JP6955366B2 - 電子素子実装用基板、電子装置および電子モジュール - Google Patents
電子素子実装用基板、電子装置および電子モジュール Download PDFInfo
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- JP6955366B2 JP6955366B2 JP2017086407A JP2017086407A JP6955366B2 JP 6955366 B2 JP6955366 B2 JP 6955366B2 JP 2017086407 A JP2017086407 A JP 2017086407A JP 2017086407 A JP2017086407 A JP 2017086407A JP 6955366 B2 JP6955366 B2 JP 6955366B2
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Description
本発明の1つの態様に係る電子素子実装用基板は、上面に電子素子が実装される実装領域を有する基部と、上面視において、前記実装領域の端部に位置する電極パッドと、前記電極パッドよりも外側において、前記基部の上面に位置する枠体と、を備えており、前記基部の側面は、前記基部の上端から前記基部の下端にかけて傾斜しているとともに、上面視において前記基部の上端から前記基部の下端にかけて外側に広がっており、前記枠体の側面は、前記枠体の上端から前記枠体の下端にかけて傾斜しているとともに、上面視において前記枠体の上端から前記枠体の下端にかけて外側に広がっており、前記基部の側面の傾斜角度と前記枠体の側面の傾斜角度とは、同じであることを特徴とする。
実装用基板の外周部に影が発生することを低減させることが可能となる。さらに、上述した電子素子実装用基板を備えた電子装置を用いることによって、実装性を向上させることが可能な電子装置および電子モジュールを提供することが可能となる。
以下、本発明のいくつかの例示的な実施形態について図面を参照して説明する。なお、以下の説明では、電子素子実装用基板に電子素子が実装され、電子素子実装用基板の上面に蓋体が接合された構成を電子装置とする。また、電子素子実装用基板の上面側、下面側または電子装置を覆うように設けられた筐体または部材を有する構成を電子モジュールとする。電子素子実装用基板、電子装置および電子モジュールは、いずれの方向が上方若しくは下方とされてもよいが、便宜的に、直交座標系xyzを定義するとともに、z方向の正側を上方とする。
図1〜図3を参照して本発明の第1の実施形態における電子装置21、および電子素子実装用基板1について説明する。本実施形態における電子装置21は、電子素子実装用基板1と電子素子10とを備えている。なお、図1〜図3は電子装置21を示しており、図3は電子モジュールを示している。
aを有する。基部2aは上面視において、実装領域4の端部に位置する電極パッドを有する。電子素子実装用基板1は基部2aの電極パッド3よりも外側において、基部2aの上面に位置する枠体2bを有している。なお、ここでは枠体2bと基部2aから構成されるもの、枠体2bだけから構成される物、または基部2aからのみ構成される物を総じて基板2と称する。
て基板2が矩形状あるとき、正方形であってもよいし長方形であってもよい。また例えば、基板2の厚みは0.2mm以上である。
1と外部回路基板とを電気的に接続するものである。
図1〜図2に電子装置21の例を示す。電子装置21は、電子素子実装用基板1と、電子素子実装用基板1の実装領域4に実装された電子素子10と、電子素子10を覆って設けられた蓋体12を備えている。
図3に電子素子実装用基板1を用いた電子モジュール31の一例を示す。電子モジュール31は、電子装置21と電子装置21の上面または電子装置21を覆うように設けられた筐体32とを有している。なお、以下に示す例では説明のため撮像モジュールを例に説明する。
動装置等が付いていて、電子素子実装用基板1と電気的に接続されていてもよい。
次に、本実施形態の電子素子実装用基板1および電子装置21の製造方法の一例について説明する。なお、下記で示す製造方法の一例は、基部2aおよび枠体2bを多数個取り配線基板を用いた製造方法である。
次に、本発明の第2の実施形態による電子素子実装用基板1について、図4を参照しつつ説明する。本実施形態における電子素子実装用基板1において、第1の実施形態の電子素子実装用基板1と異なる点は、基部2aは上端から下端まで側面が傾斜している点である。
次に、本発明の第3の実施形態による電子素子実装用基板1について、図5を参照しつつ説明する。本実施形態における電子素子実装用基板1において、第2の実施形態の電子素子実装用基板1と異なる点は、基部2aと枠体2bの側面の傾斜が連なっている点である。
図6を参照して本発明の第4の実施形態における電子装置21、および電子素子実装用基板1について説明する。本実施形態における電子装置21は、電子素子実装用基板1と電子素子10とを備えている。なお、本実施形態では図6では電子装置21を示している。なお、図6で示す電子装置21では蓋体12を省略している。
