200843006 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種用以在一基板上安裝半導體晶片 成爲覆晶之方法及設備。一覆晶係一半導體晶片，該半導 體晶片具有一有所謂凸塊之表面，經由該等凸塊實施與該 基板之電性連接。 【先前技術】 當在一基板上安裝半導體晶片成爲覆晶時，通常使該 基板可用在一水平對準支撐表面上及在一晶圓工作台上 提供該等半導體晶片且該等半導體晶片之凸塊向上。然後 該半導體晶片被一翻轉設備從該晶圓工作台移開、之後倒 轉（翻轉，其說明該名稱覆晶）及轉移至該設備之接合頭。 該接合頭將該覆晶帶至一用以以助熔劑潤濕該等凸塊之 潤濕設備，以及之後帶至一用以確定該覆晶之實際位置及 方位（旋轉位置）的靜態攝影機，然後帶至該基板及將該覆 晶放置在該基板上，藉以校正該覆晶之實際位置及方位離 它的期望位置之偏向。從U S 2 0 0 3 0 1 7 7 6 3 3知道一相似安裝 方法。 從US 5 3 7 22 94知道一種設備及一種方法，其中該覆晶 被放置在一塡充有助熔劑之空穴（cavity)中及該空穴之底 部是透明的，以便可藉由一在該空穴下面所配置之攝影機 偵測該覆晶之凸塊的位置。 【發明內容】 本發明之目的係要加速該安裝順序。 200843006 本發明係由申請專利範圍第1、7及9項中所述之特徵 所構成。從該等依附請求項獲得較佳實施例。 本發明係根據下面的發現：當該接合頭（該接合頭用以 將該等覆晶放置在該基板上）將該等覆晶集中在一位置上 而不以該翻轉設備來存放時，該安裝順序將變得較快。因 此，本發明提出一種用以在一基板上安裝一具有凸塊之半 導體晶片成爲覆晶之方法，其特徵在於下列步驟： a) 存放該覆晶於一塡充有助熔劑之空穴中且該等凸塊 面對該空穴之底部，該空穴之底部係透明的； b) 從該第一位置移動該空穴至一第二位置，以進入一 攝影機之視野中； c) (經由該空穴之底部）拍攝該覆晶之凸塊的圖像及確 定該覆晶之位置；以及 d) 從該空穴移開該覆晶、移動該覆晶至該基板及放置 該覆晶於該基板上。 要確保這是可能的，該空穴之底部係由一透明材料所 構成且是位於該攝影機之視野內。該攝影機最好是直接配 置在該空穴下面。在圖像之拍攝期間，藉由在該攝影機旁 所配置之發光裝置照射該覆晶之凸塊。要確保沒有光或儘 可能少的光在該底部上被反射，該底部最好是由一不反射 光之材料（例如，具有抗反射塗層之光學玻璃）所構成。 在步驟d)後，再次有利地從該二位置移動該空穴至該 第一位置及以助熔劑塡充該空穴。可以數個空穴實施上述 200843006 程序步驟。最好同時移動該等空穴。逐步地以一軸爲中心 特別旋轉該等空穴。 另一種用以在一基板上安裝一具有凸塊之半導體晶片 成爲覆晶之方法包括下列步驟： a) 放置一覆晶於一工作台上且使該等凸塊接觸該工作 台； b) 旋轉及/或移位該工作台，以便移動該覆晶至另一位 置； c) 從該工作台移開該覆晶及放置該覆晶於一具有透明 底部之空穴中且使該等凸塊面對該空穴之底部； d) 經由該空穴之底部拍攝該覆晶之凸塊的圖像及確定 該覆晶之位置；以及 e) 從該空穴移開該覆晶、移動該覆晶至該基板及放置 該覆晶於該基板上。 本發明同樣是有關於一種用以在一基板上安裝一具有 凸塊之半導體晶片成爲覆晶之設備，該機構包括：一翻轉設 備，用以翻轉及提供半導體晶片成爲覆晶；一裝置，該裝 置具有一用以在第一位置上接收一覆晶之有透明底部的第 一空穴及至少一用以接收另一覆晶之有透明底部的第二空 穴；一攝影機，用以經由該等空穴之底部在第二位置上確 定該覆晶之位置及方位；以及一拾取及放置系統，以該第 一空穴及該第二空穴可從該第一位置移動至該第二放置及 從該第二位置移動至該第一位置方式放置該覆晶於該基板 200843006 上。在一較佳解決方式中，當該第一空穴位於該第一位置 上時’該第二空穴位於該第二位置上，反之亦然。 現在參考實施例及圖式以較詳細說明本發明。 【實施方式】 第1圖顯示一用以安裝具有凸塊1之半導體晶片2成 爲覆晶之設備的剖面圖，其中爲了依據本發明之方法最佳 化其機構。以X、y及z表示笛卡兒座標系統之三個座標軸。 該y座標以垂直於圖式之平面方式來延伸。該設備包括一 用以供應半導體晶片2之晶圓工作台3 ; —用以將該等半 導體晶片2從該晶圓工作台3移開及轉移至一翻轉設備5 之裝置4,該翻轉設備5翻轉該等半導體晶片2及提供它們 成爲覆晶；一用以以一助熔劑潤濕該等覆晶之凸塊的裝置 6 ;至少一用以確定該等覆晶之位置及方位的攝影機7 ; — 用以供應及提供該等基板9之運輸系統8 ;以及一用以從 上述裝置6接收該等覆晶及放置它們於該基板9上之拾取 及放置系統1 0。該拾取及放置系統1 〇包括一接合頭1 1， 該接合頭1 1可在x/y平面上移動且包括至少一用以抓取一 覆晶1 3之吸夾1 2。該接合頭1 1最好包括兩個或更多吸夾 (亦即，數個吸夾），以便它可從該裝置6運送一個以上覆 晶至該基板9。下面假設該接合頭1 1之吸夾的數目爲n = 2。 最好調整該设備之其匕部分至該數目n，以便例如呈現η = 2 之攝影機7及該翻轉設備5亦包括η：ζ2之吸夾。 在一晶圓上所共同產生且然後以切割方式分離成爲個 200843006 別半導體晶片之該等半導體晶片2附著至一由一框架所握 持之金屬薄片。該框架被夾在該晶圓工作台3上。該等半 導體晶片2之凸塊1朝上。該裝置4包括一拾取頭，該拾 取頭係可在X、y及z方向上移位且包括至少一吸夾。該晶 圓工作台3週期地提供一個半導體晶片2接一個的半導體 晶片在該拾取頭所要收集的預定位置及被轉移至該翻轉設 備5之兩個吸夾中之一。該拾取頭之吸夾在具有凸塊1之 側握持該半導體晶片2，該翻轉設備5之吸夾在後側上握 C' 持該半導體晶片2。該翻轉設備5翻轉該等半導體晶片2， 以便現在該等凸塊1朝下。