TW202009478A - Substrate inspection device, substrate processing apparatus, substrate inspection method and substrate processing method - Google Patents

Abstract

In this invention, a data acquisition unit acquires real image data representing, as a real image, an image of a substrate to be inspected that has an at least partially circular outer peripheral part. A shape specification unit specifies the shape of the substrate in the real image on the basis of the acquired real image data. Taking the specified shape of the substrate in the real image to be an ellipse, a parameter calculation unit calculates a correction parameter for correcting the real image data on the basis of the major axis and minor axis of the ellipse. A data correction unit produces corrected image data by using the calculated correction parameter to correct the acquired real image data such that the major axis and minor axis of the shape of the substrate in the real image become equal. An inspection unit inspects the substrate on the basis of the corrected image data produced through correction.

Description

Substrate inspection device, substrate processing device, substrate inspection method and substrate processing method

The present invention relates to a substrate inspection device, a substrate processing device, a substrate inspection method, and a substrate processing method that perform substrate inspection.

Inspect the substrate during various processing steps on the substrate. For example, in the substrate inspection device described in Patent Document 1, the strip light that is larger than the diameter of the substrate in one direction is emitted downward from the light projecting portion. In this state, the substrate to be inspected moves in the other direction orthogonal to one direction so as to pass under the light-emitting portion. By this, the strip light is sequentially irradiated to each part of the substrate. Thereafter, the band-shaped light is sequentially reflected by each part of the substrate, and is received by the light-receiving part. Based on the amount of light received by the light-receiving portion, image data showing the image of the entire surface of the substrate is generated. Check the substrate based on the generated image data.

[Patent Document 1] Japanese Patent Laid-Open No. 2018-36235

[Problems to be solved by the invention]

In Patent Document 1, when the pixel size of the light-receiving portion corresponding to the moving direction of the substrate coincides with the moving pitch of the substrate, image data showing the image of the substrate in the correct aspect ratio is generated. However, in practice, it is difficult to match the pixel size with the moving distance of the substrate due to the mounting accuracy of the moving mechanism of the substrate. Therefore, no image data for displaying the substrate image with the correct aspect ratio is generated, and in the case where the substrate has a perfect circular shape, the substrate image displayed by the image data also has an elliptical shape. In this case, the inspection accuracy of the substrate based on the image data decreases.

An object of the present invention is to provide a substrate inspection device, a substrate processing device, a substrate inspection method, and a substrate processing method that can inspect a substrate with high accuracy based on image data. [Technical means to solve the problem]

(1) A substrate inspection apparatus according to an aspect of the present invention includes: a substrate holding portion that holds at least a part of a substrate to be inspected with a circular outer periphery; and a data acquisition portion that acquires a substrate to be held by the substrate holding portion The actual image data that the image is displayed as the actual image; the shape specific part, which specifies the shape of the substrate in the actual image based on the actual image data obtained by the data acquisition part; the parameter calculation part, which will be determined by the shape specific part The outline of the substrate in the specified actual image is regarded as an ellipse shape, and a correction parameter for correcting the actual image data based on the long and short diameters of the ellipse shape is calculated; the data correction section is based on the calculation by the parameter calculation section The correction parameter is to correct the actual image data obtained by the data acquisition section as the corrected image data in such a way that the long and short diameters of the substrate outline in the actual image become equal; and the inspection section, which is based on the data correction section Correct the corrected image data and check the board.

In this substrate inspection apparatus, at least a part of a substrate to be inspected having a circular outer periphery is held by a substrate holding portion. Obtain actual image data that displays the substrate image held by the substrate holding portion as an actual image. Based on the actual image data obtained, the outline of the substrate in the actual image is specified. The outline of the substrate in the specified actual image is regarded as an ellipse shape, and a correction parameter for correcting the actual image data based on the long and short diameters of the ellipse shape is calculated. Based on the calculated correction parameters, the actual image data obtained is corrected as corrected image data in such a way that the long and short diameters of the substrate outline in the actual image become equal. The substrate is inspected based on the corrected corrected image data.

According to this configuration, when the substrate is deformed into an ellipse shape in the actual image, the corrected image data is generated by correcting the actual image data using the correction parameters based on the long and short diameters of the ellipse shape. In the corrected image based on the corrected image data, a substrate with a substantially perfect circular shape is displayed. With this, the substrate can be inspected with higher accuracy based on the corrected image data. In addition, there is no need to separately prepare special substrates or jigs for calculating correction parameters, and it is not necessary to set correction parameters in advance. Therefore, the time and cost required for generating the corrected image data can be reduced.

(2) The substrate to be inspected may also have a non-circular part to indicate the direction of the substrate. The external shape specific part excludes the actual image data of the part corresponding to the non-circular part of the substrate, and specifies the actual figure. The shape of the substrate in the image. According to this configuration, when the substrate to be inspected has a non-circular portion, it is easy to regard the outline of the substrate in the actual image as an elliptical shape. With this, the correction parameter can be easily calculated.

(3) The substrate holding portion may hold the substrate with the non-circular portion of the substrate facing a predetermined direction, and the data acquisition portion may acquire actual image data showing the actual image of the substrate indicating the state of the non-circular portion facing the predetermined direction . In this case, it is easy to exclude the actual image data of the portion of the substrate corresponding to the non-circular shape, and specify the outline of the substrate in the actual image.

