JP7146528B2 - Substrate inspection device, substrate processing device, substrate inspection method, and substrate processing method - Google Patents

Description

The present invention relates to a substrate inspection apparatus, a substrate processing apparatus, a substrate inspection method, and a substrate processing method for inspecting a substrate.

Substrate inspection is performed during various processing steps on the substrate. For example, in the substrate inspection apparatus described in Japanese Patent Laid-Open No. 2002-200010, a strip of light having a diameter larger than the diameter of the substrate in one direction is emitted downward from the light projecting portion. In this state, the substrate to be inspected is moved in the other direction orthogonal to the one direction so as to pass under the light projecting section. As a result, each portion of the substrate is sequentially irradiated with band-like light. After that, the strip of light is sequentially reflected by each part of the substrate and received by the light receiving part. Image data representing an image of the entire surface of the substrate is generated based on the amount of light received by the light receiving section. A substrate is inspected based on the generated image data.

JP 2018-36235 A

In Patent Document 1, when the pixel size of the light-receiving section corresponding to the movement direction of the substrate and the movement pitch of the substrate match, image data showing the image of the substrate with an accurate aspect ratio is generated. . However, in practice, it is difficult to match the pixel size with the movement pitch of the substrate due to the mounting accuracy of the substrate movement mechanism and the like. Therefore, image data showing an image of the substrate with an accurate aspect ratio is not generated, and even if the substrate has a perfect circular shape, the image of the substrate shown by the image data will be an elliptical shape. In such a case, the accuracy of board inspection based on image data is reduced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate inspection apparatus, a substrate processing apparatus, a substrate inspection method, and a substrate processing method capable of inspecting a substrate with high accuracy based on image data.

(1) A substrate inspection apparatus according to a first aspect of the present invention includes a substrate holding unit that holds a substrate to be inspected having at least a portion of a circular outer peripheral portion, and an image of the substrate held by the substrate holding unit. a data acquisition unit that acquires actual image data shown as , an outline identification unit that identifies the outline of the board in the actual image based on the real image data acquired by the data acquisition unit, and the actual image specified by the outline identification unit A parameter calculation unit for calculating a correction parameter for correcting the actual image data based on the major axis and the minor axis of the elliptical shape, and the correction parameter calculated by the parameter calculating unit. a data correcting unit for correcting the actual image data acquired by the data acquiring unit as corrected image data so that the major axis and the minor axis of the outer shape of the substrate in the actual image are equal based on the data, and the corrected image corrected by the data correcting unit. an inspection unit for inspecting the substrate based on the data, the substrate to be inspected has a non-circular portion for indicating the orientation of the substrate, and the outline specifying unit has a predetermined shape in the actual image data. A plurality of virtual lines extending outward from the origin are set, and for each of the plurality of virtual lines, the position of the first pixel whose absolute value is greater than or equal to a predetermined threshold value is detected from the outside toward the origin, and the position of the pixel is detected. to the non-circular portion from the detected positions, and based on the plurality of positions other than the excluded positions, the realization of the portion of the substrate corresponding to the non-circular portion. The outer shape of the board is specified in the real image from which the image data is excluded, and the parameter calculator determines the board having an elliptical shape in the real image based on the outer shape of the board specified by the outer shape specifying part and the equation representing the ellipse. In addition to calculating the major axis and the minor axis of the outer shape, the magnification of the major axis and the minor axis is calculated as a correction parameter.

In this substrate inspection apparatus, a substrate to be inspected, which has an outer peripheral portion that is at least partially circular, is held by the substrate holding portion. Actual image data representing an image of the substrate held by the substrate holding unit is acquired. The outer shape of the substrate in the real image is specified based on the acquired real image data. The outer shape of the substrate in the specified real image is regarded as an ellipse, and correction parameters for correcting the real image data are calculated based on the major axis and minor axis of the ellipse. Based on the calculated correction parameters, the acquired real image data is corrected as corrected image data so that the major axis and the minor axis of the outer shape of the substrate in the real image become equal. The board is inspected based on the corrected corrected image data.

According to this configuration, even when the substrate in the actual image is distorted into an elliptical shape, corrected image data is generated by correcting the actual image data using the correction parameters based on the major axis and minor axis of the elliptical shape. be done. A substantially circular substrate is shown in the corrected image based on the corrected image data. As a result, the board can be inspected with high accuracy based on the corrected image data. In addition, there is no need to separately prepare a special substrate or jig for calculating correction parameters, and there is no need to set correction parameters in advance. Therefore, the time and cost required to generate corrected image data can be reduced.

In addition, the board to be inspected has a non-circular portion for indicating the orientation of the board, and the outer shape specifying section excludes the actual image data of the portion corresponding to the non-circular portion of the board to Identify the outline of the board. According to this configuration, even if the substrate to be inspected has a non-circular portion, it becomes easy to regard the external shape of the substrate in the actual image as an elliptical shape. This makes it possible to easily calculate the correction parameters.

( 2 ) The substrate holding unit holds the substrate such that the non-circular portion of the substrate faces a predetermined direction, and the data acquisition unit holds the substrate with the non-circular portion facing the predetermined direction. You may acquire the real image data which show the real image of. In this case, it becomes easy to specify the outer shape of the substrate in the actual image by excluding the actual image data of the portion corresponding to the non-circular portion of the substrate.

( 3 ) The parameter calculation unit may calculate the correction parameter by performing multiple regression analysis using the outer shape of the substrate specified by the outer shape specifying unit and the equation representing the ellipse. According to this configuration, even if the substrate in the actual image is distorted, the correction parameters can be calculated with high accuracy.

( 4 ) The outer shape identifying unit may identify the outer shape of the board in the actual image by filtering the actual image data acquired by the data acquiring unit. In this case, it is possible to easily specify the outline of the substrate in the actual image.

( 5 ) A substrate inspection apparatus includes an imaging unit that generates actual image data by capturing an image of a substrate held by a substrate holding unit with a line sensor extending in a first direction, and an image of the substrate held by the substrate holding unit. a moving unit that moves at least one of the substrate holding unit and the imaging unit so as to move in a second direction that intersects the first direction relative to the unit; The generated real image data may be acquired.

