TWI700767B - 用於將設有凸塊的半導體晶片安裝在基板的基板定位的方法 - Google Patents

用於將設有凸塊的半導體晶片安裝在基板的基板定位的方法 Download PDF

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TWI700767B
TWI700767B TW105127781A TW105127781A TWI700767B TW I700767 B TWI700767 B TW I700767B TW 105127781 A TW105127781 A TW 105127781A TW 105127781 A TW105127781 A TW 105127781A TW I700767 B TWI700767 B TW I700767B
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camera
substrate
optical mark
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弗羅里安 史貝爾
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瑞士商貝西瑞士股份有限公司
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Abstract

本發明涉及一種用於將設有凸塊的半導體晶片作為覆晶晶片安裝在基板的基板定位的方法。該方法包括在以固定方式設置的腔中放置覆晶晶片，其中用助焊劑潤濕該凸塊並且藉由照相機來判定覆晶晶片的位置。該方法進一步包括使用運送頭和接合頭，它們允許快速且高精度的安裝。

Description

用於將設有凸塊的半導體晶片安裝在基板的基板定位的方法
本發明涉及一種方法，該方法用於將設有凸塊的半導體晶片作為覆晶晶片安裝在基板的基板定位(location)。
本發明基於開發一種用於在基板上安裝作為覆晶晶片的半導體晶片的方法的目的，該方法一方面允許有非常高的安置精度，而另一方面允許有最高的可處理量。
1‧‧‧凸塊
2‧‧‧半導體晶片
3‧‧‧覆晶晶片
4‧‧‧晶圓台
5‧‧‧覆晶設備
6‧‧‧拾取頭
7‧‧‧第一運送系統
8‧‧‧運送頭
9‧‧‧第二運送系統
10‧‧‧接合頭
11‧‧‧基板
12‧‧‧支撐體
13‧‧‧裝置
14‧‧‧第一照相機
15‧‧‧第二照相機
16‧‧‧照相機支撐體
17‧‧‧板
18‧‧‧腔
19‧‧‧助熔劑器
20‧‧‧基體
21‧‧‧側壁
22‧‧‧光學標記
23‧‧‧另外的光學標記
附圖併入本說明書並構成本說明書的一部分，附圖顯示本發明的一個以上的實施例，並且與具體的描述一起用作解釋本發明的原理和實現。這些附圖是示意性的並且未按比例繪製。在附圖中：圖1係示意性地顯示一種用於安裝作為覆晶晶片的設有凸塊的半導體晶片的設備的側視圖，圖2係顯示在俯視圖中的照相機支撐體，並且 圖3係顯示像素坐標系統和機器坐標系統。
圖1示意性地顯示用於安裝作為覆晶晶片3的設有凸塊1的半導體晶片2的設備的側視圖，設置該設備以用於執行根據本發明的方法。該設備包括用於提供半導體晶片2的晶圓台4、具有拾取頭6的覆晶設備5、具有運送頭8的第一運送系統7、具有接合頭10的第二運送系統9、用於在支撐體12上供應和提供基板11的運送系統(未圖示)、用於採用助熔劑潤濕半導體晶片的裝置13、第一照相機14以及第二照相機15。裝置13包括：照相機支撐體16；板17，板17具有腔18，腔18的基體是透明的；以及向下開口的助熔劑容器19。藉由機器座標描述接合頭10的位置(position)。藉由未圖示的控制裝置控制該設備。
設置第一運送系統7以在至少兩個空間方向上移動運送頭8。設置建立第二運送系統9以在三個空間方向上移動接合頭10。
