JP7048573B2 - カメラモジュールおよびそのモールド回路基板組立体とモールド感光組立体並びに製造方法 - Google Patents
カメラモジュールおよびそのモールド回路基板組立体とモールド感光組立体並びに製造方法 Download PDFInfo
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- JP7048573B2 JP7048573B2 JP2019503667A JP2019503667A JP7048573B2 JP 7048573 B2 JP7048573 B2 JP 7048573B2 JP 2019503667 A JP2019503667 A JP 2019503667A JP 2019503667 A JP2019503667 A JP 2019503667A JP 7048573 B2 JP7048573 B2 JP 7048573B2
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- mold
- molding
- mold base
- camera module
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2201/10121—Optical component, e.g. opto-electronic component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
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- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
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- H05K2203/1327—Moulding over PCB locally or completely
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Description
モールドプロセスの前に、一体に接続された複数の回路基板11を備える一多面取り回路基板1100を先に作製する。
それに対応して、本発明の前記成形金型210の前記第1の金型211の上記構造および前記モールドベースによれば、次のような利点がある。
それに対応して、本発明の前記成形金型210’の前記第1の金型211’の上記構造および前記モールドベースによれば、次のような利点がある。
Claims (16)
- カメラモジュールに適用されるモールド感光組立体において、少なくとも一つの回路基板と、少なくとも一つの感光素子と、少なくとも一つのモールドベースとを備え、前記モールドベースは、モールドプロセスにより前記回路基板と前記感光素子とに一体に結合されており、前記モールドベースには、前記感光素子の位置に対応して少なくとも一つの光窓が形成されており、かつ、前記モールドベースは、前記感光素子から一体に延びる少なくとも一部の内側面が傾斜状に延びていて、
前記モールドベースの前記少なくとも一部の内側面と前記カメラモジュールの光軸直線との間に、傾斜角αが形成され、
前記感光素子と前記回路基板は、一組のリード線により導通接続されており、前記リード線は、前記モールドベースに被覆され、
前記リード線のワイヤボンドの方式は、前記感光素子から前記回路基板へ接続する場合、前記αの数値は、10°~80°であり、
前記モールドベースは、前記回路基板から一体に直線的に延びる外側面を有し、前記モールドベースの外側面と前記カメラモジュールの光軸直線との間に型抜きを容易にする傾斜角γを有し、γの範囲は、3°~45°であり、
前記モールドベースの前記外側面のうちの少なくとも一つの外周面の外側には、前記回路基板の基板にモールドプロセスで成形金型の少なくとも一つの仕切りブロックが圧着しやすい圧着距離Wが形成され、前記圧着距離Wの数値範囲は、0.1~0.6mmであり、
前記モールドベースの前記外側面における部分外周面は、平坦な切断面を有する
ことを特徴とするモールド感光組立体。 - 前記モールドベースは、前記感光素子の上面の非感光領域から一体に直線的に延びる内側面を有することで、前記モールドベースのすべての内側面が傾斜状に延びており、前記モールドベースの前記内側面と前記カメラモジュールの光軸直線との間に型抜きを容易にするとともに迷光を避ける前記傾斜角αを有し、前記αの大きさの範囲は、10°~55°である
請求項1に記載のモールド感光組立体。 - 前記モールドベースは、上部凹溝を先端に有し、前記モールドベースは、折れ曲がって延びる内側面を有し、前記内側面は、一体に延びる第一部分内側面と、第二部分内側面と、第三部分内側面を順次含み、前記第一部分内側面が前記感光素子の上面の非感光領域から一体に傾斜して延び、前記第三部分内側面が前記第二部分内側面から一体に傾斜して延びており、前記第二部分内側面と前記第三部分内側面により前記上部凹溝を画定している
請求項1に記載のモールド感光組立体。 - 前記第一部分内側面と前記カメラモジュールの光軸直線との間に型抜きを容易にするとともに迷光を避ける傾斜角αを有し、αの大きさの範囲は、10°~80°であり、前記第三部分内側面と前記カメラモジュールの光軸直線との間に型抜きを容易にするとともに迷光を避ける傾斜角βを有し、βの大きさの範囲は、3°~30°である
請求項3に記載のモールド感光組立体。 - 前記第二部分内側面は、前記感光素子の前記上面に対して平行している
請求項4に記載のモールド感光組立体。 - 前記モールドベースの外側面は、周回方向に配置される複数の外周面を含み、そのうち少なくとも一つの前記外周面と前記カメラモジュールの光軸直線との間に型抜きを容易にする傾斜角γを有し、γの大きさの範囲は、3°~45°である
請求項4に記載のモールド感光組立体。 - 前記モールド感光組立体は、一つ又は複数のアクチュエータピン溝をさらに有し、それぞれの前記アクチュエータピン溝を画定するピン溝壁面と前記カメラモジュールの光軸直線との間に型抜きを容易にする傾斜角δを有し、δの大きさの範囲は、3°~30°である
請求項1から6のいずれか1項に記載のモールド感光組立体。 - 前記モールドベースの材料表面は、435-660nmの光の波長範囲における反射率が5%よりも小さい
請求項1から6のいずれか1項に記載のモールド感光組立体。 - 少なくとも一つのレンズユニットと、少なくとも一つの、請求項1から8のいずれか1項に記載のモールド感光組立体とを備える
ことを特徴とするカメラモジュール。 - 前記モールドベースの先端に取り付けられる少なくとも一つのフィルタをさらに備える
請求項9に記載のカメラモジュール。 - 前記モールドベースの上部凹溝に取り付けられる少なくとも一つのフィルタをさらに備える
請求項9に記載のカメラモジュール。 - 少なくとも一つのフィルタミラーベースと、少なくとも一つのフィルタとをさらに備え、前記フィルタが前記フィルタミラーベースに取り付けられ、前記フィルタミラーベースが前記モールドベースの先端に取り付けられている
請求項9に記載のカメラモジュール。 - 少なくとも一つのアクチュエータをさらに備え、前記アクチュエータが、前記モールドベースにより支持されるように、前記モールドベースの頂側に取り付けられており、前記レンズユニットが前記アクチュエータ内に取り付けられて自動合焦を実現する
請求項9に記載のカメラモジュール。 - 前記モールドプロセスにおいてモールド材料が前記感光素子の感光領域に到達することを防止するために、少なくとも一つの環状のバリア部材をさらに備える
請求項9に記載のカメラモジュール。 - 複数の前記カメラモジュールによりアレイカメラモジュールが組み立てられる
請求項9に記載のカメラモジュール。 - 前記モールド感光組立体は、複数の前記感光素子と、複数の前記光窓とを備えることで、複数の前記レンズユニットとともにアレイカメラモジュールを構成している
請求項9に記載のカメラモジュール。
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