(4) The parameter calculation unit may also calculate the correction parameters by performing multiple regression analysis using the substrate outline specified by the outline specifying section and the equation representing the ellipse. According to this configuration, even if the substrate is deformed in the actual image, the correction parameter can be calculated with high accuracy.

(5) The shape specifying unit may also specify the shape of the substrate in the actual image by performing filtering processing on the actual image data obtained by the data obtaining unit. In this case, the outline of the substrate in the actual image can be easily specified.

(6) The substrate inspection device may also include: an imaging unit that generates actual image data by photographing the substrate held by the substrate holding unit by a line sensor extending in the first direction; and a moving unit that uses the substrate The substrate held by the holding section moves at least one of the substrate holding section and the imaging section so that the imaging section moves relatively in the second direction crossing the first direction; and the data acquisition section obtains the actual image generated by the imaging section data.

In this case, it is possible to easily generate actual image data by moving at least one of the substrate holding portion and the imaging portion along the second direction at a specific pitch using the moving portion. Here, when the pixel size of the line sensor in the direction corresponding to the second direction does not match the above-mentioned moving pitch, the substrate in the actual image is deformed into an ellipse shape. In this case, the corrected image based on the corrected image data also displays a substrate with a substantially perfect circular shape. With this, the substrate can be inspected with higher accuracy based on the corrected image data.

(7) A substrate processing apparatus of another aspect of the present invention includes: a film forming section that forms a processing film on the substrate; and a substrate inspection apparatus according to one aspect of the present invention, which forms a processing film from the film forming section Subsequent substrate inspection.

In this substrate processing apparatus, the substrate after the processing film is formed by the film forming section is inspected by the above substrate inspection apparatus. With this, the substrate can be inspected with higher accuracy based on the corrected image data. In addition, there is no need to separately prepare special substrates or jigs for calculating correction parameters, and it is not necessary to set correction parameters in advance. Therefore, the time and cost required for generating the corrected image data can be reduced.

(8) In yet another aspect of the present invention, a substrate inspection method includes: a step of holding at least a part of a substrate with a circular outer periphery by a substrate holding portion; acquiring an image of the substrate held by the substrate holding portion as The steps of displaying the actual image data of the actual image; the step of specifying the outline of the substrate in the actual image based on the obtained actual image data; taking the outline of the substrate in the specified actual image as an elliptical shape and calculating Steps for correcting the correction parameters of the actual image data based on the long and short diameters of the ellipse shape; based on the calculated correction parameters, the long and short diameters of the substrate outline in the actual image will be equal to each other to obtain The step of correcting the actual image data as the correction image data; and the step of checking the substrate based on the corrected correction image data.

According to the substrate inspection method, when the substrate in the actual image is deformed into an elliptical shape, the substrate can also be inspected with higher accuracy based on the corrected image data. In addition, there is no need to separately prepare special substrates or jigs for calculating correction parameters, and it is not necessary to set correction parameters in advance. Therefore, the time and cost required for generating the corrected image data can be reduced.

(9) The substrate to be inspected may also have a non-circular portion to indicate the direction of the substrate, and the step of specifying the shape of the substrate in the actual image may include the portion of the substrate corresponding to the non-circular portion Except the actual image data, and the situation of the substrate shape in the actual image is specified. According to this configuration, even when the substrate to be inspected has a non-circular portion, the outer shape of the substrate in the actual image is easily regarded as an elliptical shape. With this, the correction parameter can be easily calculated.

(10) The step of holding the substrate to be inspected by the substrate holding portion may include: holding the substrate by the substrate holding portion with the non-circular portion of the substrate facing a predetermined direction; specifying the outline of the substrate in the actual image includes : By obtaining the actual image data of the actual image of the substrate showing the state where the non-circular shape portion is facing the predetermined direction, the actual image data of the portion of the substrate corresponding to the non-circular shape portion is excluded, and the actual image is specified The outline of the substrate. In this case, it is easy to exclude the actual image data of the portion corresponding to the non-circular shape of the substrate, and to specify the outline of the substrate in the actual image.

(11) The step of calculating the correction parameter may include calculating the correction parameter by performing multiple regression analysis using a specific substrate shape and an equation representing an ellipse. According to this configuration, even if the substrate of the actual image is deformed, the correction parameter can be calculated with high accuracy.

(12) The step of specifying the outline of the substrate in the actual image may include: specifying the outline of the substrate of the actual image by performing filtering processing on the obtained actual image data. In this case, the outline of the substrate in the actual image can be easily specified.

(13) The substrate inspection method may further include: moving the imaging unit including the line sensor extending in the first direction relative to the second direction crossing the first direction in a manner that the substrate moves relative to the second direction The step of moving at least one of the substrate holding part and the imaging part; and the step of generating actual image data by imaging the substrate held by the substrate holding part by the imaging part; and the step of obtaining the actual image data includes obtaining the generation by the imaging part Actual image data.

In this case, it is possible to easily generate actual image data by moving at least one of the substrate holding portion and the imaging portion along the second direction at a specific pitch using the moving portion. Here, when the pixel size of the line sensor in the direction corresponding to the second direction does not match the above moving pitch, the substrate in the actual image is deformed into an ellipse shape. In this case, the corrected image based on the corrected image data also displays a substrate with a substantially perfect circular shape. With this, the substrate can be inspected with higher accuracy based on the corrected image data.

