CN108028231B - 电子元件安装用基板以及电子装置 - Google Patents

电子元件安装用基板以及电子装置 Download PDF

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CN108028231B
CN108028231B CN201680054648.4A CN201680054648A CN108028231B CN 108028231 B CN108028231 B CN 108028231B CN 201680054648 A CN201680054648 A CN 201680054648A CN 108028231 B CN108028231 B CN 108028231B
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substrate
electronic component
wiring
inorganic substrate
wiring substrate
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CN108028231A (zh
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冈村拓治
舟桥明彦
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Kyocera Corp
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Kyocera Corp
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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Abstract

电子元件安装用基板具备无机基板、布线基板和接合材料。无机基板具有在上表面的中央区域安装电子元件的电子元件安装部。布线基板设置在无机基板的上表面，且是包围电子元件安装部的框状。接合材料设置在无机基板与布线基板之间。无机基板中比接合材料所处的接合区域更靠外的一侧向下方弯曲。

Description

电子元件安装用基板以及电子装置
技术领域
本发明涉及安装电子元件例如安装CCD(Charge Coupled Device：电荷耦合器件)型或者CMOS(Complementary Metal Oxide Semiconductor：互补金属氧化物半导体)型等摄像元件、LED(Light Emtting Diode：发光二极管)等发光元件或者集成电路等的布线基板以及电子装置。
背景技术
在现有技术中，公知由无机基板和布线基板构成的电子元件安装用基板。此外，公知在该电子元件安装用基板安装了电子元件的电子装置。
如JP特开2010-220245号公报所公开的那样，电子装置要求薄型化，电子元件安装用封装体也正在实现薄型化。相对于该薄型化的要求，布线基板也正在实现薄型化。
但是，布线基板薄的电子元件安装用基板在掉落时，来自外部的冲击会从无机基板传递到布线基板，担心会在布线基板产生裂纹或者破裂。担心因在该布线基板产生裂纹或者破裂，从而在电子装置中不能很好地传递来自电子元件的信号等不良情况。
发明内容
本发明的一个方式的电子元件安装用基板具备无机基板、布线基板以及接合材料。无机基板具有在上表面的中央区域安装电子元件的电子元件安装部。布线基板设置在无机基板的上表面，是包围电子元件安装部的框状。接合材料设置在无机基板与布线基板之间。无机基板中比接合材料所处的接合区域更靠外的一侧向下方弯曲。
本发明的一个方式的电子装置具备安装在电子元件安装用基板的无机基板的电子元件安装部的电子元件。
附图说明
