational position of the substrate W so that the notch of the substrate W faces in a certain direction.

Next, the substrate W is moved so as to pass under the light projecting unit 220 by the moving unit 260 while the band-shaped light is emitted diagonally downward from the light projecting unit 220. The irradiation range of the light from the light projecting unit 220 in the direction D1 is larger than the diameter of the substrate W. As a result, the entire surface of the substrate W is sequentially irradiated with the light from the light projecting unit 220. The light reflected from the substrate W is further reflected by the reflecting unit 230 and guided to the image pickup unit 240. The image sensor of the image pickup unit 240 receives light reflected from one surface of the substrate W at a predetermined sampling cycle, thereby sequentially imaging a plurality of portions on one surface of the substrate W. Each pixel constituting the image sensor outputs pixel data indicating a value corresponding to the amount of received light. Based on the plurality of pixel data output from the image pickup unit 240, real image data representing the entire image on one surface of the substrate W is generated. After that, the substrate W is returned to the position at the time of carrying in by the moving portion 260, and the substrate W is carried out to the outside of the housing 210 through the opening 216.

[2] Aberration distortion As described above, the image pickup unit 240 in FIG. 1 includes one or a plurality of condenser lenses. In this case, distortion due to lens aberration (hereinafter referred to as aberration distortion) occurs in the actual image data acquired by the image pickup unit 240. FIG. 3 is a schematic diagram for explaining aberration distortion. FIG. 3A shows an example of an image that does not include aberration distortion. FIG. 3B shows an example of an image including aberration distortion. The image IM1 of FIG. 3A and the image IM2 of FIG. 3B are images of the same object S. The object S includes a plurality of vertical lines L1 and a plurality of horizontal lines L2. Each actual vertical line L1 and each horizontal line L2 is a straight line.

As shown in FIG. 3A, in the image IM1 that does not include aberration distortion, a plurality of vertical lines L1 are arranged parallel to each other and at equal intervals, and a plurality of horizontal lines L2 are arranged parallel to each other and at equal intervals. There is. On the other hand, as shown in FIG. 3B, in the image IM2 including the aberration distortion, the plurality of vertical lines L1 and the horizontal lines L2 are curved so as to bulge the central portion of the image IM2. The degree of curvature of the vertical line L1 and the horizontal line L2 increases as the distance from the center of the image IM2 increases.

As described above, the image pickup unit 240 in FIG. 1 includes a line sensor extending in the direction D1 and continuously images the substrate W moving in the direction D2 at a predetermined sampling cycle to generate actual image data. In this case, the portion on the substrate W imaged at a temporary point by the imaging unit 240 is a linear portion extending in the direction D1. Therefore, the actual image data obtained by the image pickup unit 240 does not include the aberration distortion in the direction D2, but includes only the aberration distortion in the direction D1. FIG. 3C shows an example of an image of the object S obtained by the imaging unit 240. In the image IM3 of FIG. 3C, the horizontal direction corresponds to the direction D1 and the vertical direction corresponds to the direction D2. In this case, aberration distortion does not occur in the vertical direction, and aberration distortion occurs only in the horizontal direction. Specifically, the distance between adjacent vertical lines L1 becomes smaller as the image IM3 is separated from the center in the horizontal direction. The plurality of horizontal lines L2 are arranged parallel to each other and at equal intervals.

FIG. 4 is a diagram showing an example of a real image of the substrate W represented by the acquired real image data. The position of each pixel of the actual image data is represented by a device-specific two-dimensional coordinate system (hereinafter referred to as a device coordinate system). In the present embodiment, the device coordinate system is an xy coordinate system having an x-axis and a y-axis orthogonal to each other. In this case, the x-axis direction corresponds to the above-mentioned direction D1, and the y-axis direction corresponds to the above-mentioned direction D2. The origin of the device coordinate system is set, for example, to a pixel at any corner of the real image RI.

In the example of FIG. 4, the pixel in the upper left corner of the real image RI is set as the origin (0,0). The positive orientation of the x-axis is right and the positive orientation of the y-axis is down. For example, when the number of pixels of the real image RI is 1000 × 1000, the coordinates of the pixels in the upper right corner of the real image RI are (1000,0), and the coordinates of the pixels in the lower left corner of the real image RI are. The initial coordinates are (0,1000), and the coordinates of the pixels in the lower right corner of the real image RI are (1000,1000).

In this example, the outer peripheral portion of the actual substrate W has a perfect circular shape except for the notch. However, in the actual image RI of FIG. 4, aberration distortion occurs in the x-axis direction, and the outer peripheral portion of the substrate W has an oval shape extending in the x-axis direction. It should be noted that the notch is not shown in FIG. 4 and FIGS. 7 to 10 below.

[3] Corrected image data generation process In the present embodiment, the corrected image data is generated from the actual image data by the corrected image data generation process described later. The corrected image data represents an original surface image of the substrate W (hereinafter, referred to as a corrected image). The original surface image means a surface image that does not include aberration distortion.

FIG. 5 is a block diagram showing a functional configuration of the substrate inspection device 200. As shown in FIG. 5, the substrate inspection device 200 includes an actual image data acquisition unit 310, a correction image data generation unit 320, and an inspection unit 330. The corrected image data generation unit 320 includes a first position information acquisition unit 321, a second position information acquisition unit 322, a position relationship specifying unit 323, and a pixel value setting unit 324. These functions are realized by, for example, a CPU executing a computer program stored in a memory in the control device 400.

The real image data acquisition unit 310 acquires the real image data generated by the image pickup unit 240 taking an image of the substrate W. The image data acquisition unit is configured by the image pickup unit 240, the actual image data acquisition unit 310, and the substrate holding device 250 and the moving unit 260 of FIG. The corrected image data generation unit 320 generates corrected image data based on the acquired actual image data. The inspection unit 330 inspects the substrate W based on the generated corrected image data. In this example, an appearance inspection for determining the presence or absence of defects in the appearance of the substrate W is performed.