In this case, real image data can be easily generated by moving at least one of the substrate holding section and the imaging section at a predetermined pitch in the second direction by the moving section. Here, if the pixel size of the line sensor in the direction corresponding to the second direction does not match the movement pitch, the substrate in the actual image is distorted into an elliptical shape. Even in such a case, the corrected image based on the corrected image data shows a substantially circular substrate. As a result, the board can be inspected with high accuracy based on the corrected image data.

( 6 ) A substrate processing apparatus according to a second aspect of the invention comprises a film forming section for forming a processing film on a substrate, and a substrate inspection apparatus according to the first aspect for inspecting the substrate after the processing film is formed by the film forming section. and a device.

In this substrate processing apparatus, the substrate on which the processing film has been formed by the film forming section is inspected by the substrate inspection apparatus. As a result, the board can be inspected with high accuracy based on the corrected image data. In addition, there is no need to separately prepare a special substrate or jig for calculating correction parameters, and there is no need to set correction parameters in advance. Therefore, the time and cost required to generate corrected image data can be reduced.

(7) A board inspection method according to a third aspect of the present invention comprises the steps of: holding a board to be inspected having at least a partially circular outer periphery by a board holding part; acquiring real image data to be shown as an actual image; identifying the outer shape of the board in the real image based on the obtained real image data; regarding the outer shape of the board in the identified real image as an elliptical shape; calculating a correction parameter for correcting the actual image data based on the major axis and the minor axis of the elliptical shape; and making the major axis and the minor axis of the outer shape of the substrate in the real image equal based on the calculated correction parameter. and inspecting the board based on the corrected corrected image data, wherein the board to be inspected indicates the orientation of the board. The step of specifying the outer shape of the substrate includes setting a plurality of virtual lines extending outward from a predetermined origin in the real image data, and for each of the plurality of virtual lines , detecting the position of the first pixel whose absolute value is greater than or equal to a predetermined threshold from the outside toward the origin, and detecting the detected position of the virtual line extending from the origin toward the non-circular portion. and specifying the outer shape of the substrate in the real image from which the real image data of the portion corresponding to the non-circular portion of the substrate is excluded based on the plurality of positions other than the excluded positions. The step of calculating the correction parameter includes: calculating the major axis and the minor axis of the elliptical outer shape of the substrate in the real image based on the specified outer shape of the substrate and the equation representing the ellipse; It includes calculating the magnification with the minor axis as a correction parameter.

According to this board inspection method, even if the board in the actual image is elliptically distorted, the board can be inspected with high accuracy based on the corrected image data. In addition, there is no need to separately prepare a special substrate or jig for calculating correction parameters, and there is no need to set correction parameters in advance. Therefore, the time and cost required to generate corrected image data can be reduced.

In addition, the board to be inspected has a non-circular portion for indicating the orientation of the board, and the step of specifying the outer shape of the board in the actual image includes real image data of a portion corresponding to the non-circular portion of the board. to identify the outline of the substrate in the real image. According to this configuration, even if the substrate to be inspected has a non-circular portion, it becomes easy to regard the external shape of the substrate in the actual image as an elliptical shape. This makes it possible to easily calculate the correction parameters.

( 8 ) The step of holding the substrate to be inspected by the substrate holding part includes holding the substrate by the substrate holding part so that the non-circular portion of the substrate faces a predetermined direction, and Identifying the outer shape involves obtaining real image data representing a real image of the substrate with the non-circular portion facing in a predetermined direction, thereby acquiring real image data of the portion corresponding to the non-circular portion of the substrate. to identify the contour of the substrate in the real image. In this case, it becomes easy to specify the outer shape of the substrate in the actual image by excluding the actual image data of the portion corresponding to the non-circular portion of the substrate.

( 9 ) The step of calculating the correction parameter may include calculating the correction parameter by performing multiple regression analysis using the identified outer shape of the substrate and an equation representing the ellipse. According to this configuration, even if the substrate in the actual image is distorted, the correction parameters can be calculated with high accuracy.

( 10 ) The step of identifying the contour of the board in the real image may include identifying the contour of the board in the real image by filtering the acquired real image data. In this case, it is possible to easily specify the outline of the substrate in the actual image.

( 11 ) The board inspection method comprises: a board holding section and an imaging section so that the board moves in a second direction intersecting the first direction relative to an imaging section including a line sensor extending in the first direction; and generating actual image data by imaging the substrate held by the substrate holding unit with the imaging unit, wherein the step of acquiring the actual image data comprises imaging obtaining actual image data generated by the unit.

In this case, real image data can be easily generated by moving at least one of the substrate holding section and the imaging section at a predetermined pitch in the second direction by the moving section. Here, if the pixel size of the line sensor in the direction corresponding to the second direction does not match the movement pitch, the substrate in the actual image is distorted into an elliptical shape. Even in such a case, the corrected image based on the corrected image data shows a substantially circular substrate. As a result, the board can be inspected with high accuracy based on the corrected image data.

( 12 ) A substrate processing method according to a fourth aspect of the present invention comprises the steps of: forming a processing film on a substrate by a film forming section; and inspecting with.

According to this substrate processing method, the substrate on which the processing film has been formed by the film forming section is inspected by the substrate inspection method described above. As a result, the board can be inspected with high accuracy based on the corrected image data. In addition, there is no need to separately prepare a special substrate or jig for calculating correction parameters, and there is no need to set correction parameters in advance. Therefore, the time and cost required to generate corrected image data can be reduced.

According to the present invention, a substrate can be inspected with high accuracy based on image data.

1 is an external perspective view of a board inspection apparatus according to an embodiment of the present invention; FIG. FIG. 2 is a schematic side view showing the internal configuration of the substrate inspection apparatus of FIG. 1; FIG. 2 is a diagram showing an example of a real image of a board indicated by real image data generated by an imaging unit in FIG. 1; It is a block diagram which shows the functional structure of a board|substrate inspection apparatus. FIG. 5 is a flow chart showing inspection processing performed by the control unit in FIG. 4 ; FIG. FIG. 4 is a diagram for conceptually explaining a procedure for generating corrected image data in inspection processing; FIG. 4 is a diagram for conceptually explaining a procedure for generating corrected image data in inspection processing; FIG. 4 is a diagram for conceptually explaining a procedure for generating corrected image data in inspection processing; 3 is a schematic block diagram showing the overall configuration of a substrate processing apparatus including the substrate inspection apparatus of FIGS. 1 and 2; FIG.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A substrate inspection apparatus, a substrate processing apparatus, a substrate inspection method, and a substrate processing method according to embodiments of the present invention will be described below with reference to the drawings. In the following description, the substrate means a semiconductor substrate, a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, A photomask substrate, a ceramic substrate, a solar cell substrate, or the like.

