CN106486400A - 用于在基板的基板定位上安装设有凸块的半导体的方法 - Google Patents

用于在基板的基板定位上安装设有凸块的半导体的方法 Download PDF

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CN106486400A
CN106486400A CN201610754833.6A CN201610754833A CN106486400A CN 106486400 A CN106486400 A CN 106486400A CN 201610754833 A CN201610754833 A CN 201610754833A CN 106486400 A CN106486400 A CN 106486400A
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photographing unit
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弗洛里安·斯皮尔
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Besi Switzerland AG
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Abstract

本发明涉及一种用于在基板的基板定位上安装设有凸块的半导体的方法，该方法用于在基板的基板定位上安装设有凸块的半导体芯片作为倒装芯片。该方法包括在以固定方式布置的腔中放置倒装芯片，其中用助焊剂润湿该凸块并且借助照相机来确定倒装芯片的位置。该方法进一步包括使用运送头和结合头，它们允许快速且高精度的安装。

Description

用于在基板的基板定位上安装设有凸块的半导体的方法
技术领域
本发明涉及一种方法，该方法用于在基板的基板定位(location)上安装设有凸块的半导体芯片作为倒装芯片。
发明内容
本发明基于开发一种用于在基板上安装作为倒装芯片的半导体芯片的方法的目的，该方法一方面允许有非常高的放置精度，而另一方面允许有最高可能的吞吐量。
附图说明
附图并入本说明书并构成本说明书的一部分，附图示出了本发明的一个或多个实施例，并且与具体的描述一起用作解释本发明的原理和实现。这些附图是示意性的并且未按比例绘制。在附图中：
图1示意性地示出了一种用于安装作为倒装芯片的设有凸块的半导体芯片的设备的侧视图，
图2示出了在顶视图中的照相机支撑体，并且
图3示出了像素坐标系统和机器坐标系统。
具体实施方式
图1示意性地示出了用于安装作为倒装芯片3的设有凸块1的半导体芯片2的设备的侧视图，建立该设备以用于执行根据本发明的方法。该设备包括用于提供半导体芯片2的晶片台4、具有拾取头6的倒装设备5、具有运送头8的第一运送系统7、具有结合头10的第二运送系统9、用于在支撑体12上供应和提供基板11的运送系统(未示出)、用于采用助熔剂润湿半导体芯片的装置13、第一照相机14以及第二照相机15。装置13包括：照相机支撑体16；板17，板17具有腔18，腔18的基体是透明的；以及向下开口的助熔剂容器19。通过机器坐标描述结合头10的位置(position)。通过未示出的控制装置控制该设备。
建立第一运送系统7以在至少两个空间方向上移动运送头8。建立第二运送系统9以在三个空间方向上移动结合头10。
在也适合于执行根据本发明的方法的另一设备中，不存在晶片台4和具有拾取头6的倒装设备5，但是通过进料装置(也被称作进料器)来替代，进料装置直接提供半导体芯片2作为倒装芯片3。在这种设备中，图1中以参考标记4示出的元件代表进料装置。
照相机支撑体16以固定的方式布置在设备上，并且包括基体20以及至少两个侧壁21，第一照相机14被紧固到基体20。板17可拆卸地安装在照相机支撑体16上。图2示出了在顶视图中的照相机支撑体16。照相机支撑体16包括第一光学标记22并且可选地还包括至少一个另外的光学标记23。照相机支撑体16如下方式的机械刚性方式地形成：第一照相机14和光学标记22以及可选的光学标记23关于彼此是刚性的几何关系，使得分配给第一照相机14的图像的像素坐标系统的位置和定向相对于光学标记22以及可选的光学标记23的位置是固定关系(即假设在这种情况下是不可变化的)。
优选地，光学标记22以及可选的光学标记23布置在垂直于用于基板11的支撑体12的表面延伸的方向上，布置在基本上等于基板定位高度的高度处。这提供了以下优势：当第二照相机15记录光学标记22和可选的光学标记23的图像或记录基板定位的图像或记录基板的基板标记的图像时，结合头10基本上位于相同高度处。这意味着不需要将结合头10升高到不同高度，以将待拍摄的对象带到第二照相机15的聚焦面。