The details of the corrected image data generation unit 320 will be described. The first position information acquisition unit 321 acquires the positions of a plurality of outer peripheral points on the outer peripheral portion of the substrate W represented in the actual image as the first outer peripheral position information. The second position information acquisition unit 322 acquires the original positions of the plurality of outer peripheral points to be represented in the corrected image as the second outer peripheral position information. In this example, the first outer peripheral position information is a plurality of actual outer peripheral coordinates representing the positions of a plurality of outer peripheral points in the real image, and the second outer peripheral position information represents the positions of the plurality of outer peripheral points in the corrected image. Multiple corrected perimeter coordinates. The details of the actual outer peripheral coordinates and the corrected outer peripheral coordinates will be described later.

Based on the acquired first and second outer peripheral position information, the positional relationship specifying unit 323 includes each pixel of the actual image data representing each part of the substrate and each pixel of the corrected image data representing each part of the substrate. Identify the positional relationship. In this example, the relationship between the coordinates of each pixel of the real image data and the coordinates of each pixel of the corrected image data by regression analysis using the coordinates of a plurality of outer peripheral points in the real image and the coordinates of a plurality of outer peripheral points in the corrected image. The relational expression representing is specified. The method of specifying the relational expression by regression analysis will be described later. The pixel value setting unit 324 sets the value of each pixel of the corrected image data based on the value of each pixel of the actual image data and the positional relationship specified by the positional relationship specifying unit 323.

FIG. 6 is a flowchart showing a corrected image data generation process by the control device 400 of FIG. 7 to 10 are diagrams for conceptually explaining the corrected image data generation process.

First, the actual image data acquisition unit 310 acquires the actual image data (step S11). Next, the first position information acquisition unit 321 detects the outer peripheral portion (edge) of the substrate W in the actual image RI based on the acquired real image data, and the substrate W is based on the detected outer peripheral portion. The coordinates of the center are specified (step S12). For example, the outer peripheral portion of the substrate W in the real image RI is detected by using a Sobel filter or the like. The coordinates of the center of the detected outer peripheral portion are specified as the coordinates of the center of the substrate W.

Next, the first position information acquisition unit 321 sets the conversion coordinate system so that the center of the substrate W is the origin (step S13 in FIG. 6). Specifically, as shown in FIG. 7A, the coordinates of the center CN of the substrate W are set to the origin (0,0), and the x-axis and the y-axis of the device coordinate system are parallel to each other. And a transformed coordinate system with a Y-axis is set. The positive orientation of the X-axis is right and the positive orientation of the Y-axis is up.

Next, the first position information acquisition unit 321 sets a plurality of actual outer peripheral points on the outer peripheral portion of the substrate W in the actual image RI, and sets the coordinates of the plurality of actual outer peripheral points in the conversion coordinate system as the actual outer peripheral coordinates. (Step S14 in FIG. 6). The actual outer peripheral coordinates are an example of the first outer peripheral coordinates. Further, the X coordinate of the actual outer peripheral point is an example of the first position, and the Y coordinate of the actual outer peripheral point is an example of the second position.

For example, as shown in FIG. 7B, a plurality of virtual lines VL extending from the center CN of the substrate W to the outside of the outer peripheral portion of the substrate W are set. For example, the plurality of virtual lines VL are arranged at equal angular intervals with respect to the center CN of the substrate W. In the example of FIG. 7B, eight virtual lines VL are set symmetrically with respect to the Y axis and symmetrically with respect to the X axis. The angular spacing of the eight virtual lines VL is 45 degrees. Further, points A1, A2, ..., A8 at which these plurality of correction lines VL and the outer peripheral portion of the substrate W intersect are set as actual outer peripheral points, respectively. The actual outer peripheral coordinates of the actual outer peripheral points A1, A2, ..., A8 are (X1, Y1), (X2, Y2), ..., And (X8, Y8).

Next, the second position information acquisition unit 322 sets a plurality of virtual outer peripheral points corresponding to each of the plurality of real outer peripheral points in a predetermined virtual coordinate system, and sets the coordinates of the plurality of virtual outer peripheral points as the virtual outer circumference. Obtained as coordinates (step S15 in FIG. 6). The virtual outer peripheral coordinates are an example of the third outer peripheral coordinates.

Specifically, as shown in FIG. 8A, a virtual coordinate system having an X'axis and a Y'axis orthogonal to each other is set. In the virtual coordinate system, the unit circle VC centered on the origin is set. A plurality of correction lines VL'extending from the center of the unit circle VC to the outside of the unit circle VC are set so as to correspond to the plurality of virtual lines VL in the converted coordinate system. In the virtual coordinate system, the angle of each correction line VL'with respect to the X'axis and the angle of each correction line VL'with respect to the Y'axis are the angle of each correction line VL with respect to the X axis and each correction line VL with respect to the Y axis in the conversion coordinate system. Is the same as the angle of. Points B1, B2, ..., B8 where these plurality of correction lines VL'and the unit circle VC intersect are set as virtual outer peripheral points, respectively. The virtual perimeter coordinates of the virtual perimeter points B1, B2, ..., B8 are (0,1), (cos (π / 4), sin (π / 4)), ..., And (cos (3π /). 4), sin (3π / 4)).

Next, the second position information acquisition unit 322 sets a plurality of corrected outer peripheral points corresponding to a plurality of actual outer peripheral points in the conversion coordinate system, and acquires the coordinates of the plurality of corrected outer peripheral points as the corrected outer peripheral coordinates ( Step S16). The corrected outer peripheral coordinates are an example of the second outer peripheral coordinates. Further, the X coordinate of the corrected outer peripheral point is an example of the third position, and the Y coordinate of the corrected outer peripheral point is an example of the fourth position.

Specifically, as shown in FIG. 8B, in the conversion coordinate system, a plurality of actual outer peripheral points A1 to A8 corresponding to a plurality of actual outer peripheral points A1 to A8 are formed on the outer peripheral line EL representing the original outer peripheral portion of the substrate W. The correction outer peripheral points C1 to C8 are set. The corrected outer peripheral points C1 to C8 correspond to the original positions of the actual outer peripheral points A1 to A8 when there is no aberration distortion.