在也適合於執行根據本發明的方法的另一設備中，不存在晶圓台4和具有拾取頭6的覆晶設備5，但是透過進給裝置(也被稱作進料器)來替代，進給裝置直接提供半導體晶片2作為覆晶晶片3。在這種設備中，圖1中以參考元件符號4顯示的元件代表進給裝置。
照相機支撐體16以固定的方式設置在設備上，並且包括基體20以及至少兩個側壁21，第一照相機14被緊固到基體20。板17可拆卸地安裝在照相機 支撐體16上。圖2顯示在俯視圖中的照相機支撐體16。 照相機支撐體16包括第一光學標記22並且選擇性地還包括至少一個另外的光學標記23。照相機支撐體16如下方式的機械剛性方式地形成：第一照相機14和光學標記22以及可選的光學標記23相對於彼此是剛性的幾何關係，使得分配給第一照相機14的圖像的像素坐標系統的位置和定向相對於光學標記22以及可選的光學標記23的位置是固定關係(即假設在這種情況下是不可變化的)。
較佳地，光學標記22以及可選的光學標記23設置在垂直於用於基板11的支撐體12的表面延伸的方向上，設置在基本上等於基板定位高度的高度處。這提供了以下優勢：當第二照相機15記錄光學標記22和可選的光學標記23的圖像或記錄基板定位的圖像或記錄基板的基板標記的圖像時，接合頭10基本上位於相同高度處。這意味著不需要將接合頭10升高到不同高度，以將待拍攝的物件帶到第二照相機15的聚焦面。
從通過第一照相機14記錄的覆晶晶片3的圖像判定覆晶晶片3的像素座標，並且藉由第一幾何資料來將覆晶晶片3的像素座標轉換為接合頭10的機器座標。第一幾何資料包括第一光學標記22的位置以及具有固定值(u,v)的向量A，向量A指示第一光學標記22相對第一照相機14像素坐標系統的基準點的方向和距離。第一幾何資料進一步包括固定角度Ψ，該角度描述了第一照相機14的像素坐標系統和接合頭10的機器坐 標系統之間的扭轉。如果存在多於一個光學標記，那麼第一幾何資料包括每一個另外的光學標記的位置以及具有固定值的相關向量，所述相關向量指示該另外的光學標記相對第一照相機14的像素坐標系統的基準點的方向和距離。
圖3示意性地顯示出接合頭10的機器坐標系統MS、第一照相機14的像素坐標系統PS、第一光學標記22、向量A以及角度Ψ。向量A的值(u,v)是機器坐標系統MS中的數位。
正如下面將要更詳細解釋的，在根據本發明的方法中將覆晶晶片3放置在腔18中，其中覆晶晶片3的凸塊1浸入到助熔劑中，用第一照相機14記錄圖像，並且在潤濕週期期滿之後，將覆晶晶片3從腔18中移除並安裝在基板11上。在這個階段期間腔18位於第一照相機14上方的固定定位上，並且第一照相機14的視野定向於腔18的基體，使得其圖像示出具有凸塊1的覆晶晶片3的底側。
在第一實施例中，以固定的方式設置助熔劑容器19。在這種情況下，裝置13包括用於板17往復移動的驅動。板17移動到如下程度：以助熔劑填充腔18，腔18位於助熔劑容器19的下方或位於助熔劑容器19的相對側上，並且之後板17再次往回移動使得腔18位於第一照相機14上方的前述定位處。
在第二實施例中，以固定的方式設置板17，其中腔18位於第一照相機14上方。在這種情況下，裝 置13包括用於使助熔劑容器19從腔18的一側移動到腔18的相對側的驅動。助熔劑容器19在板17上滑動並且用助熔劑填充腔18。
第二照相機15被緊固到接合頭10。照相機15的光軸平行於接合頭10的夾持軸線延伸。第二照相機15以如下方式機械地緊固到接合頭10：分配給第二照相機15的圖像的像素坐標系統的定向與接合頭10的夾持軸線處於固定的幾何關係。藉由第二幾何資料來將基板定位的像素座標轉換成接合頭10的機器座標，其中基板定位的像素座標是藉由基板定位的至少一個圖像或通過第二照相機15記錄的基板上的標記來判定的。
第二幾何資料包括具有數值(x,y)的向量B，其指示第二照相機15的像素坐標系統的基準點相對接合頭10的機器坐標系統的基準點的方向和距離。第二幾何資料進一步包括角度φ，該角度描述了這兩個坐標系統的扭轉。
