JP6868982B2 - 隆起部が設けられている半導体を基板の基板位置に取り付けるための方法 - Google Patents

隆起部が設けられている半導体を基板の基板位置に取り付けるための方法 Download PDF

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JP6868982B2
JP6868982B2 JP2016156305A JP2016156305A JP6868982B2 JP 6868982 B2 JP6868982 B2 JP 6868982B2 JP 2016156305 A JP2016156305 A JP 2016156305A JP 2016156305 A JP2016156305 A JP 2016156305A JP 6868982 B2 JP6868982 B2 JP 6868982B2
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camera
substrate
positioning
bonding head
image
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JP2017050533A (ja
JP2017050533A5 (enrdf_load_stackoverflow
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フローリアン スピア
フローリアン スピア
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Besi Switzerland AG
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2016156305A 2015-08-31 2016-08-09 隆起部が設けられている半導体を基板の基板位置に取り付けるための方法 Active JP6868982B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH12482015 2015-08-31
CH01248/15 2015-08-31
CH01404/15 2015-09-28
CH01404/15A CH711536B1 (de) 2015-08-31 2015-09-28 Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.

Publications (3)

Publication Number Publication Date
JP2017050533A JP2017050533A (ja) 2017-03-09
JP2017050533A5 JP2017050533A5 (enrdf_load_stackoverflow) 2019-09-05
JP6868982B2 true JP6868982B2 (ja) 2021-05-12

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JP (1) JP6868982B2 (enrdf_load_stackoverflow)
KR (1) KR102597252B1 (enrdf_load_stackoverflow)
CN (1) CN106486400B (enrdf_load_stackoverflow)
CH (1) CH711536B1 (enrdf_load_stackoverflow)
MY (1) MY176667A (enrdf_load_stackoverflow)
SG (1) SG10201606167WA (enrdf_load_stackoverflow)
TW (1) TWI700767B (enrdf_load_stackoverflow)

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JP7164314B2 (ja) * 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
CN109079367B (zh) * 2018-07-23 2020-07-24 中电科技（合肥）博微信息发展有限责任公司 一种芯片智能焊接方法
JP7582928B2 (ja) * 2021-11-25 2024-11-13 キヤノン株式会社 接合装置および接合方法

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JP6391225B2 (ja) 2013-09-13 2018-09-19 ファスフォードテクノロジ株式会社 フリップチップボンダ及びフリップチップボンディング方法
JP6200737B2 (ja) * 2013-09-17 2017-09-20 ファスフォードテクノロジ株式会社 ダイボンダ用ディッピング機構及びフリップチップボンダ
JP2015076411A (ja) * 2013-10-04 2015-04-20 株式会社日立ハイテクインスツルメンツ ダイボンダ
JP6324772B2 (ja) * 2014-03-14 2018-05-16 ファスフォードテクノロジ株式会社 ダイボンダ用ディッピング機構及びフリップチップボンダ

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KR102597252B1 (ko) 2023-11-01
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