(14) The substrate processing method of still another aspect of the present invention includes the steps of forming a processing film on the substrate by the film forming portion; and forming the processing film by the film forming portion by the substrate inspection method of another aspect of the present invention After the substrate inspection step.

According to this substrate processing method, the substrate after the processing film is formed by the film forming portion is inspected by the above substrate inspection method. With this, the substrate can be inspected with higher accuracy based on the corrected image data. In addition, there is no need to separately prepare special substrates or jigs for calculating correction parameters, and it is not necessary to set correction parameters in advance. Therefore, the time and cost required for generating the corrected image data can be reduced. [Effect of invention]

According to the present invention, the substrate can be inspected with higher accuracy based on the image data.

Hereinafter, the substrate inspection apparatus, the substrate processing apparatus, the substrate inspection method, and the substrate processing method according to the embodiments of the present invention will be described using drawings. In the following description, the substrate means a substrate for FPD (Flat Panel Display), a substrate for an optical disc, a substrate for a magnetic disk, a semiconductor substrate, a liquid crystal display device, an organic EL (Electro Luminescence) display device, etc. Substrates for magneto-optical discs, substrates for photomasks, ceramic substrates, substrates for solar cells, etc.

The substrate used in this embodiment has at least a part having a circular outer peripheral portion. Specifically, an orientation plane for positioning is formed on the substrate, and the peripheral portion has a circular shape except for the orientation plane of the substrate. The diameter of the circular portion of the substrate is, for example, 200 mm in diameter. On the substrate, grooves can also be formed to replace the orientation plane.

(1) Structure of the board inspection device 1 is an external perspective view of a substrate inspection device according to an embodiment of the present invention. FIG. 2 is a schematic side view showing the internal structure of the substrate inspection apparatus 200 of FIG. 1. As shown in FIG. 1, the substrate inspection device 200 includes a frame portion 210, a light projection portion 220, a reflection portion 230, an imaging portion 240, a substrate holding device 250, a moving portion 260, a direction detection portion 270 and a control portion 280.

The light projecting section 220, the reflecting section 230, the imaging section 240, the substrate holding device 250, the moving section 260, and the direction detecting section 270 are housed in the frame section 210. The control unit 280 includes, for example, a CPU (central processing unit) and a memory, or a microcomputer, and controls the operations of the light projection unit 220, the imaging unit 240, the substrate holding device 250, the moving unit 260, and the direction detection unit 270.

The light projecting portion 220 includes, for example, one or a plurality of light sources, and emits light in a strip shape having a larger diameter than the substrate W diagonally downward. The light from the light projecting section 220 has a long horizontal cross section extending in the X direction. The reflection unit 230 includes, for example, a mirror surface. The imaging unit 240 includes an imaging element such as a line sensor 241 arranged in a plurality of pixels arranged linearly in the X direction, and one or more condenser lenses. In this example, a CCD (Charge Coupled Device) line sensor is used as the imaging element. In addition, a COMS (Complementary Metal Oxide Semiconductor) line sensor can also be used as the imaging element.

As shown in FIG. 2, the substrate holding device 250 is, for example, a rotating chuck, and includes a driving device 251 and a rotating holding portion 252. The driving device 251 is, for example, an electric motor, and has a rotating shaft 253. The rotation holding portion 252 is attached to the front end of the rotation shaft 253 of the driving device 251, and is driven to rotate around the vertical axis while maintaining the substrate W to be inspected.

The moving part 260 includes a pair of rail members 261 and a moving holding part 262. The pair of rail members 261 are arranged to extend parallel to each other in the Y direction. The Y direction is orthogonal to the X direction on the horizontal plane. The movement holding portion 262 is configured to hold the substrate holding device 250 and move in the Y direction along the pair of rail members 261. By moving the movement holding portion 262 in the Y direction with the substrate holding device 250 holding the substrate W, the substrate W passes under the light projecting portion 220 and the reflecting portion 230.

The direction detection unit 270 is a reflective photoelectric sensor including, for example, a light-emitting element and a light-receiving element, and emits light toward the outer peripheral portion of the substrate W and receives the substrate from the substrate W under rotation with the substrate holding device 250 W reflected light. The direction detection unit 270 detects the orientation plane of the substrate W based on the received light amount of the reflected light from the substrate W. A transmission type photoelectric sensor may be used as the direction detection unit 270.

The imaging operation of the substrate W of the substrate inspection apparatus 200 of FIG. 1 will be described. A slit-shaped opening 211 for transporting the substrate W is formed on the side of the frame body 210. The substrate W to be inspected is carried into the frame portion 210 through the opening 211 by the conveying device 120 of FIG. 9 described later, and is held by the substrate holding device 250.

Then, the substrate holding device 250 rotates the substrate W, and the direction detection unit 270 emits light to the peripheral edge of the substrate W, and the direction detection unit 270 receives the reflected light. With this, the orientation plane of the substrate W is detected, and the direction of the substrate W is determined. Based on the determination result, the rotation position of the substrate W is adjusted by the substrate holding device 250 such that the orientation plane of the substrate W faces a specific direction (in this example, one of the Y directions).