The substrate used in this embodiment has an outer peripheral portion that is at least partially circular. Specifically, an orientation flat for positioning is formed on the substrate, and the peripheral portion of the substrate excluding the orientation flat has a circular shape. The diameter of the circular portion of the substrate is, for example, 200 mm. A notch may be formed in the substrate instead of the orientation flat.

(1) Configuration of Board Inspection Apparatus FIG. 1 is an external perspective view of a board inspection apparatus according to an embodiment of the present invention. FIG. 2 is a schematic side view showing the internal configuration of board inspection apparatus 200 in FIG. As shown in FIG. 1, the board inspection apparatus 200 includes a housing section 210, a light projecting section 220, a reflecting section 230, an imaging section 240, a board holding device 250, a moving section 260, a direction detecting section 270, and a control section 280. .

The light projecting section 220 , the reflecting section 230 , the imaging section 240 , the substrate holding device 250 , the moving section 260 and the direction detecting section 270 are housed inside the housing section 210 . The control unit 280 includes, for example, a CPU (Central Processing Unit) and memory or a microcomputer, and controls operations of the light projecting unit 220 , the imaging unit 240 , the substrate holding device 250 , the moving unit 260 and the direction detecting unit 270 .

The light projecting unit 220 includes, for example, one or a plurality of light sources, and emits belt-shaped light having a diameter larger than the substrate W obliquely downward. The light from light projecting section 220 has an elongated horizontal cross section extending in the X direction. Reflector 230 includes, for example, a mirror. The imaging unit 240 includes an imaging device such as a line sensor 241 in which a plurality of pixels are linearly arranged in the X direction, and one or more condenser lenses. In this example, a CCD (charge-coupled device) line sensor is used as the imaging device. A CMOS (Complementary Metal Oxide Semiconductor) line sensor may be used as the imaging element.

As shown in FIG. 2 , the substrate holding device 250 is, for example, a spin chuck, and includes a drive device 251 and a spin holder 252 . The driving device 251 is, for example, an electric motor and has a rotating shaft 253 . The rotation holding part 252 is attached to the tip of the rotation shaft 253 of the driving device 251, and is driven to rotate around the vertical axis while holding the substrate W to be inspected.

The moving part 260 includes a pair of guide members 261 and a moving holding part 262 . A pair of guide members 261 are provided so as to extend in the Y direction in parallel with each other. The Y direction is perpendicular to the X direction on the horizontal plane. The movable holding part 262 is configured to be movable in the Y direction along the pair of guide members 261 while holding the substrate holding device 250 . The substrate W passes below the light projecting unit 220 and the reflecting unit 230 by moving the moving holding unit 262 in the Y direction while the substrate holding device 250 holds the substrate W. As shown in FIG.

The direction detection unit 270 is, for example, a reflective photoelectric sensor including a light emitting element and a light receiving element, and emits light toward the outer periphery of the substrate W while the substrate W to be inspected is being rotated by the substrate holding device 250. At the same time, reflected light from the substrate W is received. The orientation detection unit 270 detects the orientation flat of the substrate W based on the amount of light reflected from the substrate W received. A transmissive photoelectric sensor may be used as the direction detection unit 270 .

An imaging operation of the substrate W in the substrate inspection apparatus 200 of FIG. 1 will be described. A slit-shaped opening 211 for transporting the substrate W is formed in a side portion of the housing portion 210 . A substrate W to be inspected is carried into the housing 210 through the opening 211 by the transport device 120 shown in FIG.

Subsequently, while the substrate W is rotated by the substrate holding device 250 , the direction detection section 270 emits light to the peripheral portion of the substrate W, and the direction detection section 270 receives the reflected light. Thereby, the orientation flat of the substrate W is detected and the orientation of the substrate W is determined. Based on the result of the determination, the substrate holding device 250 adjusts the rotational position of the substrate W so that the orientation flat of the substrate W faces a certain direction (one direction in the Y direction in this example).

Next, the substrate W is moved in one direction by the moving part 260 so as to pass below the light projecting part 220 while the light projecting part 220 emits a band of light obliquely downward. As a result, the entire surface of the substrate W is irradiated with the light from the light projecting section 220 . The light reflected by one surface of the substrate W is further reflected by the reflecting section 230 and guided to the imaging section 240 .

The imaging element of the imaging unit 240 sequentially images the one surface of the substrate W by receiving the light reflected from the one surface of the substrate W at a predetermined sampling period. Each pixel forming the image sensor outputs pixel data indicating a value corresponding to the amount of received light. Actual image data representing the entire image on one surface of the substrate W is generated based on the plurality of pixel data output from the imaging unit 240 . After that, the substrate W is returned to a predetermined position by the moving unit 260, and the substrate W is carried out of the housing unit 210 through the opening 211 by the transport device 120 shown in FIG. 9, which will be described later.

(2) Functions of Board Inspection Apparatus FIG. 3 is a diagram showing an example of a real image of the board W indicated by real image data generated by the imaging unit 240 of FIG. The position of each pixel of the actual image data is represented by a two-dimensional coordinate system unique to the device (hereinafter referred to as device coordinate system). In this embodiment, the apparatus coordinate system is an xy coordinate system having mutually orthogonal x and y axes. The positive x-direction is to the right and the positive y-direction is up. The origin of the apparatus coordinate system is set, for example, at a pixel in the center of the real image RI.

The x and y directions correspond to the X and Y directions in FIG. 1, respectively. As described above, in this example, the substrate W is imaged by the imaging unit 240 with the orientation flat OF directed in one direction in the Y direction. As a result, as shown in FIG. 3, real image data representing an actual image of the substrate W with the orientation flat OF facing downward in the y direction is generated.

When the pixel size of the imaging device of the imaging unit 240 in the y direction matches the movement pitch of the substrate W by the moving unit 260 in FIG. Actual image data shown is generated. The aspect ratio means the ratio between the dimension in the x direction and the dimension in the y direction. However, in practice, it is difficult to match the pixel size and the movement pitch of the substrate W due to the mounting accuracy of the components of the movement unit 260 and the like. Therefore, even if the outer peripheral portion of the substrate W excluding the orientation flat OF has a circular shape, the actual image of the substrate W represented by the generated actual image data has a substantially elliptical shape, as shown in FIG. Become. In such a case, the precision of the inspection of the substrate W based on the actual image data is lowered.

