JP6947188B2 - 不活性材料の構成部品を組み立てるための接着剤 - Google Patents

不活性材料の構成部品を組み立てるための接着剤 Download PDF

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Publication number
JP6947188B2
JP6947188B2 JP2018556288A JP2018556288A JP6947188B2 JP 6947188 B2 JP6947188 B2 JP 6947188B2 JP 2018556288 A JP2018556288 A JP 2018556288A JP 2018556288 A JP2018556288 A JP 2018556288A JP 6947188 B2 JP6947188 B2 JP 6947188B2
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Japan
Prior art keywords
adhesive formulation
photoinitiator
epoxy
formulation according
impregnated
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Japanese (ja)
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JP2019522685A (ja
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ダビデ チャンピーニ，
ダビデ チャンピーニ，
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SICPA Holding SA
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SICPA Holding SA
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/375—Thiols containing six-membered aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2018556288A 2016-05-19 2017-05-19 不活性材料の構成部品を組み立てるための接着剤 Active JP6947188B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16170330 2016-05-19
EP16170330.1 2016-05-19
PCT/EP2017/062112 WO2017198820A1 (en) 2016-05-19 2017-05-19 Adhesives for assembling components of inert material

Publications (2)

Publication Number Publication Date
JP2019522685A JP2019522685A (ja) 2019-08-15
JP6947188B2 true JP6947188B2 (ja) 2021-10-13

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JP2018556288A Active JP6947188B2 (ja) 2016-05-19 2017-05-19 不活性材料の構成部品を組み立てるための接着剤

Country Status (8)

Country Link
US (1) US11111417B2 (de)
EP (1) EP3458538B1 (de)
JP (1) JP6947188B2 (de)
KR (1) KR102346575B1 (de)
CN (1) CN109153900B (de)
CA (1) CA3022348C (de)
RU (1) RU2744431C2 (de)
WO (1) WO2017198820A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814839B (zh) 2018-07-30 2023-09-11 瑞士商西克帕控股有限公司 多晶片模組(mcm)組合件和列印條
TWI789529B (zh) 2018-07-30 2023-01-11 瑞士商西克帕控股有限公司 多晶片模組(mcm)組件
CN111849394B (zh) * 2019-04-29 2021-12-28 常州强力电子新材料股份有限公司 光固化粘接剂组合物、光固化粘接剂、偏光板及光学设备
KR20220094209A (ko) 2019-12-12 2022-07-05 다이킨 고교 가부시키가이샤 조성물, 경화성 조성물, 및 경화물
CN115368550B (zh) * 2021-05-20 2024-01-26 常州强力先端电子材料有限公司 一种氧杂环丁烷类含氟聚合物及其制备方法
CN117264469A (zh) * 2023-11-23 2023-12-22 苏州凡赛特材料科技有限公司 一种用于喷墨打印的延迟固化uv胶黏剂

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Publication number Priority date Publication date Assignee Title
RU2016037C1 (ru) * 1991-02-06 1994-07-15 Государственное предприятие - Научно-производственное объединение "Орион" СПОСОБ СКЛЕИВАНИЯ ПЛАСТИНЫ CdxHg1-xTe С САПФИРОВОЙ ПОДЛОЖКОЙ
JP2001089639A (ja) * 1999-09-24 2001-04-03 Mitsubishi Heavy Ind Ltd エネルギー線硬化樹脂組成物
US6610759B1 (en) 2000-03-06 2003-08-26 Curators Of The University Of Missouri Cationically polymerizable adhesive composition containing an acidic component and methods and materials employing same
JP2003152248A (ja) 2001-11-09 2003-05-23 Fuji Photo Film Co Ltd 光デバイス
GB0212062D0 (en) * 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
JP4377188B2 (ja) * 2003-09-29 2009-12-02 富士フイルム株式会社 重合性樹脂組成物、インクジェット記録ヘッド及びその製造方法
US20060292377A1 (en) * 2005-06-28 2006-12-28 Seagate Tecnology Llc Adhesive attachment of a first member to a second member
RU2451040C2 (ru) * 2006-07-17 2012-05-20 Циба Холдинг Инк. Способ склеивания
JPWO2008146685A1 (ja) * 2007-05-23 2010-08-19 昭和電工株式会社 エーテル結合を有する反応性ウレタン化合物、硬化性組成物および硬化物
JP2010163566A (ja) * 2009-01-16 2010-07-29 Three M Innovative Properties Co エポキシ樹脂組成物
KR101671047B1 (ko) 2009-07-01 2016-10-31 교리쯔 가가꾸 산교 가부시키가이샤 속경화성이 우수한 에너지선 경화형 에폭시 수지 조성물
JP5684275B2 (ja) 2010-09-24 2015-03-11 電気化学工業株式会社 エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体
EP2753662B1 (de) * 2011-09-07 2020-06-24 MicroChem Corp. Epoxidformulierungen und verfahren zur herstellung von reliefmustern auf substraten mit niedriger oberflächenenergie
CN105441001A (zh) * 2015-12-24 2016-03-30 深圳市浩力新材料技术有限公司 一种高性能光通讯器件用接着剂及其制备方法

Also Published As

Publication number Publication date
EP3458538B1 (de) 2020-10-28
RU2018140415A3 (de) 2020-08-18
CN109153900B (zh) 2021-12-03
RU2744431C2 (ru) 2021-03-09
EP3458538A1 (de) 2019-03-27
KR102346575B1 (ko) 2022-01-04
US20190300753A1 (en) 2019-10-03
CA3022348A1 (en) 2017-11-23
WO2017198820A1 (en) 2017-11-23
US11111417B2 (en) 2021-09-07
KR20190010588A (ko) 2019-01-30
CN109153900A (zh) 2019-01-04
CA3022348C (en) 2024-02-20
RU2018140415A (ru) 2020-06-19
JP2019522685A (ja) 2019-08-15

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