Then, the strip-shaped light is emitted obliquely downward from the light projecting portion 220, and the substrate W is moved in one direction by the moving portion 260 so as to pass under the light projecting portion 220. As a result, the entire surface of the substrate W is irradiated with light from the light projecting section 220. The light reflected by one surface of the substrate W is further reflected by the reflection part 230 and guided to the imaging part 240.

The imaging element of the imaging unit 240 sequentially captures a surface of the substrate W by receiving light reflected by a surface of the substrate W at a specific sampling period. Each pixel constituting the imaging element outputs pixel data that displays a value corresponding to the amount of light received. Based on the plurality of pixel data output from the imaging section 240, actual image data of the entire image on one surface of the display substrate W is generated. Thereafter, the substrate W is returned to a specific position by the moving portion 260, and the substrate W is carried out of the frame portion 210 through the opening portion 211 by the transfer device 120 of FIG. 9 described later.

(2) Function of substrate inspection device FIG. 3 is a diagram showing an example of the actual image of the substrate W displayed using the actual image data generated by the imaging unit 240 of FIG. 1. The position of each pixel of the actual image data is represented by a device-specific two-dimensional coordinate system (hereinafter referred to as the device coordinate system). In this embodiment, the device coordinate system is an xy coordinate system having an x axis and a y axis orthogonal to each other. The positive direction of the x direction is right, and the positive direction of the y direction is up. The origin of the device coordinate system is set to, for example, a pixel located in the center of the actual image RI.

The x direction and the y direction correspond to the X direction and the Y direction of FIG. 1, respectively. As described above, in this example, the imaging unit 240 images the substrate W with the orientation plane OF facing one of the Y directions. Thereby, as shown in FIG. 3, actual image data showing the actual image of the substrate W with the orientation plane OF facing downward in the y direction is generated.

When the pixel size of the imaging element of the imaging unit 240 in the y direction matches the moving distance of the substrate W by the moving unit 260 in FIG. 1 in the Y direction, an actual image showing the actual image of the substrate W in the correct aspect ratio is generated Like information. In addition, the aspect ratio means the ratio of the dimension in the x direction to the dimension in the y direction. However, in reality, it is difficult to make the pixel size and the moving pitch of the substrate W coincide due to the mounting accuracy of the components of the moving part 260 and the like. Therefore, in the case where the outer peripheral portion of the substrate W has a circular shape except for the orientation plane OF, as shown in FIG. 3, the actual image of the substrate W displayed by the generated actual image data has a substantially elliptical shape. In this case, the inspection accuracy of the substrate W based on actual image data decreases.

In this embodiment, the orientation plane OF is formed on the substrate W, and the aspect ratio of the substrate W is not 1:1. Therefore, simply stretching the actual image in the longitudinal direction or the lateral direction in such a manner that the aspect ratio of the substrate W in the actual image is 1 to 1, cannot produce image data that displays the correct image of the substrate W. In addition, in this example, the diameter of the substrate is 200 mm, which is relatively small. In this case, the substrate displayed by the stretched image is even more incorrect. Therefore, the substrate inspection apparatus 200 generates the corrected image data that displays the correct image of the substrate W as the corrected image by performing the following correction process on the actual image data.

FIG. 4 is a block diagram showing the functional structure of the substrate inspection apparatus 200. As shown in FIG. 4, the substrate inspection apparatus 200 includes a data acquisition unit 1, a shape identification unit 2, a parameter calculation unit 3, a data correction unit 4, and an inspection unit 5 as functional units. The functional part of the substrate inspection device 200 is realized by, for example, the CPU of the control part 280 executing a computer program stored in the memory. In addition, part or all of the functional parts of the substrate inspection device 200 may also be implemented by hardware such as electronic circuits.

The data acquisition unit 1 acquires actual image data from the imaging unit 240 that displays the actual image of the substrate W in a state where the orientation plane OF is oriented in a specific direction. The external shape specifying unit 2 specifies the external shape of the substrate W in the actual image based on the actual image data obtained by the data obtaining unit 1. The shape of the substrate W of the actual image is specified by excluding the actual image data of the portion corresponding to the orientation plane OF of the substrate W. In this example, because the orientation plane OF in the actual image faces a specific direction, it is easy to exclude the actual image data of the portion corresponding to the orientation plane OF, and specify the outline of the substrate W in the actual image.

The parameter calculation unit 3 regards the outer shape of the substrate W in the actual image specified by the outer shape identification unit 2 as an ellipse shape, and calculates a correction parameter for correcting the actual image data based on the long and short diameters of the ellipse shape. In addition, the elliptical shape includes a round shape. Therefore, when the pixel size of the imaging element of the imaging unit 240 in the y direction matches the moving distance of the substrate W by the moving unit 260 of FIG. 1 in the Y direction, the outer shape of the substrate W is regarded as a circular shape.

The data correction unit 4 corrects the actual image data acquired by the data acquisition unit 1 so that the long and short diameters of the outline of the substrate W in the actual image become equal by the correction parameters calculated by the parameter calculation unit 3, The corrected image data is generated.

The inspection unit 5 inspects the substrate W based on the corrected image data corrected by the data correction unit 4. In this example, sample image data representing an image of a sample substrate that is not defective in appearance is used to determine whether the substrate W to be inspected is defective. For example, an inspection is performed with high accuracy in advance, and a substrate determined to be defect-free during the inspection is used as a sample substrate. The sample image data can also be obtained in the inspection device 200, and can also be obtained in other devices. In addition, you can also use pre-generated design data as sample image data.