从通过第一照相机14记录的倒装芯片3的图像确定倒装芯片3的像素坐标，并且借助第一几何数据来将倒装芯片3的像素坐标转换为结合头10的机器坐标。第一几何数据包括第一光学标记22的位置以及具有固定值(u，v)的矢量A，矢量A指示第一光学标记22相对第一照相机14像素坐标系统的基准点的方向和距离。第一几何数据进一步包括固定角度Ψ，该角度描述了第一照相机14的像素坐标系统和结合头10的机器坐标系统之间的扭转。如果存在多于一个光学标记，那么第一几何数据包括每一个另外的光学标记的位置以及具有固定值的相关矢量，所述相关矢量指示该另外的光学标记相对第一照相机14的像素坐标系统的基准点的方向和距离。
图3示意性地示出了结合头10的机器坐标系统MS、第一照相机14的像素坐标系统PS、第一光学标记22、矢量A以及角度Ψ。矢量A的值(u，v)是机器坐标系统MS中的数字。
正如下面将要更详细解释的，在根据本发明的方法中将倒装芯片3放置在腔18中，其中倒装芯片3的凸块1浸入到助熔剂中，用第一照相机14记录图像，并且在润湿周期期满之后，将倒装芯片3从腔18中移走并安装在基底11上。在这个阶段期间腔18位于第一照相机14上方的固定定位上，并且第一照相机14的视野定向于腔18的基体，使得其图像示出具有凸块1的倒装芯片3的底侧。
在第一实施例中，以固定的方式布置助熔剂容器19。在这种情况下，装置13包括用于板17往复移动的驱动。板17移动到如下程度：以助熔剂填充腔18，腔18位于助熔剂容器19的下方或位于助熔剂容器19的相对侧上，并且之后板17再次往回移动使得腔18位于第一照相机14上方的前述定位处。
在第二实施例中，以固定的方式布置板17，其中腔18位于第一照相机14上方。在这种情况下，装置13包括用于使助熔剂容器19从腔18的一侧移动到腔18的相对侧的驱动。助熔剂容器19在板17上滑动并且用助熔剂填充腔18。
第二照相机15被紧固到结合头10。照相机15的光轴平行于结合头10的夹持轴线延伸。第二照相机15以如下方式机械地紧固到结合头10：分配给第二照相机15的图像的像素坐标系统的定向与结合头10的夹持轴线处于固定的几何关系。借助第二几何数据来将基板定位的像素坐标转换成结合头10的机器坐标，其中基板定位的像素坐标是借助基板定位的至少一个图像或通过第二照相机14记录的基板上的标记来确定的。
第二几何数据包括具有数值(x，y)的矢量B，其指示第二照相机15的像素坐标系统的基准点相对结合头10的机器坐标系统的基准点的方向和距离。第二几何数据进一步包括角度该角度描述了这两个坐标系统的扭转。
第一和第二几何数据进一步包括比例因子，其使得各个照相机的像素坐标系统中的值能够转换成结合头10的机器坐标系统中的值。在校准阶段中确定第一和第二几何数据，其中在安装阶段之前执行校准阶段。为了增加设备和方法的长期稳定性，可以在不同时间点处执行校准阶段。
所描述的设备的实施例能够执行根据本发明的用于在基板上安装作为倒装芯片的半导体芯片的方法。根据本发明的方法包括一个方面的前述的校准阶段和安装阶段，其中在校准阶段中确定第一和第二几何数据，在安装阶段中对每个半导体芯片执行下列步骤：
或者：用晶片台4在预定定位处提供半导体芯片2；
用倒装设备5的拾取头6移走所提供的半导体芯片2，并且将半导体芯片2扭转180°以便提供半导体芯片2作为倒装芯片3；
或者：用进料装置提供半导体芯片2作为倒装芯片；
用运送头8从拾取头6或进料装置接收倒装芯片3；
用助熔剂填充腔18，腔18布置在板17中并且由透明基体形成，其中板17以固定方式布置或者在填充腔18之后被移动，使得腔18在这两种情况下都位于第一照相机14上方；
将倒装芯片3放置在腔18中，其中凸块1面向腔18的基体；
用第一照相机14记录倒装芯片3的图像并且基于图像和第一几何数据来确定倒装芯片3关于结合头10的机器坐标系统的实际位置；
通过结合头10将倒装芯片3从腔18中移走；
通过如下方式确定基板定位关于结合头10的机器坐标系统的实际位置，
或者通过：
将结合头10移动到基板定位上方的位置，其中基板定位处于第二照相机15的视野中，
借助第二照相机15来记录至少一个图像，并且
基于所述至少一个图像的基板定位和第二几何数据来计算基板定位的实际位置；
或者通过：
借助至少两个基板标记的实际位置来计算基板定位的实际位置，其中在将新基板11供应到支撑体12之后通过如下方式分别确定所述至少两个基板标记的每一个的实际位置：
