JP6592102B2 - 電子素子実装用基板および電子装置 - Google Patents
電子素子実装用基板および電子装置 Download PDFInfo
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- JP6592102B2 JP6592102B2 JP2017551837A JP2017551837A JP6592102B2 JP 6592102 B2 JP6592102 B2 JP 6592102B2 JP 2017551837 A JP2017551837 A JP 2017551837A JP 2017551837 A JP2017551837 A JP 2017551837A JP 6592102 B2 JP6592102 B2 JP 6592102B2
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Description
図1〜図3を参照して本発明の第1の実施形態における電子装置21、および電子素子実装用基板1について説明する。本実施形態における電子装置21は、電子素子実装用基板1と電子素子10とを備えている。
次に、本発明の第2の実施形態による電子素子実装用基板1および電子装置21について、図4を参照しつつ説明する。本実施形態における電子素子実装用基板1および電子装置21において、第1の実施形態の電子素子実装用基板1および電子装置21と異なる点は、配線基板2は溝2aを有しており、上面視において、接合材の外周は溝2aの内部に露出している点である。
次に、本発明の第3の実施形態による電子素子実装用基板1および電子装置21について、図5および図6を参照しつつ説明する。本実施形態における電子素子実装用基板1および電子装置21において、第1の実施形態および第2の実施形態の電子素子実装用基板1および電子装置21と異なる点は、無機基板4の外縁部が上面視において配線基板2の外縁部と重なっているまたは内側に位置している点である。
次に、本発明の第4の実施形態による電子素子実装用基板1および電子装置21について、図7を参照しつつ説明する。本実施形態における電子素子実装用基板1および電子装置21において、第3の実施形態の電子素子実装用基板1および電子装置21と異なる点は、無機基板4の外縁部に平坦部分を有している点である。
次に、本発明の第5の実施形態による電子素子実装用基板1および電子装置21について、図8および図9を参照しつつ説明する。本実施形態における電子素子実装用基板1および電子装置21において、第1の実施形態の電子素子実装用基板1および電子装置21と異なる点は、配線基板2と無機基板4との間にフレキシブル基板5を有している点である。
2・・・・配線基板
2a・・・溝
3・・・・電子素子接続用パッド
4・・・・無機基板
5・・・・フレキシブル基板
10・・・電子素子
11・・・電子素子実装部
12・・・蓋体
13・・・接続部材
14・・・接合部材
15・・・接合材
16・・・接着剤
19・・・外部筐体
21・・・電子装置
31・・・電子モジュール
Claims (7)
- 上面の中央領域に電子素子が実装される電子素子実装部を有する無機基板と、
前記無機基板の上面に設けられ、前記電子素子実装部を取り囲む枠状の配線基板と、
前記無機基板と前記配線基板の間に設けられた接合材とを備え、
前記無機基板は、前記接合材が位置した接合領域よりも外側が下方に向かって曲がっている傾斜部を有することを特徴とする電子素子実装用基板。 - 前記配線基板の外側面には、上下方向に沿った溝を有しており、前記接合材は上面視において前記溝にまで食み出していることを特徴とする請求項1に記載の電子素子実装用基板。
- 前記配線基板は矩形状であり、前記配線基板の外側面には、上下方向に沿った溝を有しており、前記溝は上面視して前記配線基板の角部に設けられていることを特徴とする請求項1または2に記載の電子素子実装用基板。
- 前記配線基板は外縁が前記無機基板の外縁の内側に収まることを特徴とする請求項1乃至請求項3のいずれかに記載の電子素子実装用基板。
- 前記無機基板は最外周部に平坦部を有することを特徴とする請求項1乃至請求項4に記載の電子素子実装用基板。
- 前記無機基板の上面と前記配線基板の下面の間に設けられ、前記電子素子実装部を取り
囲む枠状のフレキシブル基板をさらに備えたことを特徴とする請求項1乃至請求項5のいずれかに記載の電子素子実装用基板。 - 請求項1ないし請求項6のいずれかに記載の電子素子実装用基板と、
前記電子素子実装用基板の前記無機基板の前記電子素子実装部に実装された電子素子とを備えていることを特徴とする電子装置。
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JP6905958B2 (ja) * | 2018-06-27 | 2021-07-21 | 京セラ株式会社 | 接着構造、撮像装置、および移動体 |
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