图1(a)是表示本发明的第1实施方式涉及的电子元件安装用基板以及电子装置的外观的俯视图，(b)是与(a)的A-A线对应的纵剖视图。
图2(a)是表示本发明的第1实施方式的另一方式的电子模块的外观的俯视图，(b)是与(a)的B-B线对应的纵剖视图。
图3(a)以及(b)是表示本发明的第1实施方式涉及的电子元件安装用基板以及电子装置的外观的俯视图。
图4(a)是表示本发明的第2实施方式涉及的电子元件安装用基板以及电子装置的外观的俯视图，(b)是与(a)的C-C线对应的纵剖视图。
图5(a)是表示本发明的第3实施方式涉及的电子元件安装用基板以及电子装置的外观的俯视图，(b)是与(a)的D-D线对应的纵剖视图。
图6(a)是表示本发明的第3实施方式的另一方式的电子元件安装用基板以及电子装置的外观的俯视图，(b)是与(a)的E-E线对应的纵剖视图。
图7(a)是表示本发明的第4实施方式涉及的电子元件安装用基板以及电子装置的外观的俯视图，(b)是与(a)的F-F线对应的纵剖视图。
图8(a)是表示本发明的第5实施方式涉及的电子元件安装用基板以及电子装置的外观的俯视图，(b)是与(a)的G-G线对应的纵剖视图。
图9(a)是表示本发明的第5实施方式的另一方式的电子元件安装用基板以及电子装置的外观的俯视图，(b)是与(a)的H-H线对应的纵剖视图。
具体实施方式
以下，参照附图，说明本发明的几个例示性的实施方式。另外，在以下的说明中，将在电子元件安装用基板安装电子元件且将盖体接合在电子元件安装用基板的上表面的结构称为电子装置。电子元件安装用基板以及电子装置可以将任意方向设为上方或下方，但是为了便于说明，定义直角坐标系xyz，并且将z方向的正侧设为上方。
(第1实施方式)
参照图1～图3，说明本发明的第1实施方式的电子装置21以及电子元件安装用基板1。本实施方式的电子装置21具备电子元件安装用基板1和电子元件10。
电子元件安装用基板1具备：无机基板4，具有在上表面的中央区域安装电子元件10的电子元件安装部11；框状的布线基板2，设置在无机基板4的上表面，且包围电子元件安装部11；以及接合材料15，设置在无机基板4与布线基板2之间，无机基板4中比形成了接合材料15的接合区域更靠外的一侧向下方弯曲。
电子元件安装用基板1具备无机基板4，该无机基板4具有在上表面的中央区域安装电子元件10的电子元件安装部11。构成无机基板4的材料例如使用具有高热传导率的材料。作为形成无机基板4的材料，例如可列举氮化铝质烧结体、氮化硅质烧结体或者硅(Si)等。另外，作为形成无机基板4的材料，例如在是氮化铝质晶体或者氮化硅质晶体等的情况下，无机基板4可以是由多个绝缘层构成的层叠体。此外，无机基板4可以在由多个绝缘层构成的层叠体的表面被覆导电层。另外，在位于无机基板4的上表面的中央区域11安装电子元件10。
此外，作为无机基板4的材料也可使用金属材料，作为金属材料，例如可列举不锈钢(SUS)、Fe-Ni-Co合金、42合金、铜(Cu)、科伐铁镍钻合金或者铜合金等。例如，在布线基板2是具有约5×10-6/℃～10×10-6/℃的热膨胀率的氧化铝质烧结体的情况下，无机基板4能够使用具有约10×10-6/℃的热膨胀率的不锈钢(SUS410)。在该情况下，由于布线基板2与无机基板4的热收缩差、热膨胀差变小，所以能够减少电子元件安装部11的变形。其结果，在电子元件10是摄像元件的情况下，能够抑制摄像元件与透镜的光轴偏离，能够良好地维持图像的清晰度。此外，当无机基板4由金属材料构成时，由于其材料是非磁性体，所以能够减少无机基板4发生磁化的情况。因而，能够减少无机基板4妨碍透镜驱动等外部设备工作的情形。
电子元件10例如使用CCD(Charge Coupled Device)型或者CMOS(ComplementaryMetal Oxide Semiconductor)型等摄像元件、LED(Light Emtting Diode)等发光元件、或者集成电路等。另外，电子元件10可以经由粘接材料16配置在无机基板4的上表面。该粘接材料16例如使用银环氧树脂或者热固性树脂等。