(3) Inspection and processing FIG. 5 is a flowchart showing the inspection process performed by the control unit 280 of FIG. 4. Hereinafter, the inspection process will be described using FIG. 4. First, the data acquisition unit 1 acquires actual image data from the imaging unit 240 (step S1). Next, the external shape specifying unit 2 specifies the outer shape of the substrate W of the actual image acquired in step S1 (step S2).

Then, the parameter calculation unit 3 regards the outer shape of the substrate W specified in step S2 as an ellipse shape, and calculates a correction parameter based on the long and short diameters of the ellipse shape (step S3). Thereafter, the data correction unit 4 corrects the actual image data obtained in step S1 so that the long and short diameters of the profile of the substrate W in the actual image become equal by the correction parameters calculated in step S3, and The corrected image data is generated (step S4).

Next, the inspection unit 5 compares the sample image data with the corrected image data generated in step S4 (step S5). In addition, the inspection unit 5 may store sample image data in advance, or it may be acquired by a memory device (not shown) or the like. Then, the inspection unit 5 determines whether the deviation of the values of all pixels between the sample image data and the corrected image data is below a specific threshold value (step S6).

In the case where the deviation of the values of all pixels is below the threshold value, the inspection section 5 determines that the substrate W indicated by the corrected image is normal (step S7), and proceeds to step S9. On the other hand, if the deviation of the value of any pixel exceeds the threshold, the inspection section 5 determines that the substrate W indicated by the corrected image is abnormal (step S8), and proceeds to step S9.

In step S9, the inspection unit 5 determines whether all the substrates W have been inspected (step S9). If all the substrates W have not been inspected, the inspection unit 5 returns to step S1 and repeats steps S1 to S9 until all the substrates W have been inspected. If all the substrates W have been inspected, the inspection section 5 ends the inspection process.

6 to 8 are diagrams for conceptually explaining the generation sequence of corrected image data in the inspection process. In step S2 of the inspection process of FIG. 5, filter processing such as Sobel filtering is performed on the actual image data. In this case, the absolute value of the pixels indicating the actual image data of the outer peripheral portion (edge portion) of the substrate W becomes larger. Further, as shown in FIG. 6, a plurality of virtual lines L1 to L8 (8 in this example) extending from the origin O of the device coordinate system to the outside are set. For example, the virtual lines L1 to L8 are arranged at equal angular intervals (45-degree intervals) with respect to the origin O.

For each of the imaginary lines L1 to L8, the detection of the absolute value from the outside toward the origin O for the first time becomes the position coordinate of the pixel above the specific threshold. In the example of FIG. 6, the coordinates of the positions A1 to A8 are detected for the imaginary lines L1 to L8, respectively. In addition, the coordinates of positions A1 to A8 are (x1, y1), (x2, y2), ..., and (x8, y8), respectively. The outer shape of the substrate W is specified by detecting the coordinates of the positions A1 to A8 of the plurality of outer peripheral portions of the substrate W corresponding to the plurality of imaginary lines L1 to L8, respectively.

In the above example, when the specific substrate W is out of shape, the eight virtual lines L1 to L8 are arranged at 45-degree intervals, but the present invention is not limited to this. It can also be configured with less than 7 imaginary lines L1 ~ L8, and more than 9 imaginary lines. When a larger number of imaginary lines are arranged at a smaller angular interval, the outer shape of the substrate W can be specified with higher accuracy.

The outline of the substrate W thus specified is regarded as an ellipse shape by the parameter calculation unit 3, and the following step S3 is executed. In addition, as described above, in the actual image, the orientation plane OF of the substrate W faces downward. Therefore, the position A5 detected for the imaginary line L5 extending downward from the origin corresponds to the position of the orientation plane OF of the substrate W. Therefore, in this example, in addition to the position A5, the shape of the substrate W is specified by detecting the positions A1 to A4 and A6 to A8. With this, it is easy to regard the outer shape of the substrate W in the actual image as an elliptical shape.

In step S3 of the inspection process of FIG. 5, the correction parameters are calculated by performing multiple regression analysis using the equation of the elliptical shape of the substrate W specified in step S2 and the equation showing the ellipse. Specifically, the equation showing the ellipse is expressed by the following formula (1). In formula (1), x and y are the coordinates in the x direction and y direction in the device coordinate system, respectively. a and b are the long and short diameters of the ellipse, respectively. O _x and O _y are the coordinates of the center of the ellipse in the x and y directions, respectively.

[Number 1]

In the example of FIG. 7, the long diameter a is the long radius in the x direction, and the short diameter b is the short radius in the y direction. Alternatively, the long diameter a may be a short radius along the x direction, and the short diameter b may be a long radius along the y direction. In addition, in the example of FIG. 7, the center coordinates (O _x , O _y ) of the ellipse are located at the origin of the device coordinate system, and may not be located at the origin of the device coordinate system.

Then, as shown in the following formula (2), if the ratio of the short axis b to the long axis a is k, the formula (1) changes to a polynomial shown in the following formula (3). In equation (3), the coefficients K ₁ , K ₂ , K ₃ and K ₄ are expressed by the following equations (4), (5), (6) and (7), respectively.