将结合头10移动到基板11上方的位置，在该位置中基板标记处于第二照相机15的视野中，
用第二照相机15记录图像，并且
借助图像和第二几何数据来确定基板标记的实际位置；并且
基于所确定的倒装芯片3的实际位置和所确定的基板定位的实际位置来计算结合头10将到达的位置；并且
将结合头10移动到所计算的位置并且将倒装芯片3放置在基板定位上。
因为运送头8和结合头10能够基本上同时地，即平行地工作，因此用运送头8和结合头10装配设备允许增加设备的生产量，其中运送头8从拾取头6或进料装置接收倒装芯片3并将所述芯片放置在腔18中，结合头10从腔18移走倒装芯片3并且将所述芯片放置在基板11上。建立控制装置以控制运送头8和结合头10的移动，使得两个头至少部分地同时运动而不相互碰撞。关于设备最高可能的生产量，控制装置尤其被编程来控制该方法的各个步骤的顺序，使得一旦结合头10已经从腔18移走待安装的下一个倒装芯片3，则基于各个工艺步骤的持续时间，运送头8尽可能快地将下一后续倒装芯片3放置到腔18中。
图1示出了在一时间点处的该设备，在该时间点倒装设备5的拾取头6已经从晶片台4取走半导体芯片2，倒装芯片3已被放在腔18中，并且结合头10将以助熔剂润湿的倒装芯片3运送到基板11。
由第一照相机14记录的倒装芯片3的图像，除了用于确定倒装芯片3的实际位置之外，还可以用于检查是否所有凸块1都存在和/或正确地被润湿。除此之外，第一照相机14可以在其它倒装芯片3之后记录一个图像，图像处理软件可以评估图像并检查是否所有凸块1都已被正确地润湿，并且一旦出现这种情况可以发出消息，所述消息为结合头10应立即将倒装芯片3从腔18中移走并且将其放在基板定位上。
如果第二照相机15的视角相对小使得整个基板定位不适合图像，那么有利的是将结合头10移到不同位置并且在包含基板定位的一部分的每个位置处记录图像。之后基于这些图像来确定基板定位的位置和定向。
在第一生产模式中，基于基板定位的至少一个图像来确定待定位倒装芯片的基板定位的位置。在第二生产模式中，一旦在供应新的基板之后基于基板标记确定其位置，并且之后借助几何材料数据来算倒装芯片的各个目标位置。这种应用是“晶片级封装”(WLB)，其中该基板是其上浇铸有塑料的晶片。该晶片不包含各个基板定位的任何位置标记，但是包含附接成靠近晶片边缘的基板标记。
为了排除由温度改变所引起的倒装芯片3在基板定位上的定位误差，通过以下方式，第一光学标记22的位置在校准阶段被确定并且在一个或多个预定时间点处被更新：
将结合头10移动到其中第一光学标记22处于第二照相机15的视野中的位置；
用第二照相机15记录图像；
基于图像和第二几何数据来确定第一光学标记22的位置；并且
存储所确定的位置作为第一光学标记22的新位置。
当板17的腔18位于第一照相机14上方的位置中时，如果光学标记被板17覆盖，那么方法进一步包括在光学标记22、23的位置被更新之前将板17移动到其中光学标记22、23被暴露的位置。
因而，本发明利用了以下发现：附接到照相机支撑体16的一个或多个光学标记足以降低第一照相机14的像素坐标系统、第二照相机15的像素坐标系统和结合头10的机器坐标系统之间的变化对在基板定位上将倒装芯片3定位到满足当前需求的水平的影响，其中第一照相机14固定在照相机支撑体16上。
如果存在一个或多个另外的光学标记，例如光学标记23，该另外的光学标记的位置以类似的方式在校准阶段被确定并在前述时间点处被更新。
有利的是，提供两个拾取和放置系统，其每个都包括具有拾取头6的倒装设备5、具有运送头8的第一运送系统7、具有结合头10的第二运送系统9、用于以助熔剂湿润倒装芯片的装置13以及第一照相机14和第二照相机15，所述系统以交替的方式从晶片台4收集半导体芯片2，并且以交替的方式将半导体芯片2作为倒装芯片3安装在设置在支撑体12上的基板11上。
根据本发明的方法提供下列优点：
-在腔中放置倒装芯片的定位与从腔移走倒装芯片的定位相同，确保腔中的助熔剂分布不会随着腔从第一定位向第二定位移动而变化，并且倒装芯片在该腔中不会移位，这种移位可能对润湿倒装芯片的凸块具有负面影响，或者可能导致该设备的生产量下降。
-可以独立于其它处理步骤来调节将倒装芯片的凸块浸入到助熔剂中的持续时间。这一方面对于获得倒装芯片的凸块的最优润湿，并且另一方面对于获得最高可能的生产量都是重要的。
-用运送头和结合头的装配以及运送头和结合头的同时平行操作增加了该设备的生产量。
虽然已经示出并描述了本发明的实施例和应用，但是对获得本公开的益处的所属领域技术人员来说显而易见的是，在不脱离本文的发明概念的情况下，很多比上述更多的修改是可能的。因而，本发明不限于此，而是由权利要求及其等同形式的精神的限制。