第一和第二幾何資料進一步包括比例因數，其使得各個照相機的像素坐標系統中的值能夠轉換成接合頭10的機器坐標系統中的值。在校準階段中判定第一和第二幾何資料，其中在安裝階段之前執行校準階段。為了增加設備和方法的長期穩定性，可以在不同時間點處執行校準階段。
所描述的設備的實施例能夠執行根據本發明的用於在基板上安裝作為覆晶晶片的半導體晶片的方法。根據本發明的方法包括一個方面的前述的校準階段 和安裝階段，其中在校準階段中判定第一和第二幾何資料，在安裝階段中對每個半導體晶片執行下列步驟：任一：用晶圓台4在預定定位處提供半導體晶片2；用覆晶設備5的拾取頭6移除所提供的半導體晶片2，並且將半導體晶片2扭轉180°以便提供半導體晶片2作為覆晶晶片3；或者：用進給裝置提供半導體晶片2作為覆晶晶片；用運送頭8從拾取頭6或進給裝置接收覆晶晶片3；用助熔劑填充腔18，腔18設置在板17中並且形成有透明基體，其中板17以固定方式設置或者在填充腔18之後被移動，使得腔18在這兩種情況下都位於第一照相機14上方；將覆晶晶片3放置在腔18中，其中凸塊1面向腔18的基體；用第一照相機14記錄覆晶晶片3的圖像並且基於圖像和第一幾何資料來判定覆晶晶片3相對於接合頭10的機器坐標系統的實際位置；藉由接合頭10將覆晶晶片3從腔18中移除；藉如下方式判定基板定位相對於接合頭10的機器坐標系統的實際位置， 任一藉由：將接合頭10移動到基板定位上方的位置，其中基板定位處於第二照相機15的視野中，藉由第二照相機15來記錄至少一個圖像，並且 基於所述至少一個圖像的基板定位和第二幾何資料來計算基板定位的實際位置；或者藉由：藉由至少兩個基板標記的實際位置來計算基板定位的實際位置，其中在將新基板11供應到支撐體12之後藉由過如下方式分別判定所述至少兩個基板標記的每一個的實際位置：將接合頭10移動到基板11上方的位置，在該位置中基板標記處於第二照相機15的視野中，用第二照相機15記錄圖像，並且藉由圖像和第二幾何資料來判定基板標記的實際位置；並且基於所判定的覆晶晶片3的實際位置和所判定的基板定位的實際位置來計算接合頭10將到達的位置；並且將接合頭10移動到所計算的位置並且將覆晶晶片3放置在基板定位上。
因為運送頭8和接合頭10能夠基本上同時地，即平行地工作，因此用運送頭8和接合頭10裝配設備允許增加設備的生產量，其中運送頭8從拾取頭6或進給裝置接收覆晶晶片3並將所述晶片放置在腔18中，接合頭10從腔18移除覆晶晶片3並且將所述晶片放置在基板11上。設置控制裝置以控制運送頭8和接合頭10的移動，使得兩個頭至少部分地同時運動而不相互碰撞。相對於設備最高的可生產量，控制裝置尤其被程式化來控制該方法的各個步驟的順序，使得一旦接合頭10 已經從腔18移除待安裝的下一個覆晶晶片3，則基於各個工藝步驟的持續時間，運送頭8盡可能快地將下一後續覆晶晶片3放置到腔18中。
圖1顯示在一時間點處的該設備，在該時間點覆晶設備5的拾取頭6已經從晶圓台4取走半導體晶片2，覆晶晶片3已被放在腔18中，並且接合頭10將以助熔劑潤濕的覆晶晶片3運送到基板11。
由第一照相機14記錄的覆晶晶片3的圖像，除了用於判定覆晶晶片3的實際位置之外，還可以用於檢查是否所有凸塊1都存在和/或正確地被潤濕。除此之外，第一照相機14可以在其它覆晶晶片3之後記錄一個圖像，影像處理軟體可以評估圖像並檢查是否所有凸塊1都已被正確地潤濕，並且一旦出現這種情況可以發出消息，所述消息為接合頭10應立即將覆晶晶片3從腔18中移除並且將其放在基板定位上。
如果第二照相機15的視角相對小使得整個基板定位不適合圖像，那麼有利的是將接合頭10移到不同位置並且在包含基板定位的一部分的每個位置處記錄圖像。之後基於這些圖像來判定基板定位的位置和定向。