[Number 2]

[Number 3]

[Number 4]

[Number 5]

[Number 6]

[Number 7]

Then, the coordinates (x1, y1), (x2, y2), ..., and (x8, y8) of the positions A1 to A4, A6 to A8 detected at step S2 are applied to (x, y of formula (3) ). Furthermore, by performing multiple regression analysis using x ² as the target variable and x, y ² and y as the explanatory variables, the coefficients K ₁ to K _{4 in} equations (4) to (7) are obtained. According to this method, even when the substrate W is deformed in the actual image, the coefficients K ₁ to K ₄ can be obtained with high accuracy. Based on the coefficients K ₁ to K ₄ , the long axis a of the ellipse is obtained by the following formula (8). The short diameter b of the ellipse is obtained from equation (2). In addition, the magnification k is obtained by the following formula (9).

[Number 8]

[Number 9]

Thereafter, the calculated magnification k is set as a correction parameter, and the actual image data is corrected so that the long axis a and the short axis b are equal. As a result, as shown in FIG. 8, corrected image data displaying the corrected image CI is generated. In addition, in the example of FIG. 8, the actual image data is corrected in such a way that the short axis b and the long axis a in the y direction are equal, or the actual image data can be corrected in such a way that the long axis a and the short axis b in the x direction are equal .

(4) Substrate processing device 9 is a schematic block diagram showing the overall configuration of a substrate processing apparatus provided with the substrate inspection apparatus 200 of FIGS. 1 and 2. As shown in FIG. 9, the substrate processing apparatus 100 is provided adjacent to the exposure apparatus 300, includes a substrate inspection apparatus 200, and includes a control device 110, a transport device 120, a film forming section 130, a developing section 140, and a heat treatment section 150.

The control device 110 includes, for example, a CPU, a memory, or a microcomputer, and controls the operations of the transport device 120, the film forming section 130, the developing section 140, and the heat treatment section 150. In addition, the control device 110 gives an instruction to inspect the substrate W to the control unit 280 of FIG. 1 of the substrate inspection device 200.

The transport device 120 transports the substrate W between the film forming portion 130, the developing portion 140, the heat treatment portion 150, the substrate inspection device 200, and the exposure device 300. The film forming section 130 forms a resist film on the surface of the substrate W by applying a resist solution on the surface of the substrate W (film forming process). The substrate W after the film formation process is exposed to light by the exposure device 300. The developing unit 140 performs development processing of the substrate W by supplying a developer to the substrate W after the exposure processing of the exposure device 300. The heat treatment unit 150 performs heat treatment of the substrate W before and after the film formation process of the film formation unit 130, the development process of the development unit 140, and the exposure process of the exposure device 300.

The substrate inspection apparatus 200 performs the inspection process of the substrate W after the resist film is formed by the film forming section 130. For example, the substrate inspection apparatus 200 performs inspection of the substrate W after the film formation process of the film formation unit 130 and the development process of the development unit 140. Alternatively, the substrate inspection device 200 may perform inspection of the substrate W after the film forming process of the film forming unit 130 and before the exposure process of the exposure device 300. In addition, the substrate inspection device 200 may perform inspection of the substrate W after the film forming process of the film forming unit 130, after the exposure process of the exposure device 300, and before the development process of the developing unit 140.

The film forming portion 130 may be provided with a processing unit for forming an anti-reflection film on the substrate W. At this time, the heat treatment unit 150 may also perform an adhesion strengthening process to improve the adhesion between the substrate W and the anti-reflection film. In addition, a processing unit may be provided in the film forming portion 130 to form a resist protective film for protecting the resist film formed on the substrate W.

When an anti-reflection film and a resist protective film are formed on one surface of the substrate W, the substrate W may be inspected by the substrate inspection device 200 after the formation of each film. In the substrate processing apparatus 100 of this embodiment, the substrate inspection apparatus 200 inspects the substrate W formed with a film such as a resist film, an anti-reflection film, or a resist protective film with high reliability.

In this example, the substrate inspection apparatus 200 that performs the processing of the substrate W before and after exposure is provided with the substrate inspection apparatus 200, but the substrate inspection apparatus 200 may be provided with other substrate processing apparatuses. For example, the substrate inspection apparatus 200 may be provided in a substrate processing apparatus that performs cleaning processing on the substrate W, or the substrate inspection apparatus 200 may be installed in a substrate processing apparatus that performs etching processing on the substrate W. Or, the substrate inspection device 200 may be used alone.

(5) Effect In the substrate processing apparatus 100 of this embodiment, the substrate holding device 250 holds the substrate W, and the moving section 260 moves the substrate holding device 250 in the Y direction at a specific pitch, and the imaging section 240 generates actual image data. Here, when the pixel size of the line sensor 241 in the y direction corresponding to the Y direction does not match the moving pitch of the substrate holding device 250, the substrate W in the actual image RI is deformed into an elliptical shape.

In such a case, in the substrate inspection device 200, the actual image data can also be acquired by the data acquisition unit 1. Based on the acquired actual image data, the outer shape of the substrate W in the actual image RI is specified by the shape specifying unit 2. The parameter calculation unit 3 regards the outline of the substrate W in the specified actual image RI as an ellipse shape, and calculates the correction parameters based on the long and short diameters of the ellipse shape. The data correction unit 4 corrects the image data as corrected image data in such a manner that the long and short diameters of the profile of the substrate W in the actual image RI become equal based on the calculated correction parameters. Based on the corrected corrected image data, the inspection unit 5 inspects the substrate W.