Further, in the present embodiment, the orientation flat OF is formed on the substrate W, and the aspect ratio of the substrate W is not 1:1. Therefore, image data representing an accurate image of the substrate W cannot be generated simply by stretching the actual image in the vertical or horizontal direction so that the aspect ratio of the substrate W in the actual image is 1:1. In this example, the diameter of the substrate is 200 mm, which is relatively small. In this case, the substrate W shown by the enlarged image will be less accurate. Therefore, the substrate inspection apparatus 200 generates corrected image data representing an accurate image of the substrate W as a corrected image by performing the following correction processing on the actual image data.

FIG. 4 is a block diagram showing a functional configuration of board inspection apparatus 200. As shown in FIG. As shown in FIG. 4, the board inspection apparatus 200 includes a data acquisition unit 1, an outer shape identification unit 2, a parameter calculation unit 3, a data correction unit 4, and an inspection unit 5 as functional units. The functional units of the substrate inspection apparatus 200 are implemented by, for example, the CPU of the control unit 280 executing a computer program stored in the memory. Some or all of the functional units of board inspection apparatus 200 may be realized by hardware such as electronic circuits.

The data acquisition unit 1 acquires from the imaging unit 240 real image data representing an actual image of the substrate W with the orientation flat OF directed in a specific direction. The outer shape identification unit 2 identifies the outer shape of the substrate W in the actual image based on the actual image data acquired by the data acquisition unit 1 . The specification of the outer shape of the substrate W in the actual image is performed by excluding the actual image data of the portion corresponding to the orientation flat OF of the substrate W. FIG. In this example, since the orientation flat OF is oriented in a specific direction in the actual image, it is easy to specify the outer shape of the substrate W in the actual image by excluding the actual image data of the portion corresponding to the orientation flat OF. become.

The parameter calculation unit 3 regards the outer shape of the substrate W in the actual image specified by the outer shape specifying unit 2 as an elliptical shape, and determines correction parameters for correcting the actual image data based on the major axis and minor axis of the elliptical shape. calculate. Note that the elliptical shape includes a circular shape. Therefore, when the pixel size of the imaging device of the imaging unit 240 in the y direction matches the movement pitch of the substrate W by the moving unit 260 in FIG. 1 in the Y direction, the outer shape of the substrate W is regarded as circular. will be

The data correction unit 4 corrects the real image data acquired by the data acquisition unit 1 based on the correction parameters calculated by the parameter calculation unit 3 so that the major axis and the minor axis of the outer shape of the substrate W in the real image become equal. By doing so, the corrected image data is generated.

The inspection unit 5 inspects the substrate W based on the corrected image data corrected by the data correction unit 4 . In this example, the presence or absence of defects in the substrate W to be inspected is determined using sample image data representing an image of a sample substrate having no defects in appearance. For example, a substrate that has been inspected in advance with high precision and that has been determined to have no defects in the inspection is used as a sample substrate. The sample image data may be acquired by the board inspection apparatus 200 or may be acquired by another apparatus. Design data generated in advance may also be used as the sample image data.

(3) Inspection Processing FIG. 5 is a flowchart showing inspection processing performed by the control unit 280 in FIG. The inspection process will be described below with reference to FIG. First, the data acquisition unit 1 acquires actual image data from the imaging unit 240 (step S1). Next, the outer shape identification unit 2 identifies the outer shape of the substrate W in the actual image acquired in step S1 (step S2).

Subsequently, the parameter calculator 3 regards the outer shape of the substrate W identified in step S2 as an elliptical shape, and calculates correction parameters based on the major axis and minor axis of the elliptical shape (step S3). After that, the data correction unit 4 corrects the actual image data acquired in step S1 so that the major axis and the minor axis of the outer shape of the substrate W in the actual image become equal based on the correction parameters calculated in step S3. to generate corrected image data (step S4).

Next, the inspection unit 5 compares the sample image data with the corrected image data generated in step S4 (step S5). Note that the inspection unit 5 may store the sample image data in advance, or may acquire the sample image data from a storage device or the like (not shown). Subsequently, the inspection unit 5 determines whether or not the deviation of the values of all pixels between the sample image data and the corrected image data is equal to or less than a predetermined threshold value (step S6).

When the deviation of the values of all pixels is equal to or less than the threshold value, the inspection unit 5 determines that the substrate W indicated by the corrected image is normal (step S7), and proceeds to step S9. On the other hand, if the value deviation of any pixel exceeds the threshold value, the inspection unit 5 determines that the substrate W indicated by the corrected image is abnormal (step S8), and proceeds to step S9.

In step S9, the inspection unit 5 determines whether or not all substrates W have been inspected (step S9). If all the substrates W have not been inspected, the inspection section 5 returns to step S1. Steps S1-S9 are repeated until all substrates W have been inspected. When all the substrates W have been inspected, the inspection section 5 ends the inspection process.

6 to 8 are diagrams for conceptually explaining the procedure for generating corrected image data in inspection processing. In step S2 of the inspection process in FIG. 5, filter processing such as a Sobel filter is performed on the actual image data. In this case, the absolute value of the pixels of the actual image data representing the outer peripheral portion (edge portion) of the substrate W increases. Also, as shown in FIG. 6, a plurality of (eight in this example) virtual lines L1 to L8 extending outward from the origin O of the apparatus coordinate system are set. For example, the virtual lines L1 to L8 are arranged at equal angular intervals (45 degree intervals) with respect to the origin O. FIG.

For each of the virtual lines L1 to L8, the coordinates of the position of the pixel whose absolute value is greater than or equal to a predetermined threshold value for the first time toward the origin O from the outside are detected. In the example of FIG. 6, coordinates of positions A1 to A8 are detected for virtual lines L1 to L8, respectively. The coordinates of the positions A1 to A8 are (x1, y1), (x2, y2), . . . and (x8, y8), respectively. The outer shape of the substrate W is specified by detecting the coordinates of the positions A1 to A8 of the plurality of peripheral portions of the substrate W corresponding to the plurality of virtual lines L1 to L8, respectively.