該等翻轉之半導體晶片2被稱 爲覆晶。在第1圖中，該拾取及放置系統1 〇之接合頭U 的吸夾12握持一*覆晶13。 下面描述兩個實施例，其中該翻轉設備5轉移兩個覆 晶至用以以助熔劑潤濕該等覆晶之凸塊1的裝置6。 範例1 弟2 Η以上視0頒不該裝置6。裝置6包括一可以一垂 直軸14爲中心旋轉之工作台15且包括兩倍^ = 2之空穴 1 6，其依據它們的瞬間位置以標籤A或B來表示。工作台 1 5包括一透明台板1 7。台板1 7係由一大致半透明及不反 射光之材料（例如··光學玻璃，最好是具有抗反射塗層之光 學玻璃）所構成。爲了形成該等空穴丨6，將一構成有凹部之 薄片18黏合至該板17。以固定方式將該等n = 2攝影機7 配置在該等空穴16B下方之位置B處。該兩個攝影機7之 200843006 視野面對該台板1 7，該兩個空穴i 6 B中之一位於該第一攝 影機之視野內及該兩個空穴丨6 B中之另一空穴位於該第二 攝影機之視野內。發光裝置係配置在靠近用以從下方照射 該等空穴16B之攝影機7。該裝置6進一步包括一具有該 助;丨谷劑之開口向下容器1 9及一用以以該軸1 4爲中心旋轉 該工作台15之馬達20。該容器19靠在工作台15上及因而 接觸該薄片1 8。 下文描述在必須以助熔劑潤濕該半導體晶片2之凸塊 ί ' 1的狀況下’將一半導體晶片2安裝在一基板9上成爲一覆 晶1 3。依據下面步驟來安裝； Α)以一個半導體晶片2接一個在一預定位置呈現的方 式’週期地位移晶圓工作台3，因此所呈現半導體晶片2 被該拾取頭收集及轉移至該翻轉設備5。一旦該翻轉設備5 之兩個吸夾已接收一半導體晶片，該翻轉設備5繞~水平 軸旋轉1 80°。現在，以此方式所翻轉之半導體晶片被放置 在該工作台15上之兩個空穴16Α中成爲覆晶13。該覆晶 1 3之凸塊浸入該助熔劑及接觸該透明台板1 7。在第2圖 中，兩個覆晶13位於該等空穴16Α中。 Β)使該工作台1 5繞垂直軸1 4旋轉在此範例中，約 1 8 0°，以便具有該等覆晶1 3之空穴1 6從位置Α移μ f立 置B。在第2圖中以箭頭21顯示旋轉之方向。然後，該等 覆晶1 3之凸塊1位於該等攝影機7之視野內。 C)該照明裝置照射具有該等凸塊1之覆晶13的$胃& •10- 200843006 該等攝影機7經由該透明底部拍攝該相關覆晶1 3之圖像。 每一攝影機7與一影像處理模組相關聯，該影像處理模組 評估該拍攝圖像及確定該個別覆晶1 3之實際位置及方位 或離該期望位置及方位之偏向。 D) 該拾取及放置系統1 〇從位置B上之空穴1 6收集該 兩個覆晶1 3。 E) 該拾取及放置系統10移動該等覆晶13至該預定基 板位置及連續地放置該等覆晶13於該基板9上。200843006 IX. Description of the Invention: [Technical Field] The present invention relates to a method and apparatus for mounting a semiconductor wafer on a substrate to form a flip chip. A flip-chip-semiconductor wafer having a surface having a so-called bump through which electrical connection to the substrate is performed. [Prior Art] When a semiconductor wafer is mounted on a substrate to be flip chip, the substrate is typically used on a horizontal alignment support surface and the semiconductor wafers are provided on a wafer stage and the semiconductor wafers are convex. The block is up. The semiconductor wafer is then removed from the wafer table by a flipping device, then inverted (turned over, indicating the name flip-chip) and transferred to the bond head of the device. The bonding head brings the flip chip to a wetting device for wetting the bumps with a flux, and then to a static camera for determining the actual position and orientation (rotational position) of the flip chip, It is then brought to the substrate and the flip chip is placed on the substrate to correct the deviation of the actual position and orientation of the flip chip from its desired position. A similar installation method is known from U S 2 0 0 3 0 1 7 7 6 3 3 . A device and a method are known from US 5 3 7 22 94, wherein the flip chip is placed in a cavity filled with a flux and the bottom of the cavity is transparent so that The camera disposed under the cavity detects the position of the bump of the flip chip. SUMMARY OF THE INVENTION The object of the present invention is to speed up the installation sequence. 