As described above, the real image RI has no aberration distortion in the Y-axis direction. Therefore, the Y coordinates of the corrected outer peripheral points C1 to C8 are equal to the Y coordinates of the actual outer peripheral points A1 to A8, respectively. On the other hand, the real image RI has aberration distortion in the X-axis direction. Therefore, the X coordinates of the corrected outer peripheral points C1 to C8 are different from the X coordinates of the actual outer peripheral points A1 to A8. Therefore, the X coordinates of the correction outer peripheral points C1 to C8 are calculated using the following equations (1) and (2).

X _am (n) = X'(n) · Y _max (Y ≧ 0) ・ ・ ・ (1)
X _am (n) = X'(n) · | Y _min | (Y <0) ... (2)
In the equations (1) and (2), X'(n) is the X'coordinate of an arbitrary virtual outer peripheral point, and X _am (n) is the X of the corrected outer peripheral point corresponding to the arbitrary virtual outer peripheral point. The coordinates.

Y _max is the maximum value of the Y coordinate representing the outer peripheral portion of the substrate W on the actual image RI. Y _min is the minimum value of the Y coordinate representing the outer peripheral portion of the substrate W on the actual image RI. In the example of FIG. 8B, the actual outer peripheral points A1 and A5 are set on the Y axis. In this case, the Y coordinate of the actual outer peripheral point A1 is Y _max , and the Y coordinate of the actual outer peripheral point A5 is Y _min . Y _max represents the radius of the outer peripheral line EL in the range of Y ≧ 0, and | Y _min | represents the radius of the outer peripheral line EL in the range of Y <0. When Y _max = | Y _min |, the outer peripheral line EL is a perfect circle.

The deviation between the actual outer peripheral point and the corrected outer peripheral point corresponding to each other becomes smaller as it approaches the center of the substrate W in the X-axis direction. In this case, the deviation between the actual outer peripheral point and the corrected outer peripheral point is 0 on the Y axis. Therefore, in FIG. 8B, the actual outer peripheral point A1 and the corrected outer peripheral point C1 coincide with each other, and the actual outer peripheral point A5 and the corrected outer peripheral point C5 coincide with each other.

In the range of Y ≧ 0, X _am (n) is calculated using the above equation (1), and in the range of Y <0, X _am (n) is calculated using the above equation (2). In the example of FIG. 8B, the X coordinates of the corrected outer peripheral points C2, C3, C7, and C8 are calculated using the equation (1), and the X coordinates of the corrected outer peripheral points C4 and C6 are the equation (2). Calculated using. For example, the X coordinate of the corrected outer peripheral point C2 is cos (π / 4) · Y _max , and the X coordinate of the corrected outer peripheral point C6 is cos (-3π / 4) · | Y _min |. Since the correction outer peripheral points C1 and C5 are on the Y axis, the X coordinate of the correction outer peripheral points C1 and C5 is 0. It should be noted that Y _am (n) may be calculated using only one of the equations (1) and (2). In this case, it is assumed that the outer peripheral line EL is a perfect circle.

Next, the positional relationship specifying unit 323 specifies a correction relational expression representing the relationship between the coordinates of each pixel in the real image RI and the coordinates of each pixel in the corrected image (step S17 in FIG. 6). Specifically, the following correction relational expression (3) is specified by regression analysis (in this example, multiple regression analysis).

X (p) = k ₀ + k ₁ X _am (p) + k ₂ X _am (p) ² + k ₃ X _am (p) ³ + ... + ^km X _am (p) _m
... (3)
In the correction relational expression (3), X _am (p) is the X coordinate of an arbitrary pixel of the corrected image, and Xp is the X coordinate of the pixel of the real image RI corresponding to the arbitrary pixel. In this example, the number and arrangement of pixels constituting the corrected image are equal to the number and arrangement of pixels constituting the real image RI, respectively. Further, a conversion coordinate system is set for the corrected image in the same manner as the actual image RI.

The coefficients k ₀ to _km have X (p) as the objective variable and X _am (p), X _am (p) ² , X _am (p) ³ , ..., X _am (p) ^m as explanatory variables. It can be calculated by regression analysis. In this case, the X coordinates of a plurality of real outer peripheral points are used as X (p), and X _am (p), X _am (p) ² , X _am (p) ³ , ..., X _am (p). As ^m , the X coordinate “X _am (n)” of the plurality of correction outer peripheral points calculated by the equations (1) and (2) is used. m is a positive integer, and the larger m is, the higher the reliability of the correction relational expression.

Next, the pixel value setting unit 324 sets the value of each pixel of the corrected image data based on the acquired relational expression for correction (step S18 in FIG. 6). Specifically, as shown in FIG. 9A, one pixel Ea of all the pixels of the corrected image AI is set as the pixel of interest. The X and Y coordinates of the pixel of interest Ea are "Xa" and "Ya", respectively. Subsequently, as shown in FIG. 9B, among all the pixels of the real image RI, the pixel corresponding to the pixel of interest Ea (hereinafter referred to as the corresponding pixel) Eb is specified. The X and Y coordinates of the corresponding pixel Eb are "Xb" and "Yb", respectively.

In this case, the X coordinate “Xa” of the pixel of interest Ea is substituted into X _am (p) of the equation (3). As a result, the X coordinate “Xb” of the corresponding pixel E2 is calculated as X (p) in the equation (3). Further, the Y coordinate "Yb" of the corresponding pixel Eb is equal to the Y coordinate "Ya" of the pixel of interest Ea. As a result, the X coordinate “Xb” and the Y coordinate “Yb” of the corresponding pixel Eb are specified.

The value of the pixel of interest Ea (for example, the gradation value) is set to be equal to the value of the corresponding pixel Eb. Similarly, the corresponding pixels of the actual image RI are specified for all the pixels of the corrected image AI, and the value of each pixel of the corrected image AI is set to be equal to the value of the corresponding pixel. As a result, the values of all the pixels of the corrected image AI are determined. As a result, the corrected image AI in which the aberration distortion as shown in FIG. 10 is removed is completed. It should be noted that the values of all the pixels of the corrected image AI are not set by the above method, but the values of some pixels of the corrected image AI may be set by interpolation using the values of other pixels.