电子元件安装用基板1具有包围电子元件安装部11的框状的布线基板2。布线基板2在上表面设置有电子元件连接用焊盘3。此外，虽然未图示，但是可以在布线基板2的下表面设置多个与外部电路或者无机基板4连接的外部电路连接用电极。构成布线基板2的材料例如使用电绝缘性陶瓷或者树脂(塑料)等。
作为被用作形成布线基板2的材料的电绝缘性陶瓷，例如可列举氧化铝质烧结体、莫来石质烧结体、碳化硅质烧结体、氮化铝质烧结体、氮化硅质烧结体或者玻璃陶瓷烧结体等。此外，作为被用作形成布线基板2的材料的树脂，例如可列举环氧树脂、聚酰亚胺树脂、丙烯树脂、酚醛树脂或者氟系树脂等。作为氟系树脂，例如可列举聚酯树脂或者四氟乙烯树脂。
布线基板2可以将多个由前述材料构成的绝缘层上下层叠而形成。形成布线基板2的绝缘层可以如图1所示那样由三层绝缘层形成，也可以由单层、两层或者四层以上的绝缘层形成。此外，可以如图1～图3所示的例子那样，使形成布线基板2的绝缘层的开口部的大小不同，在上表面形成台阶部，在台阶部设置有多个电子元件连接用焊盘3。
此外，也可以在布线基板2的上表面、侧面或者下表面设置有外部电路连接用电极。外部电路连接用电极电连接布线基板2和外部电路基板、或者电子装置21和外部电路基板。
在布线基板2的内部设置形成在布线基板内部或者形成在形成布线基板的绝缘层之间的内部布线、和将内部布线彼此上下连接的贯通导体。这些内部布线或者贯通导体可以在布线基板2的表面露出。可以通过该内部布线或者贯通导体，电连接外部电路连接用电极以及电子元件连接用焊盘3。
电子元件连接用焊盘3、外部电路连接用电极、内部布线以及贯通导体在布线基板2由电绝缘性陶瓷构成的情况下，由钨(W)、钼(Mo)、锰(Mn)、银(Ag)或铜(Cu)、或者含有从这些当中选出的至少一种以上的金属材料的合金等构成。此外，电子元件连接用焊盘3、外部电路连接用电极、内部布线以及贯通导体在布线基板2由树脂构成的情况下，由铜(Cu)、金(Au)、铝(Al)、镍(Ni)、钼(Mo)或钛(Ti)、或者含有从这些当中选出的至少一种以上的金属材料的合金等构成。
可以在电子元件连接用焊盘3、外部电路连接用电极、内部布线以及贯通导体的露出表面，设置镀覆层。根据该结构，能够对电子元件连接用焊盘3、外部电路连接用电极、内部布线以及贯通导体的露出表面进行保护，从而抑制氧化。此外，根据该结构，能够经由引线接合(wire bonding)等的连接构件13，良好地电连接电子元件连接用焊盘3和电子元件10。对于镀覆层而言，例如可以被覆厚度为0.5μm～10μm的Ni镀覆层，或者依次被覆该Ni镀覆层以及厚度为0.5μm～3μm的金(Au)镀覆层。
此外，布线基板2为了密封可以具有盖体12。盖体12例如是平板形状。此外，盖体12例如在电子元件10是摄像元件、或者LED等发光元件的情况下，使用玻璃材料等透明度高的构件。又例如，在电子元件10是半导体电路元件等的情况下，盖体12可以是金属等构件。盖体12例如通过由热固性树脂或者低熔点玻璃或者金属成分构成的钎料等接合构件14，接合在布线基板2的上表面。
电子元件安装用基板1在无机基板4与布线基板2之间具有接合材料15。此时，例如，在后述的布线基板2具有切口等的情况下，在俯视下接合材料15可以在切口的内部露出。
作为构成接合材料15的材料，例如使用热固性树脂或者钎料等。作为被用作形成接合材料15的材料的热固性树脂，例如可列举双酚A型液状环氧树脂等。此外，作为被用作形成接合材料15的材料的钎料，例如可列举焊料、铅、玻璃等。
接合材料15例如可以具有导电性。作为接合材料15，例如是银环氧树脂、焊料、各向异性导电树脂(ACF)或者各向异性导电膜(ACP)等。通过接合材料15具有导电性，从而能够将布线基板2和无机基板4电接合。通过例如以与接地电极相同的电位电接合布线基板2和无机基板4，从而能够使无机基板4具有保护电子元件10不受来自外部的噪声影响的屏蔽体的作用。