In the above example, eight imaginary lines L1 to L8 are arranged at intervals of 45 degrees when specifying the outer shape of the substrate W, but the present invention is not limited to this. Seven or less virtual lines L1 to L8 may be arranged, or nine or more virtual lines may be arranged. When a larger number of virtual lines are arranged at smaller angular intervals, the outer shape of the substrate W can be specified with higher accuracy.

The outer shape of the substrate W specified in this way is regarded as an elliptical shape by the parameter calculator 3, and the following step S3 is executed. As described above, the orientation flat OF of the substrate W faces downward in the actual image. Accordingly, the position A5 detected with respect to the virtual line L5 extending downward from the origin O corresponds to the position of the orientation flat OF of the substrate W. FIG. Therefore, in this example, the outer shape of the substrate W is specified by excluding the position A5 and detecting the positions A1 to A4 and A6 to A8. This makes it easier to regard the outer shape of the substrate W in the actual image as an elliptical shape.

In step S3 of the inspection process in FIG. 5, correction parameters are calculated by performing multiple regression analysis using the elliptical outer shape of the substrate W specified in step S2 and the equation representing the ellipse. Specifically, the equation representing the ellipse is represented by the following formula (1). In equation (1), x and y are coordinates in the x and y directions, respectively, in the device coordinate system. a and b are the major and minor axes of the ellipse, respectively. O _x and O _y are the x- and y-direction coordinates of the center of the ellipse, respectively.

In the example of FIG. 7 , the major axis a is the major axis along the x direction and the minor axis b is the minor axis along the y direction. The major axis a may be the minor axis along the x direction, and the minor axis b may be the major axis along the y direction. Also, in the example of FIG. 7 , the coordinates (O _x , O _y ) of the center of the ellipse are located at the origin of the device coordinate system, but they do not have to be located at the origin of the device coordinate system.

Next, assuming that the ratio of the minor axis b to the major axis a is k, as shown in the following formula (2), the formula (1) is transformed into a polynomial expressed by the following formula (3). In equation (3), coefficients K ₁ , K ₂ , K ₃ and K ₄ are represented by equations (4), (5), (6) and (7) below, respectively.

Subsequently, the coordinates (x1, y1), (x2, y2), . ). Further, the coefficients K ₁ to K ₄ in the equations (4) to (7) are obtained by multiple regression analysis using x ² as the objective variable and x, y ² and y as the explanatory variables. According to this method, the coefficients K ₁ to K ₄ can be obtained with high accuracy even if the substrate W in the actual image is distorted. Based on the coefficients K ₁ to K ₄ , the major axis a of the ellipse is obtained by the following formula (8). The minor axis b of the ellipse is obtained by Equation (2). Also, the magnification k is obtained by the following formula (9).

After that, using the calculated magnification k as a correction parameter, the actual image data is corrected so that the major axis a and the minor axis b become equal. As a result, corrected image data representing the corrected image CI is generated as shown in FIG. In the example of FIG. 8, the actual image data is corrected so that the minor axis b in the y direction becomes equal to the major axis a, but the actual image data is corrected so that the major axis a in the x direction becomes equal to the minor axis b. may be

(4) Substrate Processing Apparatus FIG. 9 is a schematic block diagram showing the overall configuration of a substrate processing apparatus including the substrate inspection apparatus 200 of FIGS. 1 and 2. As shown in FIG. As shown in FIG. 9, the substrate processing apparatus 100 is provided adjacent to an exposure apparatus 300 and includes a substrate inspection apparatus 200, a control apparatus 110, a transport apparatus 120, a film forming section 130, a developing section 140 and a thermal processing section. 150.

The control device 110 includes, for example, a CPU and memory or a microcomputer, and controls the operations of the conveying device 120 , the film forming section 130 , the developing section 140 and the thermal processing section 150 . Further, the control device 110 gives a command for inspecting the substrate W to the control section 280 of FIG.

The transport device 120 transports the substrate W between the film forming section 130 , the developing section 140 , the thermal processing section 150 , the substrate inspection device 200 and the exposure device 300 . The film forming section 130 forms a resist film on the surface of the substrate W by coating the surface of the substrate W with a resist liquid (film forming process). After the film forming process, the substrate W is subjected to an exposure process in the exposure device 300 . The developing unit 140 develops the substrate W by supplying a developer to the substrate W after the exposure processing by the exposure device 300 . The thermal processing section 150 thermally processes the substrate W before and after the film formation processing by the film forming section 130 , the development processing by the development section 140 , and the exposure processing by the exposure device 300 .

The substrate inspection apparatus 200 inspects the substrate W on which the resist film is formed by the film forming unit 130 . For example, the substrate inspection apparatus 200 inspects the substrate W after the film forming process by the film forming section 130 and the developing process by the developing section 140 . Alternatively, the substrate inspection apparatus 200 may inspect the substrate W after the film forming process by the film forming section 130 and before the exposure process by the exposure apparatus 300 . Further, the substrate inspection apparatus 200 may inspect the substrate W after the film forming process by the film forming section 130 , after the exposure process by the exposure apparatus 300 , and before the development process by the developing section 140 .

A processing unit for forming an antireflection film on the substrate W may be provided in the film forming section 130 . In this case, the thermal processing section 150 may perform an adhesion strengthening process for improving the adhesion between the substrate W and the antireflection film. Further, a processing unit for forming a resist cover film for protecting the resist film formed on the substrate W may be provided in the film forming section 130 .

When an antireflection film and a resist cover film are formed on one surface of the substrate W, the substrate W may be inspected by the substrate inspection apparatus 200 after the formation of each film. In the substrate processing apparatus 100 according to the present embodiment, the substrate W on which a film such as a resist film, an antireflection film, or a resist cover film is formed is inspected by the substrate inspection apparatus 200 with high reliability.

In this example, the substrate inspection apparatus 200 is provided in the substrate processing apparatus 100 that processes the substrate W before and after the exposure processing, but the substrate inspection apparatus 200 may be provided in another substrate processing apparatus. For example, the substrate inspection apparatus 200 may be provided in a substrate processing apparatus that performs a cleaning process on the substrate W, or the substrate inspection apparatus 200 may be provided in a substrate processing apparatus that performs an etching process on the substrate W. Alternatively, board inspection apparatus 200 may be used alone.