[4] Appearance inspection In the present embodiment, the substrate W to be inspected (hereinafter referred to as an inspection substrate) is used using image data (hereinafter referred to as sample image data) representing a surface image of a sample substrate having no defects in appearance. It is determined whether or not there is a defect of (referred to as W). For example, a substrate that has been inspected with high accuracy in advance and is determined to have no defects by the inspection is used as a sample substrate. The sample image data may be acquired by the substrate inspection device 200 or may be acquired by another device. Moreover, the design data generated in advance may be used as the sample image data.

Hereinafter, the defect determination process by the inspection unit 330 of FIG. 5 will be described. FIG. 11 is a flowchart of the defect determination process. As shown in FIG. 11, the inspection unit 330 acquires the corrected image data generated by the corrected image data generation process of FIG. 6 (step S21). Based on the corrected image data, the corrected image of the inspection board W that does not include aberration distortion may be displayed on the display unit 410 of FIG. Subsequently, the inspection unit 330 acquires sample image data prepared in advance (step S22). It is preferable that the sample image data does not include aberration distortion. When the sample image data includes aberration distortion, the corrected image data generation process may be performed on the sample image data in the same manner as the inspection image data.

Next, the inspection unit 330 determines the presence or absence of a defect in the inspection board W based on the comparison between each pixel of the sample image data and each pixel of the corrected image data (step S23). Specifically, the difference between the values of the pixels of each set having the same coordinates in the sample image data and the inspection image data is calculated.

The value of the pixel representing the normal portion in the inspection image data is the same as or close to the value of the corresponding pixel in the sample image data. On the other hand, the value of the pixel representing the defective portion in the inspection image data is significantly different from the value of the corresponding pixel in the sample image data. Thereby, the normal part and the defective part in the inspection board W can be distinguished based on the difference value of each set of pixels having the same coordinates in the inspection image data and the sample image data. For example, when the difference values of all the sets of pixels in the inspection image data and the sample image data are within a predetermined allowable range, the inspection unit 330 determines that the inspection board W has no defects in appearance. When the difference value of any set of pixels in the inspection image data and the sample image data is out of the permissible range, the inspection unit 330 determines that the inspection board W has an appearance defect.

This ends the defect determination process. The inspection board W in which a defect is detected is subjected to a different process from the inspection board W in which it is determined that there is no defect. For example, the inspection board W in which a defect is detected is subjected to a detailed inspection, a regeneration process, or the like.

[5] Board processing device FIG. 12 is a schematic block diagram showing an overall configuration of a board processing device including the board inspection device 200 of FIGS. 1 and 2. As shown in FIG. 12, the substrate processing device 100 is provided adjacent to the exposure device 500 and includes a substrate inspection device 200, as well as a control device 110, a transfer device 120, a coating processing unit 130, a development processing unit 140, and a heat treatment. A unit 150 is provided.

The control device 110 includes, for example, a CPU and a memory, or a microcomputer, and controls the operations of the transfer device 120, the coating processing unit 130, the development processing unit 140, and the heat treatment unit 150. Further, the control device 110 gives a command for inspecting the surface state of one surface of the substrate W to the control device 400 (FIG. 1) of the substrate inspection device 200.

The transport device 120 transports the substrate W between the coating processing unit 130, the development processing unit 140, the heat treatment unit 150, the substrate inspection device 200, and the exposure device 500. The coating treatment unit 130 forms a resist film on the surface of the substrate W by applying a resist liquid to the surface of the substrate W (coating treatment). The coating treatment section 130 is an example of a film forming section, and the resist film is an example of a treatment film. The substrate W after the coating process is exposed by the exposure apparatus 500. The development processing unit 140 performs the development processing of the substrate W by supplying the developer to the substrate W after the exposure processing by the exposure apparatus 500. The heat treatment unit 150 heat-treats the substrate W before and after the coating process by the coating process unit 130, the development process by the development process unit 140, and the exposure process by the exposure apparatus 500.

The substrate inspection apparatus 200 inspects the substrate W (defect determination processing) after the resist film is formed by the coating processing unit 130. For example, the substrate inspection device 200 inspects the substrate W after the coating treatment by the coating processing unit 130 and after the development processing by the development processing unit 140. Alternatively, the substrate inspection device 200 may inspect the substrate W after the coating process by the coating process unit 130 and before the exposure process by the exposure device 500. Further, the substrate inspection device 200 may inspect the substrate W after the coating treatment by the coating processing unit 130 and after the exposure processing by the exposure device 500 and before the development processing by the development processing unit 140.

The coating processing unit 130 may be provided with a processing unit that forms an antireflection film on the substrate W. In this case, the heat treatment unit 150 may perform an adhesion strengthening treatment for improving the adhesion between the substrate W and the antireflection film. Further, the coating processing unit 130 may be provided with a processing unit for forming a resist cover film for protecting the resist film formed on the substrate W. When the antireflection film and the resist cover film are formed on one surface of the substrate W, the substrate W may be inspected by the substrate inspection apparatus 200 after the formation of each film.

In the substrate processing apparatus 100 according to the present embodiment, the surface condition on one surface of the substrate W on which a film such as a resist film, an antireflection film, or a resist cover film is formed is inspected by the substrate inspection apparatus 200 of FIG. .. As a result, the substrate W can be appropriately inspected based on the corrected image data that does not include aberration distortion.

In this example, the substrate inspection device 200 is provided in the substrate processing device 100 that processes the substrate W before and after the exposure processing, but the substrate inspection device 200 may be provided in another substrate processing device. For example, the substrate inspection device 200 may be provided in the substrate processing device that performs the cleaning process on the substrate W, or the substrate inspection device 200 may be provided in the substrate processing device that performs the etching process of the substrate W. Alternatively, the substrate inspection device 200 may be used alone.