无机基板4中比形成了接合材料15的接合区域更靠外的一侧向下方弯曲。一般，要求电子装置21薄型化，且电子元件安装用封装体也正在实现薄型化。相对于该薄型化的要求，布线基板2也正在实现薄型化。但是，布线基板2薄的电子元件安装用基板1在掉落时，来自外部的冲击会从无机基板4传递到布线基板2，担心会在布线基板2产生裂纹或者破裂。担心因在布线基板2产生裂纹或者破裂，从而在电子装置21中不能很好地传递来自电子元件10的信号等不良情况。相对于此，通过使电子元件安装用基板1的无机基板4中比形成了接合材料15的接合区域更靠外的一侧向下方弯曲，从而无机基板4朝向下方弯曲的部分就会先受到掉落时的应力。此时，通过接合材料15具有未设置在布线基板2与无机基板4之间的部位，从而掉落时的应力就很难传递到布线基板2。因而，能够利用无机基板4，缓和掉落等时从外部对布线基板2施加的应力，能够抑制在布线基板2产生裂纹或者破裂等的情况。此外，通过无机基板4向下方弯曲，从而弯曲的部分具有缓和冲击的作用，能够缓和掉落时的应力。
图2示出使用了电子元件安装用基板1的电子模块31。电子模块31具有电子装置21和设置在电子装置21的外部壳体19。此外，电子装置21具备：电子元件安装用基板1；以及安装在电子元件安装用基板1的无机基板4的电子元件安装部11的电子元件10。
如图2所示的例子那样，电子模块31可以具有外部壳体19。通过具有外部壳体19，从而能够进一步实现气密性的提高或者减少来自外部的应力直接施加至电子装置21。在此，在图2所示的例子中，是电子元件10为摄像元件的情况的例子。此时，外部壳体19例如将由树脂等构成的壳体和由树脂、液体、玻璃或者水晶等构成的透镜接合成一个以上的壳体而成。此外，外部壳体19可以附带进行上下左右的驱动的驱动装置等，并与布线基板2电连接。同样，在电子元件10是发光元件或者半导体电路元件等的情况下，适当使用适合于各个元件的结构的外部壳体19。
此外，在图2所示的例子中，外部壳体19的下端部在剖视下设置在布线基板2的厚度方向的中途。由此，即使是电子模块31掉落而对无机基板4施加了应力的情况，也能够减少应力传递到外部壳体19的情况。因而，能够减少外部壳体19从电子元件10剥离的情况或者外部壳体19发生变形的情况。
另外，在图2所示的例子中，虽然未图示，但是外部壳体19可以在俯视下在四个方向的至少一个边上设置有开口部。并且，可以从外部壳体19的开口部插入外部电路从而与布线基板2电连接。此外，外部壳体19的开口部在将外部电路与布线基板2电连接后，可以用树脂等密封材料等封闭开口部的间隙，从而使电子模块31的内部具备气密性。
图3示出本发明的另一方式的电子装置21的俯视图。在图3所示的例子中，布线基板2是矩形形状，在布线基板2的外侧面形成有沿上下方向的槽2a，槽2a在俯视时设置在布线基板2的角部。一般，在布线基板2是矩形形状的情况下，应力容易集中在角部附近，从而产生裂纹或者破裂等的可能性高。相对于此，通过如图3所示的例子那样在布线基板2的角部具有槽2a，能够避免应力的集中，能够进一步减少在布线基板2产生裂纹或者破裂的情况。
此外，在图3(b)所示的例子中，无机基板4在俯视下在布线基板2的槽2a的附近向外侧突出。这样，通过在布线基板2的槽2a的附近使无机基板4大于其他部分，从而无机基板4中突出的部分就更加容易变形。由此，能够利用无机基板4缓和掉落时的应力，能够减少在布线基板2产生裂纹或者破裂等的情况。
此外，在图1～图3所示的例子中，布线基板2的外缘收在无机基板4的外缘的内侧。由此，能够减小布线基板2与外部相接的可能性。因而，能够进一步减少在布线基板2产生破裂或者裂纹等的情况。此外，通过无机基板4的外缘在俯视下位于比布线基板2的外缘更靠外侧的位置处，从而更容易通过无机基板4阻挡掉落等时的冲击，能够进一步减少对布线基板2施加的冲击。进而，能够减少布线基板2的破裂等。