いる。基部2aの側面は、電極パッド3の外側において、基部2aの上端から基部2aの下端にかけて傾斜しているとともに、上面視において上端から下端かけて外側に広がっている。
図6に電子装置21の例を示す。なお、図6では蓋体12を省略している。電子装置21は、電子素子実装用基板1と、電子素子実装用基板1の実装領域4に実装された電子素子10と、電子素子10を覆って設けられた蓋体12を備えている。以下、電子装置21の構成/条件/材料などは第1実施形態に記載の内容と同様であるため、説明は省略する。
設けられた枠状体を設けてもよい。また、枠状体は基部2aと同じ材料から構成されていてもよいし、別の材料で構成されていてもよい。また、枠状体の側面も同様に、上端から下端にかけて傾斜しているとともに、上面視において上端から下端にかけて外側に広がっていてもよい。
次に電子素子実装用基板1を用いた電子モジュール31の一例を示す。電子モジュール31は、電子装置21と電子装置21の上面または電子装置21を覆うように設けられた筐体32とを有している。以下、電子モジュール31の構成/条件/材料などは第1実施形態に記載の内容と同様であるため、説明は省略する。
次に、本実施形態の電子素子実装用基板1および電子装置21の製造方法の一例について説明する。なお、下記で示す製造方法の一例は、基部2aを多数個取り配線基板を用いた製造方法である。
ラスまたはセラミックスを含んでいても構わない。
次に、本発明の第5の実施形態による電子素子実装用基板1について、図7を参照しつつ説明する。本実施形態における電子素子実装用基板1において、第4の実施形態の電子素子実装用基板1と異なる点は、実装領域4および電極パッド3は基部2aの下面に位置しており、基部2aは実装領域4と重なる位置に貫通孔を有している点である。
0μmのNiめっき層を被着させるか、またはこのNiめっき層および厚さ0.5μm〜3μmの金(Au)めっき層を順次被着させてもよい。さらにはめっき層上にSnメッキが施されていてもよい。
2・・・・基板
2a・・・基部
2b・・・枠体
3・・・・電極パッド
4・・・・実装領域
5・・・・位置あわせパターン
6・・・・その他の基板
10・・・電子素子
12・・・蓋体
13・・・素子接合材
14・・・蓋体接合材
21・・・電子装置
31・・・電子モジュール
32・・・筐体
Claims (7)
- 上面に電子素子が実装される実装領域を有する基部と、
上面視において、前記実装領域の端部に位置する電極パッドと、
前記電極パッドよりも外側において、前記基部の上面に位置する枠体と、を備えており、前記枠体の側面は、前記枠体の上端から前記枠体の下端にかけて傾斜しているとともに、上面視において前記枠体の上端から前記枠体の下端にかけて外側に広がっており、
前記基部の側面は、前記基部の上端から前記基部の下端にかけて傾斜しているとともに、上面視において前記基部の上端から前記基部の下端にかけて外側に広がっており、
上面視において、前記基部の上面の外縁は、前記枠体の下面の外縁よりも外側に突出していることを特徴とする電子素子実装用基板。 - 上面に電子素子が実装される実装領域を有する、金属材料から成る基部と、
上面視において、前記実装領域の端部に位置する電極パッドと、
前記電極パッドよりも外側において、前記基部の上面に位置する枠体と、を備えており、前記枠体の側面は、前記枠体の上端から前記枠体の下端にかけて傾斜しているとともに、上面視において前記枠体の上端から前記枠体の下端にかけて外側に広がっていることを特徴とする電子素子実装用基板。 - 上面に電子素子が実装される実装領域を有する基部と、
上面視において、前記実装領域の端部に位置する電極パッドと、
前記電極パッドよりも外側において、前記基部の上面に位置する枠体と、を備えており、前記基部の側面は、前記基部の上端から前記基部の下端にかけて傾斜しているとともに、上面視において前記基部の上端から前記基部の下端にかけて外側に広がっており、上面視において前記基部の上端から前記基部の下端にかけて外側に広がっており、
前記枠体の側面は、前記枠体の上端から前記枠体の下端にかけて傾斜しているとともに、上面視において前記枠体の上端から前記枠体の下端にかけて外側に広がっており、
前記基部の側面の傾斜角度と前記枠体の側面の傾斜角度とは、同じであることを特徴とする電子素子実装用基板。 - 前記枠体と前記基部とは一体的に形成されていることを特徴とする請求項1または請求項3に記載の電子素子実装用基板。
- 上面視において、前記基部の外縁は、前記枠体の外縁よりも外側に突出していることを特徴とする請求項1〜4のいずれか1つに記載の電子素子実装用基板。
- 請求項1〜5のいずれか1つに記載の電子素子実装用基板と、
前記実装領域に実装された電子素子と、
前記電子素子を覆って設けられた蓋体とを備えたことを特徴とする電子装置。 - 請求項6に記載の電子装置と、
前記電子装置の上面に位置した筐体とを備えたことを特徴とする電子モジュール。
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