[6] Effect of the Embodiment In the substrate inspection apparatus 200 according to the present embodiment, the coordinates of the plurality of actual outer peripheral points represented by the actual image RI are acquired as the plurality of actual outer peripheral coordinates, and are displayed in the corrected image AI. The coordinates of the plurality of correction outer peripheral points to be performed are acquired as the plurality of correction outer peripheral coordinates. Based on the acquired plurality of actual outer peripheral coordinates and a plurality of corrected outer peripheral coordinates, the positional relationship between each pixel of the actual image data and each pixel of the corrected image data is specified. The value of each pixel of the corrected image data is set based on the positional relationship. This makes it possible to generate corrected image data from which aberration distortion is removed. By using the corrected image data generated in this way, the substrate can be appropriately inspected. Further, since the corrected image data can be generated based on the actual image data obtained by imaging the substrate W to be inspected, it is not necessary to separately prepare a special substrate or the like for correction, and the correction is performed. It is not necessary to set the parameters for this in advance. Therefore, the time and cost required to generate the corrected image data are reduced.

Further, in the present embodiment, a correction relationship showing the relationship between the coordinates of each pixel of the real image data and the coordinates of each pixel of the corrected image data by regression analysis using a plurality of actual outer peripheral coordinates and a plurality of corrected outer peripheral coordinates. The expression is specified. Thereby, the pixel of the real image data corresponding to the pixel of the corrected image data can be easily specified by using the specified correction relational expression, and the corrected image data is based on the value of the pixel of the real image data. The pixel value of can be set easily and accurately.

Further, in the present embodiment, the coordinates of a plurality of virtual outer peripheral points set on the unit circle in the virtual coordinate system are acquired as a plurality of virtual outer peripheral coordinates, and are based on the plurality of real outer peripheral coordinates and the plurality of virtual outer peripheral coordinates. Multiple corrected perimeter coordinates are acquired. As a result, it is possible to acquire a plurality of corrected outer peripheral coordinates without performing complicated calculation, image analysis, or the like.

Further, in the present embodiment, the actual image data is acquired by continuously imaging the substrate W by the imaging unit 240 while the substrate is moved in the direction D2 by the moving unit 260. Since the image pickup unit 240 captures the substrate by the line sensor extending in the direction D1, in the actual image, aberration distortion occurs only in the X-axis direction corresponding to the direction D1, and aberration distortion occurs in the Y-axis direction corresponding to the direction D2. Does not occur. Therefore, the Y coordinate of each corrected outer peripheral point is set to be the same as the Y coordinate of the corresponding actual outer peripheral point. Thereby, the aberration distortion in the X-axis direction can be appropriately removed based on the X coordinate of each actual outer peripheral point and the X coordinate of each corrected outer peripheral point.

Further, in the present embodiment, an outer peripheral line EL representing the original shape of the outer peripheral portion of the substrate W is set based on the Y coordinates (Y _max and Y _min ) of the actual outer peripheral point, and the set outer peripheral line EL is set. The X coordinates of the plurality of correction outer peripheral points are specified based on. As a result, each corrected outer peripheral coordinate can be efficiently and appropriately specified.

[7] Other Embodiments In the above embodiment, the number of the actual outer peripheral points and the corrected outer peripheral points is set to eight, but the number of the actual outer peripheral points and the corrected outer peripheral points can be arbitrarily changed. By increasing the number of the actual outer peripheral points and the corrected outer peripheral points, the positional relationship between each pixel of the actual image data and each pixel of the corrected image data can be specified more accurately.

In the above embodiment, the appearance inspection of the substrate W is performed as the inspection of the substrate W using the corrected image data, but other inspections may be performed as the inspection of the substrate W. For example, based on the corrected image data, it may be inspected whether or not the distance (edge width) between the outer peripheral portion of the substrate W and the outer peripheral portion of the film formed on the substrate W is appropriate. .. In this case, the edge width can be appropriately detected by using the corrected image data from which the aberration distortion is removed. As a result, the accuracy of determining whether or not the edge width is appropriate is improved.

In the above embodiment, real image data including aberration distortion in the X-axis direction and not including aberration distortion in the Y-axis direction is used, but real image data including aberration distortion in both the X-axis direction and the Y-axis direction is used. It may be used. For example, an image sensor in which pixels are arranged in two dimensions is used instead of a line sensor, and a stationary substrate W is imaged, so that an actual image including aberration distortion in both the X-axis direction and the Y-axis direction is included. Data is retrieved. In this case, the Y coordinates of the actual outer peripheral points and the Y coordinates of the corrected outer peripheral points corresponding to each other are different. For example, in addition to the correction relational expression regarding the X coordinate, the correction relational expression regarding the Y coordinate is specified. Using these correction relational expressions, the pixels of the actual image data corresponding to the pixels of the corrected image data are specified, and the values of the corrected image data are set based on the values of the pixels of the actual image data.