此外，虽然未图示，但是无机基板4可以从向下表面侧弯曲的部位的上表面、下表面或者从上表面及下表面这两方设置缝隙。由此，能够进一步利用弯曲点通过无机基板4来减轻应力。
接着，说明本实施方式的电子元件安装用基板1以及电子装置21的制造方法的一例。另外，下面所示的制造方法的一例是对布线基板2使用多连片布线基板的制造方法。
(1)首先，形成构成布线基板2的陶瓷生片。例如，在得到作为氧化铝(Al2O3)质烧结体的布线基板2的情况下，对Al2O3的粉末添加二氧化硅(SiO2)、氧化镁(MgO)或者氧化钙(CaO)等粉末作为烧结助剂，进一步添加适当的粘合剂、溶剂以及增塑剂，接着将这些混合物混炼成浆料状。之后，利用现有技术周知的刮刀法或者压延辊法等成形方法，得到多连片用的陶瓷生片。
另外，在布线基板2例如由树脂构成的情况下，使用能够成形为给定形状的模具，以传递模塑法或者注入模塑法等成形，由此能够形成布线基板2。
此外，布线基板2例如可以如玻璃环氧树脂这样使树脂浸渍到由玻璃纤维构成的基材。在该情况下，通过使环氧树脂的前体浸渍到由玻璃纤维构成的基材，在给定的温度下使该环氧树脂前体热固化，从而能够形成布线基板2。
(2)接着，利用丝网印刷法等，在由上述(1)工序得到的陶瓷生片中，在会成为电子元件连接用焊盘3、外部电路连接用电极、内部布线以及贯通导体的部分，涂敷或者填充金属膏。该金属膏通过在由前述的金属材料构成的金属粉末中加入适当的溶剂以及粘合剂并进行混炼，从而调制成适度的粘度。另外，为了提高与布线基板2的接合强度，金属膏可以包含玻璃或者陶瓷。
(3)接着，利用模具等对前述的生片进行加工。在会成为布线基板2的生片的中央部形成开口部。另外，此时，可以用模具等在会成为布线基板2的生片的给定部位形成槽2a。
(4)接着，通过将会成为各绝缘层的陶瓷生片层叠并进行加压，从而制成会成为布线基板2的陶瓷生片层叠体。此外，在本工序中，例如，可以通过在会成为各个层的生片设置贯通孔，将两者层叠并进行加压，从而制成会成为布线基板2的生片层叠体。此外，在本工序中，例如，可以通过在会成为各个层的生片设置槽2a，将两者层叠并进行加压，从而制成会成为布线基板2的生片层叠体，也可以将多个会成为布线基板2的生片层叠后形成槽2a。
(5)接着，在约1500～1800℃的温度下对该陶瓷生片层叠体进行烧固，得到将多个布线基板2排列而成的多连片布线基板。另外，通过该工序，前述的金属膏与会成为布线基板2的陶瓷生片同时被烧固，成为电子元件连接用焊盘3、外部电路连接用电极、内部布线以及贯通导体。
(6)接着，将烧固而得到的多连片布线基板截断成多个布线基板2。在该截断中，能够使用以下方法等，即，预先沿会成为布线基板2的外缘的部位在多连片布线基板形成分割槽，通过沿该分割槽断开来分割的方法或者切片法等，沿会成为布线基板2的外缘的部位进行切断的方法。另外，分割槽虽然能够通过在烧固后利用切片装置切入比多连片布线基板的厚度小的厚度来形成，但是也可以通过将刀刃抵接到多连片布线基板用的陶瓷生片层叠体，或者利用切片装置切入比陶瓷生片层叠体的厚度小的厚度来形成。
(7)接着，准备与布线基板2的下表面接合的无机基板4。在无机基板4由金属材料构成的情况下，对由金属材料构成的板材实施使用了现有技术周知的冲压模具的冲压加工或者蚀刻加工等来制成。此外，在由其他材料构成的情况下也同样能够通过适合于各个材质的冲压加工等来制成。此外，在无机基板4由作为金属材料的Fe-Ni-Co合金、42合金、Cu或者铜合金等金属构成的情况下，可以在其表面被覆镍镀覆层以及金镀覆层。由此，能够有效抑制无机基板4的表面的氧化腐蚀。
此外，在无机基板4由电绝缘性陶瓷等构成且在表面印刷有导体图案的情况下，也同样可以在其表面被覆镍镀覆层以及金镀覆层。由此，能够有效抑制无机基板4表面的氧化腐蚀。另外，此时还能够使用按压、模具等，在给定的位置处生成向下表面侧弯曲的部分。