According to this configuration, when the substrate W is deformed into an elliptical shape in the actual image RI, the corrected image data is generated by correcting the actual image data using the correction parameters based on the long and short diameters of the elliptical shape. In the corrected image CI based on the corrected image data, the substrate W having a substantially perfect circular shape is displayed. With this, the substrate W can be inspected with higher accuracy based on the corrected image data. In addition, there is no need to separately prepare special substrates or jigs for calculating correction parameters, and it is not necessary to set correction parameters in advance. Therefore, the time and cost required for generating the corrected image data can be reduced.

(6) Other embodiments (a) In the above embodiment, the substrate W on which the orientation plane OF for positioning is formed is inspected by the substrate inspection device 200, but the present invention is not limited to this. The substrate W formed with the positioning groove instead of the orientation plane OF may be inspected by the substrate inspection device 200. Or the substrate W of the circular shape in which the orientation plane OF and the groove are not formed can be inspected by the substrate inspection apparatus 200.

(b) In the above embodiment, the visual inspection of the substrate W is performed as the inspection of the substrate W, but the present invention is not limited to this. Other inspections may be performed as the inspection of the substrate W. For example, the distance (edge width) between the outer peripheral portion of the substrate W and the outer peripheral portion of the film formed on the substrate W may be checked based on the corrected image data. In this case, the edge width can be appropriately detected by using corrected image data. This can improve the accuracy of the determination of whether the edge width is appropriate.

(c) In the above embodiment, the substrate W is imaged by the imaging unit 240 in a state where the rotation position of the substrate W is adjusted so that the orientation plane OF is oriented in a specific direction by the substrate holding device 250, but the invention is not limited Here. The imaging unit 240 may capture the substrate W with the orientation plane OF facing any direction. In this case, the external shape specifying unit 2 excludes the actual image data of the portion corresponding to the orientation plane PF of the substrate W by performing image processing on the actual image data, and specifies the substrate W in the actual image Outer shape.

(7) Correspondence between the requirements of the requirements and the requirements of the implementation form In the following, an example of correspondence between each constituent element of the request item and each element of the embodiment will be described, but the present invention is not limited to the following examples. As each constituent element of the request item, various other elements having the structure or function described in the request item can also be used.

In the above embodiment, the substrate W is an example of a substrate, the substrate holding device 250 is an example of a substrate holding section, the actual image RI is an example of an actual image, and the data acquisition section 1 is an example of a data acquisition section. The shape designation part 2 is an example of the shape designation part, the parameter calculation part 3 is an example of the parameter calculation part, the correction image CI is an example of a correction image, the data correction part 4 is an example of a data correction part, and the inspection part 5 is an inspection part Example.

The substrate inspection device 200 is an example of a substrate inspection device, the orientation plane OF is an example of a non-circular portion, and the X direction and the Y direction are examples of the first and second directions, respectively. The line sensor 241 is an example of a line sensor, the imaging section 240 is an example of an imaging section, the moving section 260 is an example of a moving section, the film forming section 130 is an example of a film forming section, and the substrate processing apparatus 100 is a substrate processing apparatus Example.

1‧‧‧ Data Acquisition Department 2‧‧‧Shape specific part 3‧‧‧Parameter calculation department 4‧‧‧ Data Correction Department 5‧‧‧ Inspection Department 100‧‧‧Substrate processing device 110‧‧‧Control device 120‧‧‧Conveying device 130‧‧‧film formation 140‧‧‧Development Department 150‧‧‧Heat Treatment Department 200‧‧‧Substrate inspection device 210‧‧‧frame part 211‧‧‧ opening 220‧‧‧Projection Department 230‧‧‧Projection Department 240‧‧‧Camera Department 241‧‧‧Line sensor 250‧‧‧Substrate holding device 251‧‧‧Drive device 252‧‧‧Rotating holding part 253‧‧‧rotating shaft 260‧‧‧Mobile Department 261‧‧‧rail components 262‧‧‧Mobile holding department 270‧‧‧Direction Detection Department 280‧‧‧Control Department 300‧‧‧Exposure device A1～A8‧‧‧Coordinates a‧‧‧Long Path b‧‧‧short path CI‧‧‧ corrected image K1～K4‧‧‧Coefficient K‧‧‧Magnification L1～L8‧‧‧Imaginary line O‧‧‧Origin OF‧‧‧directional plane PF‧‧‧Orientation plane RI‧‧‧actual image S1～S9‧‧‧Step W‧‧‧Substrate X‧‧‧ direction x‧‧‧ direction Y‧‧‧ direction y‧‧‧ direction

1 is an external perspective view of a substrate inspection device according to an embodiment of the present invention. FIG. 2 is a schematic side view showing the internal structure of the substrate inspection apparatus of FIG. 1. FIG. 3 is a diagram showing an example of an actual image of a substrate displayed using actual image data generated by the imaging section of FIG. 1. 4 is a block diagram showing the functional structure of a substrate inspection device. FIG. 5 is a flowchart showing the inspection process performed by the control unit of FIG. 4. FIG. 6 is a diagram for conceptually explaining the generation sequence of corrected image data in the inspection process. FIG. 7 is a diagram for conceptually explaining the generation sequence of corrected image data in the inspection process. FIG. 8 is a diagram for conceptually explaining the generation sequence of corrected image data in the inspection process. 9 is a schematic block diagram showing the overall configuration of a substrate processing apparatus provided with the substrate inspection apparatus of FIGS. 1 and 2.

