JP7035014B2 - 性能が強化されたウェハレベルパッケージ - Google Patents

性能が強化されたウェハレベルパッケージ Download PDF

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JP7035014B2
JP7035014B2 JP2019507765A JP2019507765A JP7035014B2 JP 7035014 B2 JP7035014 B2 JP 7035014B2 JP 2019507765 A JP2019507765 A JP 2019507765A JP 2019507765 A JP2019507765 A JP 2019507765A JP 7035014 B2 JP7035014 B2 JP 7035014B2
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die
thin
walled
support pad
mold compound
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JP2019525486A5 (enExample
JP2019525486A (ja
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ハッチャー，メリル・アルバート，ジュニア
ハモンド，ジョナサン・ヘイル
チャドウィック，ジョン
コスタ，ジュリオ・シー
ヴァンダミア・ジャン，エドワード
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コーボ ユーエス，インコーポレイティド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
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    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00777—Preserve existing structures from alteration, e.g. temporary protection during manufacturing
    • B81C1/00785—Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching
    • B81C1/00801—Avoid alteration of functional structures by etching, e.g. using a passivation layer or an etch stop layer
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    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Error Detection And Correction (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2019507765A 2016-08-12 2017-08-14 性能が強化されたウェハレベルパッケージ Active JP7035014B2 (ja)

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Application Number Priority Date Filing Date Title
US201662374304P 2016-08-12 2016-08-12
US62/374,304 2016-08-12
PCT/US2017/046744 WO2018031994A1 (en) 2016-08-12 2017-08-14 Wafer-level package with enhanced performance

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JP2019525486A JP2019525486A (ja) 2019-09-05
JP2019525486A5 JP2019525486A5 (enExample) 2020-09-24
JP7035014B2 true JP7035014B2 (ja) 2022-03-14

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