(8)接着，经由接合材料15接合布线基板2和无机基板4。接合材料15利用丝网印刷法或者分配法等将膏状的热固性树脂(粘接构件)涂敷在布线基板2以及无机基板4中的任一方或者两者的接合面。并且，在使热固性树脂干燥后，在重叠了布线基板2和无机基板4的状态下，在隧道式的空气炉或者烤炉等中通炉，通过进行加压加热，从而使接合材料热固化，将布线基板2和无机基板4牢固地粘接。
接合材料15例如在由双酚A型液状环氧树脂、双酚F型液状环氧树脂、酚醛酚醛型液状树脂等构成的主剂中，添加由球状的氧化硅等构成的填充材料、作为以甲基四氢邻苯二甲酸酐等酸酐等为主的固化剂以及着色剂的碳粉末等，并使用离心搅拌机等进行混合。或者，通过进行混炼而设为膏状来得到。此外，作为接合材料15，除此以外，例如还能够使用在双酚A型环氧树脂、双酚A变性环氧树脂、双酚F型环氧树脂、酚醛酚醛型环氧树脂、甲酚酚醛型环氧树脂、特殊酚醛型环氧树脂、酚醛衍生物环氧树脂、双酚骨架型环氧树脂等环氧树脂中添加咪唑系、胺系、磷系、肼系、咪唑加合系、胺加合系、阳离子聚合系或者双氰胺系等固化剂后得到的材料。
(9)接着，在无机基板4的中央区域安装电子元件10。电子元件10通过引线接合等与布线基板2电接合。此外，此时也可以在电子元件10或者无机基板4设置粘接材料等固定于无机基板4。此外，可以在将电子元件10安装在无机基板4的中央区域后，用接合材料将盖体12接合。
通过如以上这样组装布线基板2和无机基板4，能够制成电子装置21。通过上述(1)～(9)的工序，得到电子装置21。另外，上述(1)～(9)的工序顺序并不是指定的。
此外，作为使无机基板4向下表面侧弯曲的方法，能够通过使用布线基板2与无机基板4的热膨胀率之差来制成。例如，通过进行选择使得布线基板2的热膨胀率小于无机基板4，从而能够在用于使接合材料15固化的加热的工序中，利用热膨胀的大小之差，在接合材料15固化后设定成无机基板4向下表面侧的方向弯曲。
(第2实施方式)
接着，参照图4，说明本发明的第2实施方式的电子元件安装用基板1以及电子装置21。在本实施方式的电子元件安装用基板1以及电子装置21中，与第1实施方式的电子元件安装用基板1以及电子装置21的不同点在于，布线基板2具有槽2a，在俯视下接合材料的外周在槽2a的内部露出。
在本实施方式中，在布线基板2的外侧面形成沿上下方向的槽2a，接合材料15在俯视下伸出到槽2a为止。一般，在电子元件10是摄像装置时，通过在布线基板2设置槽2a，从而外部壳体19的位置匹配就会很容易，设置在外部壳体19的透镜与摄像元件的光学位置匹配就会很容易。但是，通过在布线基板2设置槽2a，无机基板4与布线基板2的接合面积会变小。特别是，近几年，电子装置21要求小型化，因该接合面积的降低引起的接合强度的降低变成可课题。如本实施方式这样，通过接合材料15在俯视下伸出到槽2a，从而能够增加接合材料15的接合面积。因而，能够减少无机基板4与布线基板2剥离的可能性以及在无机基板4产生裂纹或者破裂的情况。
此外，基于本实施方式，外部壳体19的脚部能够与接合材料15相接。因而，即使从外部向外部壳体19施加了应力，也能够利用接合材料15使应力得到缓和，能够减少应力直接传递到无机基板4的情况。因而，能够进一步减少在无机基板4产生破裂或者变形的情况、以及无机基板4与布线基板2的剥离。
另外，如本实施方式这样，当接合材料15在俯视下伸出到槽2a为止时，接合材料15可以被设置成向槽2a的侧面攀爬。由此，接合材料15能够形成填角(fillet)，能够提高布线基板2与无机基板4的接合强度。
作为制成这样的电子元件安装用基板1的方法，例如有在印刷接合材料15的工序中将接合材料15印刷到俯视下与槽2a重叠的位置为止的方法。此外，例如，通过将接合材料15印刷得较厚并在接合无机基板4和布线基板2时进行按压，从而能够使其伸出到槽2a。