Claims (4)

1.一种用于在基板(11)的基板定位上安装设有凸块(1)的半导体芯片(2)的方法，其中在校准阶段确定第一和第二几何数据，并且在安装阶段对每个半导体芯片(2)执行下列步骤：
或者：用晶片台(4)在预定定位处提供所述半导体芯片(2)；
用倒装设备(5)的拾取头(6)移走提供的所述半导体芯片(2)，并且将所述半导体芯片(2)扭转180°以便提供所述半导体芯片(2)作为倒装芯片(3)；
或者：用进料装置提供所述半导体芯片(2)作为倒装芯片(3)；
用运送头(8)从所述拾取头(6)或进所述料装置接收所述倒装芯片(3)；
用助熔剂填充腔(18)，所述腔(18)被布置在板(17)中并且由透明基体形成，其中所述板(17)被以固定方式布置或者在填充所述腔(18)之后被移动，使得所述腔(18)在这两种情况下都位于第一照相机(14)上方，所述第一照相机(14)被以固定方式布置；
将所述倒装芯片(3)置于所述腔(18)中，其中置于所述凸块(1)面向所述腔(18)的所述基体；
用所述第一照相机(14)记录所述倒装芯片(3)的图像，并且基于所述图像和所述第一几何数据来确定所述倒装芯片(3)关于结合头(10)的机器坐标系统的实际位置；
用所述结合头(10)将所述倒装芯片(3)从所述腔(18)移走；
借助紧固到所述结合头(10)的第二照相机(15)，通过以下方式，来确定所述基板定位关于所述结合头(10)的所述机器坐标系统的实际位置，所述方式是
或者通过：
将所述结合头(10)移动到所述基板定位上方的位置，在所述位置中所述基板定位处于所述第二照相机(15)的视野中，
用所述第二照相机(15)记录至少一个图像，并且
基于所述至少一个图像中的所述基板定位的位置和所述第二几何数据来计算所述基板定位的实际位置；
或者通过：
借助至少两个基板标记的实际位置来计算所述基板定位的实际位置，其中在将新基板(11)供应到所述支撑体(12)之后，通过以下方式来确定所述至少两个基板标记的每一个的实际位置：
将所述结合头(10)移动到所述基板上方的位置，在所述位置中所述基板标记处于所述第二照相机(15)的视野中，
用所述第二照相机(15)记录图像，并且
借助所述图像和所述第二几何数据来确定所述基板标记的实际位置；并且
基于确定的所述倒装芯片(3)的实际位置和确定的所述基板定位的实际位置来计算所述结合头(10)将到达的位置；并且
将所述结合头(10)移动到计算的位置并且将所述倒装芯片(3)放置在所述基板定位上，其中
所述运送头(8)和所述结合头(10)至少部分地同时运动。
2.根据权利要求1所述的方法，其中所述第一几何数据包括第一光学标记(22)的位置和第一固定矢量，所述第一固定矢量指示所述第一光学标记(22)到所述第一照相机(14)的像素坐标系统的基准点的方向和距所述第一照相机(14)的所述像素坐标系统的所述基准点的距离，并且其中至少在一个预定时间点处通过以下方式更新所述第一光学标记(22)的位置：
将所述结合头(10)移动到所述第一光学标记(22)处于所述第二照相机(15)的视野中的位置；
用所述第二照相机(15)记录图像；
基于所述图像和所述第二几何数据来确定所述第一光学标记(22)的位置；并且
存储确定的位置作为所述第一光学标记(22)的新位置。
3.根据权利要求2所述的方法，其中所述第一几何数据包括至少一个另外的光学标记(23)的位置和另外的固定矢量，所述另外的固定矢量指示所述另外的光学标记到所述第一照相机(14)的所述像素坐标系统的所述基准点的方向和距所述第一照相机(14)的所述像素坐标系统的所述基准点的距离，并且其中通过以下方式更新所述另外的光学标记(23)的位置：
将所述结合头(10)移动到所述另外的光学标记(23)处于所述第二照相机(15)的视野中的位置；
用所述第二照相机(15)记录图像；
基于所述图像和所述第二几何数据来确定所述另外的光学标记(23)的位置；并且
存储确定的位置作为所述另外的光学标记(23)的新位置。
4.根据权利要求2或3所述的方法，其中当所述板(17)的所述腔(18)位于所述第一照相机(14)上方的位置中时，所述光学标记被所述板(17)覆盖，所述方法进一步包括在所述光学标记(22，23)的位置被更新之前将所述板(17)移动到所述光学标记(22，23)被暴露的位置。
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