在第一生產模式中，基於基板定位的至少一個圖像來判定待定位覆晶晶片的基板定位的位置。在第二生產模式中，一旦在供應新的基板之後基於基板標記判定其位置，並且之後藉由幾何材料資料來算覆晶晶片的各個目標位置。這種應用是「晶片級封裝」(WLB)，其中該基板是其上澆鑄有塑膠的晶片。該晶片不包含各 個基板定位的任何位置標記，但是包含附接成靠近晶片邊緣的基板標記。
為了排除由溫度改變所引起的覆晶晶片3在基板定位上的定位誤差，透過以下方式，第一光學標記22的位置在校準階段被判定並且在一個以上的預定時間點處被更新：將接合頭10移動到其中第一光學標記22處於第二照相機15的視野中的位置；用第二照相機15記錄圖像；基於圖像和第二幾何資料來判定第一光學標記22的位置；並且存儲所判定的位置作為第一光學標記22的新位置。
當板17的腔18位於第一照相機14上方的位置中時，如果光學標記被板17覆蓋，那麼方法進一步包括在光學標記22,23的位置被更新之前將板17移動到其中光學標記22,23被暴露的位置。
因而，本發明利用了以下發現：附接到照相機支撐體16的一個以上的光學標記足以降低第一照相機14的像素坐標系統、第二照相機15的像素坐標系統和接合頭10的機器坐標系統之間的變化對在基板定位上將覆晶晶片3定位到滿足當前需求的水準的影響，其中第一照相機14固定在照相機支撐體16上。
如果存在一個以上的另外的光學標記，例如光學標記23，該另外的光學標記的位置以類似的方式在校準階段被判定並在前述時間點處被更新。
有利的是，設置兩個拾取和放置系統，其每個都包括具有拾取頭6的覆晶設備5、具有運送頭8的第一運送系統7、具有接合頭10的第二運送系統9、用於以助熔劑濕潤覆晶晶片的裝置13以及第一照相機14和第二照相機15，所述系統以交替的方式從晶圓台4收集半導體晶片2，並且以交替的方式將半導體晶片2作為覆晶晶片3安裝在設置在支撐體12上的基板11上。
根據本發明的方法提供下列優點：
- 在腔中放置覆晶晶片的定位與從腔移除覆晶晶片的定位相同，確保腔中的助熔劑分佈不會隨著腔從第一定位向第二定位移動而變化，並且覆晶晶片在該腔中不會移位，這種移位元可能對潤濕覆晶晶片的凸塊具有負面影響，或者可能導致該設備的生產量下降。
- 可以獨立於其它處理步驟來調節將覆晶晶片的凸塊浸入到助熔劑中的持續時間。這一方面對於獲得覆晶晶片的凸塊的最佳潤濕，並且另一方面對於獲得最高的可生產量都是重要的。
- 用運送頭和接合頭的裝配以及運送頭和接合頭的同時平行操作增加了該設備的生產量。
雖然已經示出並描述了本發明的實施例和應用，但是對獲得本揭示之益處的所屬領域技術人員來說顯而易見的是，在不脫離本文的發明概念的情況下，可做很多比上述更多的修改。因而，本發明不限於此，而是由申請專利範圍及其等同形式的精神所限制。
1‧‧‧凸塊
2‧‧‧半導體晶片
3‧‧‧覆晶晶片
4‧‧‧晶圓台
5‧‧‧覆晶設備
6‧‧‧拾取頭
7‧‧‧第一運送系統
8‧‧‧運送頭
9‧‧‧第二運送系統
10‧‧‧接合頭
11‧‧‧基板
12‧‧‧支撐體
13‧‧‧裝置
14‧‧‧第一照相機
15‧‧‧第二照相機
16‧‧‧照相機支撐體
17‧‧‧板
18‧‧‧腔
19‧‧‧助熔劑容器

Claims (5)

  1. 一種用於將設有凸塊(1)的半導體晶片(2)安裝在基板(11)的基板定位的方法，在校準階段判定第一和第二幾何資料，並且在安裝階段對每個半導體晶片(2)執該方法，該方法包括下列的步驟(i)及步驟(ii)中之任一者：步驟(i)用晶圓台(4)在預定定位處提供該半導體晶片(2)，且用覆晶設備(5)的拾取頭(6)移除提供的該半導體晶片(2)，並且將該半導體晶片(2)扭轉180°以便提供該半導體晶片(2)作為覆晶晶片(3)；以及步驟(ii)用進給裝置提供該半導體晶片(2)作為覆晶晶片(3)；該方法更包括：用運送頭(8)從該拾取頭(6)或該進給裝置接收該覆晶晶片(3)；用助熔劑填充腔(18)，該腔(18)被設置在板(17)中並且形成有透明基體，其中該板(17)被以固定方式設置或者在填充該腔(18)之後被移動，使得該腔(18)在這兩種情況下都位於第一照相機(14)上方，該第一照相機(14)被以固定方式設置；將該覆晶晶片(3)置於該腔(18)中，其中該凸塊(1)面向該腔(18)的該基體；用該第一照相機(14)記錄該覆晶晶片(3)的圖像，並且基於該圖像和該第一幾何資料來判定該覆晶晶片(3)相對於接合頭(10)的機器坐標系統的實際位置； 