(5) Effect In the substrate processing apparatus 100 according to the present embodiment, the substrate W is held by the substrate holding device 250, and the substrate holding device 250 is moved in the Y direction at a predetermined pitch by the moving unit 260. Actual image data is generated by the imaging unit 240 . Here, if the pixel size of the line sensor 241 in the y direction corresponding to the Y direction does not match the movement pitch of the substrate holding device 250, the substrate W in the actual image RI will be elliptically distorted.

Even in such a case, the data acquisition unit 1 acquires the actual image data in the substrate inspection apparatus 200 . The outer shape of the substrate W in the real image RI is specified by the outer shape specifying unit 2 based on the acquired real image data. The outer shape of the substrate W in the specified actual image RI is regarded as an elliptical shape, and the correction parameter is calculated by the parameter calculator 3 based on the major axis and the minor axis of the elliptical shape. Based on the calculated correction parameters, the image data is corrected as corrected image data by the data correction unit 4 so that the major axis and the minor axis of the outer shape of the substrate W in the actual image RI become equal. The substrate W is inspected by the inspection unit 5 based on the corrected image data.

According to this configuration, even when the substrate W in the actual image RI is distorted in an elliptical shape, the corrected image data is obtained by correcting the actual image data using the correction parameters based on the major axis and the minor axis of the elliptical shape. is generated. In the corrected image CI based on the corrected image data, the substantially circular substrate W is shown. As a result, the substrate W can be inspected with high accuracy based on the corrected image data. In addition, there is no need to separately prepare a special substrate or jig for calculating correction parameters, and there is no need to set correction parameters in advance. Therefore, the time and cost required to generate corrected image data can be reduced.

(6) Other Embodiments (a) In the above embodiments, the substrate W on which the orientation flat OF for positioning is formed is inspected by the substrate inspection apparatus 200, but the present invention is not limited to this. Instead of the orientation flat OF, a substrate W having a notch for positioning may be inspected by the substrate inspection apparatus 200 . Alternatively, a circular substrate W on which the orientation flat OF and the notch are not formed may be inspected by the substrate inspection apparatus 200 .

(b) In the above embodiment, the appearance inspection of the substrate W is performed as the inspection of the substrate W, but the present invention is not limited to this. Other inspections may be performed as substrate W inspections. For example, based on the corrected image data, it may be inspected whether or not the distance (edge width) between the outer peripheral portion of the substrate W and the outer peripheral portion of the film formed on the substrate W is appropriate. . In this case, the edge width can be detected appropriately by using the corrected image data. As a result, it is possible to improve the accuracy of determining whether the edge width is appropriate.

(c) In the above embodiment, the imaging unit 240 captures an image of the substrate W in a state in which the rotational position of the substrate W is adjusted by the substrate holding device 250 so that the orientation flat OF faces a certain direction. The invention is not so limited. The substrate W may be imaged by the imaging unit 240 with the orientation flat OF facing in any direction. In this case, the outer shape specifying unit 2 performs image processing on the actual image data to specify the outer shape of the substrate W in the actual image by excluding the actual image data of the portion corresponding to the orientation flat OF of the substrate W. .

(7) Correspondence between each constituent element of the claims and each element of the embodiment An example of correspondence between each constituent element of the claim and each element of the embodiment will be described below. Examples are not limiting. Various other elements having the structure or function described in the claims can be used as each component of the claims.

In the above embodiments, the substrate W is an example of a substrate, the substrate holding device 250 is an example of a substrate holding unit, the actual image RI is an example of an actual image, and the data acquisition unit 1 is an example of a data acquisition unit. is. The outline identification unit 2 is an example of an outline identification unit, the parameter calculation unit 3 is an example of a parameter calculation unit, the corrected image CI is an example of a corrected image, the data correction unit 4 is an example of a data correction unit, The inspection unit 5 is an example of an inspection unit.