In the above embodiment, as the positional relationship between each pixel of the actual image data and each pixel of the corrected image data, a correction relationship representing the relationship between the coordinates of each pixel of the actual image data and the coordinates of each pixel of the corrected image data. The formula is specified, but the invention is not limited to this. For example, instead of the correction relation expression, a map showing the positional relationship between each pixel of the actual image data and each pixel of the corrected image data may be generated. Further, instead of using regression analysis, each pixel of the actual image data and each pixel of the corrected image data are obtained by another method using the position information of a plurality of real outer peripheral points and the position information of a plurality of corrected outer peripheral points. The positional relationship may be specified.
[7] Reference form
(1) The substrate inspection apparatus according to the first reference embodiment includes an image data acquisition unit that acquires real image data representing an actual image of one surface of the substrate by imaging a substrate having at least a circular outer peripheral portion. , The corrected image data generation unit that generates the corrected image data that represents the original image of one side of the board as the corrected image based on the actual image data, and the corrected image data generated by the corrected image data generation unit of the board. A first position information acquisition unit is provided with an inspection unit for inspecting, and the correction image data generation unit acquires the positions of a plurality of outer peripheral points on the outer peripheral portion of the substrate represented in the actual image as the first outer peripheral position information. A second position information acquisition unit that acquires the original positions of the unit and a plurality of outer peripheral points to be represented in the corrected image as the second outer peripheral position information, and a second position information acquisition unit acquired by the first position information acquisition unit. Based on the outer peripheral position information of 1 and the second outer peripheral position information acquired by the second position information acquisition unit, each pixel of the actual image data representing each part of the substrate and the corrected image data representing each part of the substrate A pixel value that sets the value of each pixel of the corrected image data based on the relationship specified by the positional relationship specifying unit that specifies the positional relationship with each pixel, the value of each pixel of the actual image data, and the positional relationship specifying unit. Including the setting part.
In this board inspection device, real image data representing a real image of a board is acquired by taking an image of the board. The actual image data may include distortion due to aberration of the lens used for imaging the substrate (hereinafter, referred to as aberration distortion). Therefore, based on the actual image data, the corrected image data representing the original image of the substrate as the corrected image is generated.
In this case, the positions of the plurality of outer peripheral points represented in the actual image are acquired as the first outer peripheral position information, and the original positions of the plurality of outer peripheral points to be represented in the corrected image are used as the second outer peripheral position information. To be acquired. When aberration distortion is included in the actual image data, a difference occurs between the first and second outer peripheral position information. Therefore, the positional relationship between each pixel of the actual image data and each pixel of the corrected image data is specified based on the first and second outer peripheral position information, and the value of each pixel of the corrected image data is specified based on the positional relationship. Is set. This makes it possible to easily generate corrected image data from which aberration distortion is removed. By using the corrected image data generated in this way, the substrate can be appropriately inspected. Further, since the corrected image data can be generated based on the actual image data obtained by imaging the substrate to be inspected, it is not necessary to separately prepare a special substrate or the like for correction, and the correction is performed. It is not necessary to set the parameters of the above in advance. Therefore, the time and cost required to generate the corrected image data are reduced.
(2) The positional relationship specifying unit may specify the positional relationship by regression analysis using the first outer peripheral position information and the second outer peripheral position information. In this case, the positional relationship between each pixel of the actual image data and each pixel of the corrected image data can be easily specified.
(3) The first outer peripheral position information includes a plurality of first outer peripheral coordinates representing the positions of the plurality of outer peripheral points in the actual image, and the second outer peripheral position information includes the positions of the plurality of outer peripheral points in the corrected image. The positional relationship specifying part is corrected with the coordinates of each pixel of the actual image data by regression analysis using the plurality of first outer peripheral coordinates and the plurality of second outer peripheral coordinates. A relational expression expressing the relation with the coordinates of each pixel of the image data may be specified as a positional relation. In this case, the pixel of the real image data corresponding to the pixel of the corrected image data can be easily specified by using the specified relational expression, and the pixel of the corrected image data is based on the value of the pixel of the real image data. You can set the value.
(4) The second position information acquisition unit acquires the coordinates of the plurality of virtual outer peripheral points corresponding to the plurality of outer peripheral points set on the unit circle in the virtual coordinate system as the plurality of third outer peripheral coordinates. A plurality of second outer peripheral coordinates may be acquired based on a plurality of first outer peripheral coordinates and a plurality of third outer peripheral coordinates.
In this case, by using the coordinates of the virtual outer peripheral points set on the unit circle, it is possible to acquire a plurality of second outer peripheral coordinates without performing complicated calculation, image analysis, or the like.
(5) In the image data acquisition unit, the substrate holding unit that holds the substrate, the image pickup unit that images the substrate by the line sensor extending in the first direction, and the substrate held by the substrate holding unit are relative to the image pickup unit. The first direction corresponds to the third direction in each of the real image and the corrected image, including the substrate holding part and the moving part that moves at least one of the image pickup units so as to move in the second direction. , The second direction corresponds to the fourth direction, and the first outer peripheral position information represents the position of each outer peripheral point in the third direction as the first position, and the position of each outer peripheral point in the fourth direction. As the second position, the second outer peripheral position information represents the position of each outer peripheral point in the third direction as the third position, and the position of each outer peripheral point in the fourth direction as the fourth position. Even if the fourth position of the plurality of outer peripheral points represented by the second outer peripheral position information is set to be the same as the second position of the plurality of outer peripheral points represented by the first outer peripheral position information. good.
In this case, the actual image data is acquired by continuously imaging the substrate by the imaging unit while the substrate is moved in the second direction by the moving unit. Since the image pickup unit captures the substrate by the line sensor extending in the first direction, in the actual image, aberration distortion occurs only in the third direction corresponding to the first direction, and the second direction corresponds to the second direction. Aberration distortion does not occur in the direction of 4. Therefore, the fourth position of each outer peripheral point in the corrected image is set to be the same as the second position. Thereby, the aberration distortion in the third direction can be appropriately removed based on the first position of each outer peripheral point in the actual image and the third position of each outer peripheral point in the corrected image.
(6) The second position information acquisition unit identifies and specifies the original shape of the outer peripheral portion of the substrate based on the second position of at least one outer peripheral point represented by the first outer peripheral position information. The third position of the plurality of outer peripheral points in the corrected image may be specified based on the formed shape.
In this case, since aberration distortion does not occur in the fourth direction in the actual image, the original shape of the outer peripheral portion of the substrate can be appropriately specified and specified based on the second position of each outer peripheral point. The third position of each outer peripheral point can be appropriately specified based on the formed shape.
(7) The substrate processing apparatus according to the second reference embodiment includes a film forming portion that forms a treated film on the substrate and the above-mentioned substrate inspection apparatus that inspects the substrate after the processed film is formed by the film forming portion. Be prepared.
In this substrate processing apparatus, the substrate is inspected by the above-mentioned substrate inspection apparatus. Therefore, the corrected image data including the aberration distortion can be easily generated, and the substrate can be appropriately inspected based on the corrected image data. Further, since the corrected image data can be generated based on the actual image data obtained by imaging the substrate to be inspected, it is not necessary to prepare a special substrate or the like for correction, and the correction is performed. There is no need to set parameters etc. in advance. Therefore, the time and cost required to generate the corrected image data are reduced.
(8) The substrate inspection method according to the third reference embodiment includes a step of acquiring real image data representing an actual image of one surface of the substrate by imaging a substrate having at least a circular outer peripheral portion, and an actual image. Generates corrected image data, including a step of generating corrected image data that represents the original image of one side of the board as a corrected image based on the data, and a step of inspecting the board based on the generated corrected image data. The steps to be performed are a step of acquiring the positions of a plurality of outer peripheral points on the outer peripheral portion of the substrate represented in the actual image as the first outer peripheral position information, and an original step of acquiring the positions of the plurality of outer peripheral points to be represented in the corrected image. Based on the step of acquiring the position as the second outer peripheral position information and the first and second outer peripheral position information, each pixel of the actual image data representing each part of the substrate and the corrected image data representing each part of the substrate It includes a step of specifying a positional relationship with each pixel and a step of setting a value of each pixel of the corrected image data based on the value of each pixel of the actual image data and the specified relationship.
According to this substrate inspection method, the actual image data representing the actual image of the substrate is acquired by imaging the substrate. The positions of the plurality of outer peripheral points represented in the actual image are acquired as the first outer peripheral position information, and the original positions of the plurality of outer peripheral points to be represented in the corrected image are acquired as the second outer peripheral position information. .. When aberration distortion is included in the actual image data, a difference occurs between the first and second outer peripheral position information. Therefore, the positional relationship between each pixel of the actual image data and each pixel of the corrected image data is specified based on the first and second outer peripheral position information, and the value of each pixel of the corrected image data is specified based on the positional relationship. Is set. This makes it possible to easily generate corrected image data from which aberration distortion is removed. By using the corrected image data generated in this way, the substrate can be appropriately inspected. Further, since the corrected image data can be generated based on the actual image data obtained by imaging the substrate to be inspected, it is not necessary to separately prepare a special substrate or the like for correction, and the correction is performed. It is not necessary to set the parameters of the above in advance. Therefore, the time and cost required to generate the corrected image data are reduced.