(第3实施方式)
接着，参照图5以及图6，说明本发明的第3实施方式的电子元件安装用基板1以及电子装置21。在本实施方式的电子元件安装用基板1以及电子装置21中，与第1实施方式以及第2实施方式的电子元件安装用基板1以及电子装置21的不同点在于，无机基板4的外缘部在俯视下与布线基板2的外缘部重叠或者位于其内侧。
在图5所示的例子中，无机基板4的外缘在俯视下位于比布线基板2的外缘更靠内侧的位置处。此外，在图6所示的例子中，无机基板4的外缘在俯视下与布线基板2的外缘重叠。这样，通过使无机基板4的外缘位于与布线基板2的外缘相同的位置或者位于其内侧，能够实现电子装置21的进一步的小型化。
此外，由于无机基板4变小，因此能够使无机基板4中向下方弯曲的部位变小。因而，能够减少从无机基板4的下表面施加了大的力时在无机基板中4产生破裂或者裂纹等的情况。
(第4实施方式)
接着，参照图7，说明本发明的第4实施方式的电子元件安装用基板1以及电子装置21。在本实施方式的电子元件安装用基板1以及电子装置21中，与第3实施方式的电子元件安装用基板1以及电子装置21的不同点在于，在无机基板4的外缘部具有平坦部分。
在图7所示的例子中，无机基板4在最外周部具有平坦部。这样，通过无机基板4在最外周部具有平坦部，从而施加至电子元件安装用基板1的应力更容易被平坦部吸收，掉落时的应力就很难传递到布线基板2。因而，能够进一步减少在布线基板2中产生裂纹或者破裂等情况。此外，此时，计算来自外部壳体19的应力，将平坦部的位置设为与该应力对应的位置，从而能够进一步减轻施加至布线基板2的应力。
此外，通过图7所示的例子那样无机基板4具有平坦部，从而就由平坦部接受来自外部的应力。因而，在对无机基板4施加了应力时，平坦部与倾斜部之间的支点如弹簧那样工作，能够进一步吸收应力。由此，能够减少在布线基板2中产生裂纹或者破裂等的情况。
作为制成这样的电子元件安装用基板1的方法，例如可通过在制成无机基板4的工序中对会成为平坦部的位置利用模具等进行按压并加工，由此来设置。
(第5实施方式)
接着，参照图8以及图9，说明本发明的第5实施方式的电子元件安装用基板1以及电子装置21。在本实施方式的电子元件安装用基板1以及电子装置21中，与第1实施方式的电子元件安装用基板1以及电子装置21的不同点在于，在布线基板2与无机基板4之间具有挠性基板5。
在图8所示的例子中，还具备设置在无机基板4的上表面与布线基板2的下表面之间且包围电子元件安装部11的框状的挠性基板5。这样，通过具备挠性基板5，从而能够增大从无机基板4至布线基板2的距离，能够进一步减少施加至无机基板4的应力传播至布线基板2的情况。此外，通过在布线基板2与无机基板4之间设置杨氏模量低的挠性基板5，从而能够由挠性基板5吸收施加至无机基板4的应力。因而，能够进一步减少施加至无机基板4的应力传播到布线基板2。
此外，在图9所示的例子中，挠性基板5可以在剖视下朝向与无机基板4相同的方向弯曲。此外，通过如图9所示的例子那样，挠性基板5的外缘部在俯视下位于比布线基板2以及无机基板4的外缘部更靠外侧的位置处，从而能够由挠性基板5吸收来自侧面方向的外力。
挠性基板5例如具有基础膜。作为形成基础膜的材料，例如使用由聚酰亚胺膜等树脂构成的绝缘体。此外，挠性基板5在基础膜的上表面具有导电层。导电层由铜、铝、金、镍或者含有从它们当中选出的至少一种以上的金属材料的合金构成。
此外，可以在导电层的露出表面设置镀覆层。根据该结构，能够对导电层的露出表面进行保护来抑制氧化。此外，根据该结构，能够使布线基板2与导电层的电连接变得良好。对于镀覆层而言，例如可以被覆厚度为0.5μm～10μm的Ni镀覆层，或者依次被覆该Ni镀覆层以及厚度为0.5μm～3μm的金(Au)镀覆层。进而，可以在镀覆层上实施Sn镀覆。