The board inspection apparatus 200 is an example of a board inspection apparatus, the orientation flat OF is an example of a non-circular portion, and the X direction and Y direction are examples of first and second directions, respectively. The line sensor 241 is an example of a line sensor, the imaging unit 240 is an example of an imaging unit, the moving unit 260 is an example of a moving unit, the film forming unit 130 is an example of a film forming unit, and the substrate processing apparatus 100 is an example of a substrate processing apparatus.
(8) Reference form
(8-1) A board inspection apparatus according to a first embodiment includes a board holding section that holds a board to be inspected having at least a partially circular outer peripheral portion, and an image of the board held by the board holding section. as an actual image; an outline specifying unit for specifying the outline of the board in the actual image based on the real image data acquired by the data acquiring unit; The outer shape of the substrate in the actual image is regarded as an ellipse, and a parameter calculation unit calculates a correction parameter for correcting the actual image data based on the major axis and minor axis of the ellipse, and a data correction unit that corrects the actual image data acquired by the data acquisition unit as corrected image data so that the major axis and the minor axis of the outer shape of the substrate in the actual image are equal based on the correction parameters; an inspection unit that inspects the board based on the corrected image data.
In this substrate inspection apparatus, a substrate to be inspected, which has an outer peripheral portion that is at least partially circular, is held by the substrate holding portion. Actual image data representing an image of the substrate held by the substrate holding unit is acquired. The outer shape of the substrate in the real image is specified based on the acquired real image data. The outer shape of the substrate in the specified real image is regarded as an ellipse, and correction parameters for correcting the real image data are calculated based on the major axis and minor axis of the ellipse. Based on the calculated correction parameters, the acquired real image data is corrected as corrected image data so that the major axis and the minor axis of the outer shape of the substrate in the real image become equal. The board is inspected based on the corrected corrected image data.
According to this configuration, even when the substrate in the actual image is distorted into an elliptical shape, corrected image data is generated by correcting the actual image data using the correction parameters based on the major axis and minor axis of the elliptical shape. be done. A substantially circular substrate is shown in the corrected image based on the corrected image data. As a result, the board can be inspected with high accuracy based on the corrected image data. In addition, there is no need to separately prepare a special substrate or jig for calculating correction parameters, and there is no need to set correction parameters in advance. Therefore, the time and cost required to generate corrected image data can be reduced.
(8-2) The board to be inspected has a non-circular portion for indicating the orientation of the board, and the outer shape specifying section excludes the actual image data of the portion corresponding to the non-circular portion of the board. The outline of the substrate in the real image may be specified. According to this configuration, even if the substrate to be inspected has a non-circular portion, it becomes easy to regard the external shape of the substrate in the actual image as an elliptical shape. This makes it possible to easily calculate the correction parameters.
(8-3) The substrate holding unit holds the substrate such that the non-circular portion of the substrate faces a predetermined direction, and the data acquisition unit causes the non-circular portion to face the predetermined direction. actual image data representing the actual image of the substrate may be acquired. In this case, it becomes easy to specify the outer shape of the substrate in the actual image by excluding the actual image data of the portion corresponding to the non-circular portion of the substrate.
(8-4) The parameter calculation unit may calculate the correction parameters by performing multiple regression analysis using the outer shape of the substrate specified by the outer shape specifying unit and the equation representing the ellipse. According to this configuration, even if the substrate in the actual image is distorted, the correction parameters can be calculated with high accuracy.
(8-5) The outer shape specifying unit may specify the outer shape of the substrate in the actual image by filtering the actual image data acquired by the data acquiring unit. In this case, it is possible to easily specify the outline of the substrate in the actual image.
(8-6) The board inspection apparatus includes an imaging section that generates actual image data by capturing an image of a board held by a board holding section with a line sensor extending in a first direction, and a board held by the board holding section. a moving unit that moves at least one of the substrate holding unit and the imaging unit so that the is moved in a second direction that intersects the first direction relative to the imaging unit; You may acquire the real image data produced|generated by the part.
In this case, real image data can be easily generated by moving at least one of the substrate holding section and the imaging section at a predetermined pitch in the second direction by the moving section. Here, if the pixel size of the line sensor in the direction corresponding to the second direction does not match the movement pitch, the substrate in the actual image is distorted into an elliptical shape. Even in such a case, the corrected image based on the corrected image data shows a substantially circular substrate. As a result, the board can be inspected with high accuracy based on the corrected image data.
(8-7) A substrate processing apparatus according to a second embodiment includes a film forming unit that forms a processing film on a substrate, and a substrate processing apparatus that inspects the substrate after the processing film is formed by the film forming unit. and a substrate inspection device according to
In this substrate processing apparatus, the substrate on which the processing film has been formed by the film forming section is inspected by the substrate inspection apparatus. As a result, the board can be inspected with high accuracy based on the corrected image data. In addition, there is no need to separately prepare a special substrate or jig for calculating correction parameters, and there is no need to set correction parameters in advance. Therefore, the time and cost required to generate corrected image data can be reduced.
(8-8) A substrate inspection method according to a third embodiment includes the steps of: holding a substrate to be inspected having at least a partially circular outer peripheral portion by a substrate holding portion; acquiring real image data showing the image as an actual image; specifying the outline of the board in the real image based on the acquired real image data; and making the outline of the board in the specified real image an elliptical calculating a correction parameter for correcting the actual image data based on the major axis and the minor axis of the elliptical shape; and correcting the acquired actual image data as corrected image data, and inspecting the board based on the corrected corrected image data.
According to this board inspection method, even if the board in the actual image is elliptically distorted, the board can be inspected with high accuracy based on the corrected image data. In addition, there is no need to separately prepare a special substrate or jig for calculating correction parameters, and there is no need to set correction parameters in advance. Therefore, the time and cost required to generate corrected image data can be reduced.
(8-9) The substrate to be inspected has a non-circular portion for indicating the orientation of the substrate, and the step of specifying the outer shape of the substrate in the actual image includes the portion corresponding to the non-circular portion of the substrate. It may include excluding the real image data to identify the contour of the substrate in the real image. According to this configuration, even if the substrate to be inspected has a non-circular portion, it becomes easy to regard the external shape of the substrate in the actual image as an elliptical shape. This makes it possible to easily calculate the correction parameters.
(8-10) The step of holding the substrate to be inspected by the substrate holding portion includes holding the substrate by the substrate holding portion so that the non-circular portion of the substrate faces a predetermined direction, and Determining the outer shape of the board involves obtaining real image data representing a real image of the board with the non-circular part oriented in a predetermined direction, thereby obtaining real image data of the part corresponding to the non-circular part of the board. It may include excluding the image data to identify the contour of the substrate in the actual image. In this case, it becomes easy to specify the outer shape of the substrate in the actual image by excluding the actual image data of the portion corresponding to the non-circular portion of the substrate.
(8-11) The step of calculating the correction parameter may include calculating the correction parameter by performing multiple regression analysis using the identified outer shape of the substrate and an equation representing the ellipse. According to this configuration, even if the substrate in the actual image is distorted, the correction parameters can be calculated with high accuracy.
(8-12) The step of identifying the contour of the board in the real image may include identifying the contour of the board in the real image by filtering the acquired real image data. In this case, it is possible to easily specify the outline of the substrate in the actual image.
(8-13) The board inspection method includes: a board holding section and a the step of moving at least one of the imaging units by the moving unit; and the step of generating actual image data by capturing an image of the substrate held by the substrate holding unit by the imaging unit, wherein the step of acquiring the actual image data is , acquiring real image data generated by the imaging unit.
In this case, real image data can be easily generated by moving at least one of the substrate holding section and the imaging section at a predetermined pitch in the second direction by the moving section. Here, if the pixel size of the line sensor in the direction corresponding to the second direction does not match the movement pitch, the substrate in the actual image is distorted into an elliptical shape. Even in such a case, the corrected image based on the corrected image data shows a substantially circular substrate. As a result, the board can be inspected with high accuracy based on the corrected image data.
(8-14) A substrate processing method according to a fourth embodiment includes the steps of: forming a processing film on a substrate by a film forming unit; and a step of inspecting by such a board inspection method.
According to this substrate processing method, the substrate on which the processing film has been formed by the film forming section is inspected by the substrate inspection method described above. As a result, the board can be inspected with high accuracy based on the corrected image data. In addition, there is no need to separately prepare a special substrate or jig for calculating correction parameters, and there is no need to set correction parameters in advance. Therefore, the time and cost required to generate corrected image data can be reduced.