110 ... control device, 120 ... transfer device, 130 ... coating processing unit, 140 ... development processing unit, 150 ... heat treatment unit, 200 ... substrate inspection device, 210 ... housing, 220 ... floodlight unit, 230 ... reflection unit, 240 ... Imaging unit, 250 ... Board holding device, 260 ... Moving unit, 270 ... Notch detection unit, 310 ... Real image data acquisition unit, 320 ... Corrected image data generation unit, 321 ... First position information acquisition unit, 322 ... 2 position information acquisition unit, 323 ... positional relationship specifying unit, 324 ... pixel value setting unit, 330 ... inspection unit, 400 ... control device, 410 ... display unit, AI ... corrected image, RI ... actual image

Claims (10)

An image data acquisition unit that acquires real image data representing an actual image of one surface of a substrate by imaging a substrate having at least a part having a circular edge .
A correction image data generation unit that generates correction image data that represents an original image of one surface of a substrate as a correction image based on the actual image data, and a correction image data generation unit.
It is provided with an inspection unit that inspects the substrate based on the corrected image data generated by the corrected image data generation unit.
The corrected image data generation unit is
A first position information acquisition unit that acquires the positions of a plurality of outer peripheral points on the edge of the substrate represented in the actual image as the first outer peripheral position information.
A second position information acquisition unit that acquires the original positions of the plurality of outer peripheral points to be represented in the corrected image as the second outer peripheral position information, and
The actual image representing each part of the substrate based on the first outer peripheral position information acquired by the first position information acquisition unit and the second outer peripheral position information acquired by the second position information acquisition unit. A positional relationship specifying unit that specifies the positional relationship between each pixel of the data and each pixel of the corrected image data representing each part of the substrate, and
A substrate inspection apparatus including a pixel value setting unit that sets a value of each pixel of the corrected image data based on a value of each pixel of the actual image data and a positional relationship specified by the positional relationship specifying unit. An image data acquisition unit that acquires real image data representing an actual image of one surface of the substrate by imaging a substrate having at least a circular outer peripheral portion.
A correction image data generation unit that generates correction image data that represents an original image of one surface of a substrate as a correction image based on the actual image data, and a correction image data generation unit.
It is provided with an inspection unit that inspects the substrate based on the corrected image data generated by the corrected image data generation unit.
The corrected image data generation unit is
A first position information acquisition unit that acquires the positions of a plurality of outer peripheral points on the outer peripheral portion of the substrate shown in the actual image as the first outer peripheral position information.
A second position information acquisition unit that acquires the original positions of the plurality of outer peripheral points to be represented in the corrected image as the second outer peripheral position information, and
The actual image representing each part of the substrate based on the first outer peripheral position information acquired by the first position information acquisition unit and the second outer peripheral position information acquired by the second position information acquisition unit. A positional relationship specifying unit that specifies the positional relationship between each pixel of the data and each pixel of the corrected image data representing each part of the substrate, and
Includes a pixel value setting unit that sets the value of each pixel of the corrected image data based on the value of each pixel of the actual image data and the positional relationship specified by the positional relationship specifying unit.
The positional relationship specifying unit is a substrate inspection device that specifies the positional relationship by regression analysis using the first outer peripheral position information and the second outer peripheral position information. The first outer peripheral position information includes a plurality of first outer peripheral coordinates representing the positions of the plurality of outer peripheral points in the actual image.
The second outer peripheral position information includes a plurality of second outer peripheral coordinates each representing the positions of the plurality of outer peripheral points in the corrected image.
The positional relationship specifying unit includes the coordinates of each pixel of the actual image data and the coordinates of each pixel of the corrected image data by regression analysis using the plurality of first outer peripheral coordinates and the plurality of second outer peripheral coordinates. The substrate inspection apparatus according to claim 2, wherein the relational expression representing the relationship is specified as the positional relationship. The second position information acquisition unit acquires the coordinates of the plurality of virtual outer peripheral points corresponding to the plurality of outer peripheral points set on the unit circle in the virtual coordinate system as the plurality of third outer peripheral coordinates, and the said. The substrate inspection apparatus according to claim 3, wherein the plurality of second outer peripheral coordinates are acquired based on the plurality of first outer peripheral coordinates and the plurality of third outer peripheral coordinates. An image data acquisition unit that acquires real image data representing an actual image of one surface of the substrate by imaging a substrate having at least a circular outer peripheral portion.
A correction image data generation unit that generates correction image data that represents an original image of one surface of a substrate as a correction image based on the actual image data, and a correction image data generation unit.
It is provided with an inspection unit that inspects the substrate based on the corrected image data generated by the corrected image data generation unit.
The corrected image data generation unit is
A first position information acquisition unit that acquires the positions of a plurality of outer peripheral points on the outer peripheral portion of the substrate shown in the actual image as the first outer peripheral position information.
A second position information acquisition unit that acquires the original positions of the plurality of outer peripheral points to be represented in the corrected image as the second outer peripheral position information, and
The actual image representing each part of the substrate based on the first outer peripheral position information acquired by the first position information acquisition unit and the second outer peripheral position information acquired by the second position information acquisition unit. A positional relationship specifying unit that specifies the positional relationship between each pixel of the data and each pixel of the corrected image data representing each part of the substrate, and
Includes a pixel value setting unit that sets the value of each pixel of the corrected image data based on the value of each pixel of the actual image data and the positional relationship specified by the positional relationship specifying unit.