挠性基板5具有设置在导电层的上表面的覆盖膜。覆盖膜是导电层的表面保护用的膜，在由聚酰亚胺膜等树脂材料构成的膜的单面涂敷粘接材料，并设置在与布线基板2电接合的部位以外的导电层的表面。另外，挠性基板5和布线基板2通过导电性的接合材料连接。
此外，接合挠性基板5和无机基板4的接合材料15以及接合挠性基板5和布线基板2的粘接构件由很难因电子元件10的安装工序中施加的热而变性的材料构成。作为这样的接合材料15以及粘接构件，有双酚A型液状环氧树脂或者聚酰亚胺树脂等。在该情况下，能够良好地抑制在电子元件10的安装工序中挠性基板5与无机基板4、或者挠性基板5与布线基板2剥离的情况。此外，接合材料15以及粘接构件可以是导电性的，挠性基板5和布线基板2、或者挠性基板5和无机基板4可以电接合。另外，作为导电性的接合材料15或者粘接构件，例如是银环氧树脂、焊料、各向异性导电树脂(ACF)或者各向异性导电膜(ACP)等。
此外，在图8所示的例子中，挠性基板5在俯视下位于比无机基板4更靠内侧的位置处。由此，能够利用无机基板4的外缘来统一电子装置21的外形的全部的基准。因而，能够使电子装置21进一步小型化的同时，容易统一电子装置21的外部尺寸。
此外，在本实施方式中，当在布线基板2中设置有槽2a时，挠性基板5可以在俯视下与槽2a重叠的位置处设置有孔。通过该结构，能够通过槽2a以及设置在挠性基板5的孔，将外部壳体19的脚部接合到无机基板4。因而，能够使从外部壳体19施加的应力向无机基板4释放，能够减少在布线基板2产生裂纹或者破裂的情况。此外，在该结构中，接合材料15可以分别攀爬到设置在布线基板2的槽2a或设置在挠性基板5的孔，或者分别攀爬到这两方。由此，接合材料15能够形成填角(fillet)，能够提高布线基板2与挠性基板5、或者挠性基板5与无机基板4的接合强度。
符号说明
1...电子元件安装用基板
2...布线基板
2a...槽
3...电子元件连接用焊盘
4...无机基板
5...挠性基板
10...电子元件
11...电子元件安装部
12...盖体
13...连接构件
14...接合构件
15...接合材料
16...粘接剂
19...外部壳体
21...电子装置
31...电子模块

Claims (7)

1.一种电子元件安装用基板，其特征在于，具备：
无机基板，具有在上表面的中央区域安装电子元件的电子元件安装部；
框状的布线基板，设置在所述无机基板的上表面，且包围所述电子元件安装部；以及
接合材料，设置在所述无机基板与所述布线基板之间，
所述无机基板具有：与所述布线基板之间配置有所述接合材料的第1部分、在比所述第1部分更靠外侧位于比所述第1部分更靠下方的位置并且与所述布线基板之间未配置有所述接合材料的第2部分、和位于所述第1部分与所述第2部分之间的包含弯曲点的第3部分。
2.根据权利要求1所述的电子元件安装用基板，其特征在于，
在所述布线基板的外侧面具有沿上下方向的槽，所述接合材料在俯视下伸出到所述槽为止。
3.根据权利要求1或2所述的电子元件安装用基板，其特征在于，
所述布线基板是矩形形状，在所述布线基板的外侧面具有沿上下方向的槽，所述槽在俯视下设置在所述布线基板的角部。
4.根据权利要求1或2所述的电子元件安装用基板，其特征在于，
所述布线基板的外缘收在所述无机基板的外缘的内侧。
5.根据权利要求1或2所述的电子元件安装用基板，其特征在于，
所述无机基板在最外周部具有平坦部。
6.根据权利要求1或2所述的电子元件安装用基板，其特征在于，还具备：
框状的挠性基板，设置在所述无机基板的上表面与所述布线基板的下表面之间，且包围所述电子元件安装部。
7.一种电子装置，其特征在于，具备：
权利要求1～6中任一项所述的电子元件安装用基板；以及
安装在所述电子元件安装用基板的所述无机基板的所述电子元件安装部的电子元件。
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