DESCRIPTION OF SYMBOLS 1... Data acquisition part 2... Outline specification part 3... Parameter calculation part 4... Data correction part 5... Inspection part 100... Substrate processing apparatus 110... Control apparatus 120... Transfer apparatus 130... Coating process part , 140...Development processing unit 150...Heat treatment unit 200...Board inspection device 210...Case part 211...Opening part 220...Light projecting part 230...Reflection part 240...Image pickup part 241...Line sensor, DESCRIPTION OF SYMBOLS 250... Substrate holding|maintenance apparatus, 251... Drive device, 252... Rotation holding|maintenance part, 253... Rotating shaft, 260... Moving part, 261... Guide member, 262... Movement holding part, 270... Direction detection part, 280... Control part, 300 Exposure device A1 to A8 Position CI Corrected image L1 to L8 Virtual line OF Orientation flat RI Real image W Substrate

Claims (12)

a substrate holder for holding a substrate to be inspected, the outer peripheral portion of which is at least partially circular;
a data acquisition unit that acquires actual image data representing an image of the substrate held by the substrate holding unit as an actual image;
an outline identification unit that identifies the outline of the substrate in the actual image based on the actual image data acquired by the data acquisition unit;
a parameter calculation unit that regards the outer shape of the substrate in the actual image specified by the outer shape specifying unit as an elliptical shape, and calculates a correction parameter for correcting the actual image data based on the major axis and minor axis of the elliptical shape;
Data correction for correcting the actual image data acquired by the data acquiring unit as corrected image data so that the major axis and the minor axis of the outer shape of the substrate in the actual image are equal based on the correction parameters calculated by the parameter calculating unit. Department and
an inspection unit that inspects the substrate based on the corrected image data corrected by the data correction unit;
the substrate under test has a non-circular portion to indicate the orientation of the substrate;
The outer shape specifying unit
setting a plurality of virtual lines extending outward from a predetermined origin in the real image data;
For each of the plurality of virtual lines, detecting the position of a pixel whose absolute value is greater than or equal to a predetermined threshold value for the first time from the outside toward the origin;
excluding from the detected positions a detected position for a virtual line extending from the origin toward the non-circular portion;
Based on a plurality of positions other than the excluded positions, specifying the outer shape of the substrate in the real image in which the real image data of the portion corresponding to the non-circular portion of the substrate is excluded;
The parameter calculation unit
Based on the outer shape of the substrate specified by the outer shape specifying unit and the equation representing the ellipse, the major axis and minor axis of the elliptical outer shape of the substrate in the actual image are calculated, and the distance between the major axis and the minor axis is calculated. A board inspection apparatus, wherein a magnification is calculated as the correction parameter. the substrate holding part holds the substrate so that the non-circular portion of the substrate faces a predetermined direction;
2. The board inspection apparatus according to claim 1, wherein said data acquisition unit acquires real image data representing a real image of the board with said non-circular portion facing in said predetermined direction. 3. The board inspection apparatus according to claim 1, wherein said parameter calculator calculates a correction parameter by performing multiple regression analysis using the outer shape of the board specified by said outer shape specifying unit and an equation representing an ellipse. . 4. The board inspection apparatus according to claim 1, wherein said outline identifying section identifies the outline of the board in the actual image by filtering the actual image data acquired by said data acquiring section. . an imaging unit configured to generate actual image data by capturing an image of the substrate held by the substrate holding unit with a line sensor extending in a first direction;
At least one of the substrate holding unit and the imaging unit is moved such that the substrate held by the substrate holding unit moves relative to the imaging unit in a second direction crossing the first direction. further comprising a moving part,
5. The substrate inspection apparatus according to claim 1, wherein said data acquiring section acquires actual image data generated by said imaging section. a film forming unit for forming a processing film on a substrate;
A substrate processing apparatus comprising the substrate inspection apparatus according to any one of claims 1 to 5, which inspects a substrate on which a processing film has been formed by the film forming unit. a step of holding a substrate to be inspected, which has an outer peripheral portion at least partially circular, by a substrate holding part;
a step of obtaining actual image data representing an image of the substrate held by the substrate holding unit as an actual image;
identifying the outer shape of the substrate in the real image based on the acquired real image data;
regarding the external shape of the substrate in the specified real image as an elliptical shape, and calculating a correction parameter for correcting the real image data based on the major axis and the minor axis of the elliptical shape;
a step of correcting the acquired real image data as corrected image data so that the major axis and the minor axis of the outer shape of the substrate in the real image are equal based on the calculated correction parameter;
inspecting the substrate based on the corrected corrected image data;
the substrate under test has a non-circular portion to indicate the orientation of the substrate;
The step of identifying the contour of the substrate includes:
setting a plurality of virtual lines extending outward from a predetermined origin in the real image data;
For each of the plurality of virtual lines, detecting the position of a pixel whose absolute value is greater than or equal to a predetermined threshold value for the first time toward the origin from the outside;
excluding from the detected positions a detected position for a virtual line extending from the origin toward the non-circular portion;
Based on a plurality of positions other than the excluded positions, specifying the outer shape of the substrate in the real image in which the real image data of the portion corresponding to the non-circular portion of the substrate is excluded;
The step of calculating the correction parameter includes:
Calculating the major axis and the minor axis of the elliptical outer shape of the substrate in the real image based on the specified outer shape of the substrate and the equation representing the ellipse;
A board inspection method, comprising calculating a magnification of the major axis and the minor axis as the correction parameter. The step of holding the substrate to be inspected by the substrate holding portion includes holding the substrate by the substrate holding portion such that the non-circular portion of the substrate faces a predetermined direction;
Specifying the outer shape of the substrate in the actual image includes acquiring real image data representing an actual image of the substrate in which the non-circular portion is oriented in the predetermined direction. 8. The board inspection method according to claim 7, further comprising specifying the outline of the board in the real image by excluding the real image data of the part corresponding to the part. 9. The board inspection according to claim 7, wherein the step of calculating the correction parameter includes calculating the correction parameter by performing multiple regression analysis using the identified outer shape of the board and an equation representing an ellipse. Method. 10. The method according to any one of claims 7 to 9, wherein the step of identifying the outer shape of the board in the real image includes identifying the outer shape of the board in the real image by performing filtering on the acquired real image data. The substrate inspection method described. At least one of the substrate holding section and the imaging section is moved so that the substrate moves in a second direction crossing the first direction relative to the imaging section including a line sensor extending in the first direction. moving by the unit;
generating actual image data by imaging the substrate held by the substrate holding unit by the imaging unit;
The board inspection method according to any one of claims 7 to 10, wherein the step of obtaining the actual image data includes obtaining the actual image data generated by the imaging section. forming a treatment film on the substrate by a film forming unit;
12. A substrate processing method, comprising: inspecting the substrate on which the processing film is formed by the film forming unit by the substrate inspection method according to any one of claims 7 to 11.

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