The image data acquisition unit
The board holding part that holds the board and
An image pickup unit that captures images of the substrate by a line sensor extending in the first direction,
It includes a substrate holding portion and a moving portion that moves at least one of the imaging portions so that the substrate held by the substrate holding portion moves in a second direction relative to the image pickup unit.
In each of the actual image and the corrected image, the first direction corresponds to the third direction, and the second direction corresponds to the fourth direction.
In the first outer peripheral position information, the position of each outer peripheral point in the third direction is represented as a first position, and the position of each outer peripheral point in the fourth direction is represented as a second position.
In the second outer peripheral position information, the position of each outer peripheral point in the third direction is represented as a third position, and the position of each outer peripheral point in the fourth direction is represented as a fourth position.
The fourth position of the plurality of outer peripheral points represented by the second outer peripheral position information is the same as the second position of the plurality of outer peripheral points represented by the first outer peripheral position information. Board inspection equipment to be set. The second position information acquisition unit identifies and identifies the original shape of the outer peripheral portion of the substrate based on the second position of at least one outer peripheral point represented by the first outer peripheral position information. The substrate inspection apparatus according to claim 4, wherein a third position of the plurality of outer peripheral points in the corrected image is specified based on the shape. A film forming part that forms a treated film on the substrate,
A substrate processing apparatus comprising the substrate inspection apparatus according to any one of claims 1 to 5, which inspects a substrate after formation of a treated film by the film forming portion. A step of acquiring real image data representing a real image of one surface of a board by imaging a board having at least a part having a circular edge .
A step of generating corrected image data that represents an original image of one surface of a substrate as a corrected image based on the actual image data, and
Including the step of inspecting the substrate based on the generated corrected image data.
The step of generating the corrected image data is
A step of acquiring the positions of a plurality of outer peripheral points on the edge of the substrate represented in the actual image as the first outer peripheral position information, and
A step of acquiring the original positions of the plurality of outer peripheral points to be represented in the corrected image as the second outer peripheral position information, and
A step of specifying the positional relationship between each pixel of the actual image data representing each part of the substrate and each pixel of the corrected image data representing each part of the substrate based on the first and second outer peripheral position information. When,
A substrate inspection method comprising the step of setting the value of each pixel of the corrected image data based on the value of each pixel of the real image data and the specified relationship. A step of acquiring real image data representing a real image of one surface of a board by imaging a board having at least a circular outer peripheral portion.
A step of generating corrected image data that represents an original image of one surface of a substrate as a corrected image based on the actual image data, and
Including the step of inspecting the substrate based on the generated corrected image data.
The step of generating the corrected image data is
A step of acquiring the positions of a plurality of outer peripheral points on the outer peripheral portion of the substrate represented in the actual image as the first outer peripheral position information, and
A step of acquiring the original positions of the plurality of outer peripheral points to be represented in the corrected image as the second outer peripheral position information, and
A step of specifying the positional relationship between each pixel of the actual image data representing each part of the substrate and each pixel of the corrected image data representing each part of the substrate based on the first and second outer peripheral position information. When,
A step of setting a value of each pixel of the corrected image data based on the value of each pixel of the real image data and the specified relationship is included.
The step of specifying the positional relationship is a substrate inspection method including specifying the positional relationship by regression analysis using the first outer peripheral position information and the second outer peripheral position information. A step of acquiring real image data representing a real image of one surface of a board by imaging a board having at least a circular outer peripheral portion.
A step of generating corrected image data that represents an original image of one surface of a substrate as a corrected image based on the actual image data, and
Including the step of inspecting the substrate based on the generated corrected image data.
The step of generating the corrected image data is
A step of acquiring the positions of a plurality of outer peripheral points on the outer peripheral portion of the substrate represented in the actual image as the first outer peripheral position information, and
A step of acquiring the original positions of the plurality of outer peripheral points to be represented in the corrected image as the second outer peripheral position information, and
A step of specifying the positional relationship between each pixel of the actual image data representing each part of the substrate and each pixel of the corrected image data representing each part of the substrate based on the first and second outer peripheral position information. When,
A step of setting a value of each pixel of the corrected image data based on the value of each pixel of the real image data and the specified relationship is included.
The step of acquiring the actual image data is
Holding the board by the board holding part and
Taking an image of the substrate by a line sensor included in the image pickup unit that extends in the first direction,
This includes moving at least one of the substrate holding portion and the imaging unit by the moving portion so that the substrate held by the substrate holding portion moves in a second direction relative to the imaging unit.
In each of the real image and the corrected image, the first direction corresponds to the third direction, and the second direction corresponds to the fourth direction.
In the first outer peripheral position information, the position of each outer peripheral point in the third direction is represented as a first position, and the position of each outer peripheral point in the fourth direction is represented as a second position.
In the second outer peripheral position information, the position of each outer peripheral point in the third direction is represented as a third position, and the position of each outer peripheral point in the fourth direction is represented as a fourth position.
The fourth position of the plurality of outer peripheral points represented by the second outer peripheral position information is the same as the second position of the plurality of outer peripheral points represented by the first outer peripheral position information. Board inspection method to be set.

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