1‧‧‧ Data Acquisition Department

2‧‧‧Shape specific part

3‧‧‧Parameter calculation department

4‧‧‧ Data Correction Department

5‧‧‧ Inspection Department

200‧‧‧Substrate inspection device

240‧‧‧Camera Department

280‧‧‧Control Department

Claims (14)

A substrate inspection device, comprising: A substrate holding part, which holds at least a part of a substrate to be inspected with a circular outer periphery; A data acquisition unit that acquires actual image data that displays the image of the substrate held by the substrate holding unit as an actual image; The shape specific part, which specifies the shape of the substrate in the actual image based on the actual image data obtained by the above-mentioned data obtaining part; The parameter calculation unit regards the outline of the substrate in the actual image specified by the outline identification unit as an ellipse shape, and calculates correction parameters for correcting the actual image data based on the long and short diameters of the ellipse shape; The data correction unit, based on the correction parameters calculated by the parameter calculation unit, uses the actual image data obtained by the data acquisition unit as a correction map so that the long and short diameters of the substrate profile in the actual image become equal Image data to be corrected; and The inspection unit inspects the substrate based on the corrected image data corrected by the data correction unit. The substrate inspection device according to claim 1, wherein the inspection target substrate has a non-circular portion to indicate the direction of the substrate; and The outline-specific part excludes the actual image data of the portion of the substrate corresponding to the non-circular shape, and specifies the outline of the substrate in the actual image. The substrate inspection device according to claim 2, wherein the substrate holding portion holds the substrate such that the non-circular portion of the substrate faces a predetermined direction; and The data acquisition unit acquires actual image data indicating an actual image of the substrate in a state where the non-circular portion is oriented in the predetermined direction. The substrate inspection apparatus according to any one of claims 1 to 3, wherein the parameter calculation section calculates the correction parameter by performing multiple regression analysis using the substrate profile specified by the profile specifying section and an equation representing an ellipse. The substrate inspection device according to any one of claims 1 to 3, wherein the outline specifying section specifies the outline of the substrate in the actual image by performing filtering processing on the actual image data acquired by the data acquisition section. The substrate inspection device according to any one of claims 1 to 3, further comprising: An imaging part that generates actual image data by photographing the substrate held by the substrate holding part by a line sensor extending in the first direction; and A moving part that moves at least one of the substrate holding part and the imaging part so that the substrate held by the substrate holding part moves relative to the imaging part in a second direction crossing the first direction relative to the imaging part; and The data acquisition unit acquires actual image data generated by the imaging unit. A substrate processing device including: A film forming portion, which forms a processing film on the substrate; and The substrate inspection device according to any one of claims 1 to 3, which performs substrate inspection after forming a processed film by the film forming portion. A substrate inspection method includes the following steps: Holding at least a part of the inspection target substrate having a circular outer periphery by the substrate holding portion; Obtain actual image data that displays the image of the substrate held by the substrate holding portion as an actual image; Based on the actual image data obtained, the substrate shape in the actual image is specified; The outline of the substrate in the specified actual image is regarded as an ellipse shape, and the correction parameters used to correct the actual image data based on the long and short diameters of the ellipse shape are calculated; Based on the calculated correction parameters, the actual image data obtained is corrected as corrected image data in such a way that the long and short diameters of the substrate profile in the actual image become equal; and The substrate is inspected based on the corrected corrected image data. A substrate inspection method according to claim 8, wherein the substrate to be inspected has a non-circular shaped portion to indicate the direction of the substrate; and The step of specifying the outline of the substrate in the actual image includes: excluding the actual image data of the portion of the substrate corresponding to the non-circular shape portion, and specifying the outline of the substrate in the actual image. The substrate inspection method of claim 9, wherein the step of holding the substrate to be inspected by the substrate holding portion includes: holding the substrate by the substrate holding portion so that the non-circular portion of the substrate faces a predetermined direction; Identifying the outline of the substrate in the actual image includes: obtaining actual image data of the actual image of the substrate showing the state of the non-circular shaped portion facing the predetermined direction, and matching the substrate with the non-circular shaped portion Except for part of the actual image data, the outline of the substrate in the actual image is specified. The substrate inspection method according to any one of claims 8 to 10, wherein the step of calculating the correction parameter includes calculating the correction parameter by performing multiple regression analysis using a specified substrate shape and an equation representing an ellipse. The substrate inspection method according to any one of claims 8 to 10, wherein the step of specifying the outline of the substrate in the actual image includes: specifying the actual image by filtering the acquired actual image data Substrate shape. The substrate inspection method according to any one of claims 8 to 10 further includes the following steps: At least one of the substrate holding part and the imaging part is moved by the moving part in such a manner that the imaging part including the line sensor extending in the first direction relatively moves in the second direction crossing the first direction Movers; and The actual image data is generated by the imaging section photographing the substrate held by the substrate holding section; The step of obtaining the actual image data includes obtaining actual image data generated by the imaging unit. A substrate processing method, including the following steps: Forming a processing film on the substrate by the film forming part; and With the substrate inspection method according to any one of claims 8 to 10, the substrate after the processing film is formed by the film forming portion is inspected.

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