用該接合頭(10)將該覆晶晶片(3)從該腔(18)移除；藉由緊固到該接合頭(10)的第二照相機(15)，透過第1處理及第2處理中之任一者，來判定該基板定位相對於該接合頭(10)的該機器坐標系統的實際位置，該第1處理包括：將該接合頭(10)移動到該基板定位上方的位置，在該位置中該基板定位處於該第二照相機(15)的視野中；用該第二照相機(15)記錄至少一個圖像；及基於該至少一個圖像中的該基板定位的位置和該第二幾何資料來計算該基板定位的實際位置；該第2處理包括：藉由至少兩個基板標記的實際位置來計算該基板定位的實際位置，其中在將新基板(11)進給到支撐體(12)之後，藉由以下方式來判定該至少兩個基板標記的每一個的實際位置：將該接合頭(10)移動到該基板上方的位置，在該位置中該基板標記處於該第二照相機(15)的視野中；用該第二照相機(15)記錄圖像，及藉由該圖像和該第二幾何資料來判定該基板標記的實際位置；基於判定的該覆晶晶片(3)的實際位置和判定的該基板定位的實際位置來計算該接合頭(10)將到達的位 置；以及將該接合頭(10)移動到計算的位置並且將該覆晶晶片(3)放置在該基板定位上，其中該運送頭(8)和該接合頭(10)至少部分地同時運動。
  2. 如請求項1之方法，其中該第一幾何資料包括第一光學標記(22)的位置和第一固定向量，該第一固定向量指示由該第一照相機(14)的像素坐標系統的基準點至該第一光學標記(22)的方向及距離，並且其中至少在一個預定時間點處透過以下方式更新該第一光學標記(22)的位置：將該接合頭(10)移動到該第一光學標記(22)處於該第二照相機(15)的視野中的位置；用該第二照相機(15)記錄圖像；基於該圖像和該第二幾何資料來判定該第一光學標記(22)的位置；並且存儲判定的位置作為該第一光學標記(22)的新位置。
  3. 如請求項2之方法，其中該第一幾何資料包括至少一個另外的光學標記(23)的位置和另外的固定向量，該另外的固定向量指示由該第一照相機(14)的該像素坐標系統的該基準點至該至少一個另外的光學標記(23)的方向及距離，並且其中透過以下方式更新該至少一個另外的光學標記(23)的位置：將該接合頭(10)移動到該至少一個另外的光學標 記(23)處於該第二照相機(15)的視野中的位置；用該第二照相機(15)記錄圖像；基於該圖像和該第二幾何資料來判定該至少一個另外的光學標記(23)的位置；並且存儲判定的位置作為該至少一個另外的光學標記(23)的新位置。
  4. 如請求項2之方法，其中當該板(17)的該腔(18)位於該第一照相機(14)上方的位置時，該第一光學標記(22)被該板(17)覆蓋，該方法進一步包括在該第一光學標記(22)的位置被更新之前將該板(17)移動到該第一光學標記(22)被暴露的位置。
  5. 如請求項3之方法，其中當該板(17)的該腔(18)位於該第一照相機(14)上方的位置時，該第一光學標記(22)及該至少一個另外的光學標記(23)被該板(17)覆蓋，該方法進一步包括在該第一光學標記(22)及該至少一個另外的光學標記(23)的位置被更新之前將該板(17)移動到該第一光學標記(22)及該至少一個另外的光學標記(23)被暴露的位置。
TW105127781A 2015-08-31 2016-08-30 用於將設有凸塊的半導體晶片安裝在基板的基板定位的方法 TWI700767B (zh)

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