200843006 The present invention consists of the features recited in claims 1, 7, and 9. The preferred embodiment is obtained from the dependent claims. The present invention is based on the discovery that when the bond heads are used to place the flip chips on the substrate, the flip chips are concentrated in a position without being stored by the flip device, The installation sequence will become faster. Therefore, the present invention provides a method for mounting a semiconductor wafer having bumps on a substrate to form a flip chip, which is characterized by the following steps: a) storing the flip chip in a cavity filled with a flux and The bumps face the bottom of the cavity, the bottom of the cavity being transparent; b) moving the cavity from the first position to a second position to enter a field of view of a camera; c) The bottom of the hole) captures an image of the flip chip and determines the position of the flip chip; and d) removes the flip chip from the hole, moves the flip chip to the substrate, and places the flip chip on On the substrate. To ensure this is possible, the bottom of the cavity is made of a transparent material and is located within the field of view of the camera. Preferably, the camera is disposed directly below the cavity. During the shooting of the image, the flip chip bump is illuminated by a light emitting device disposed adjacent to the camera. To ensure that no light or as little light is reflected on the bottom, the bottom is preferably constructed of a material that does not reflect light (e.g., an optical glass with an anti-reflective coating). After step d), it is again advantageous to move the cavity from the two positions to the first position and to fill the cavity with a flux. The above steps of 200843006 can be implemented with several holes. It is preferable to move the holes at the same time. The holes are rotated in particular, centered on one axis. Another method for mounting a bumped semiconductor wafer on a substrate to form a flip chip includes the steps of: a) placing a flip chip on a table and contacting the bumps to the table; b) rotating And/or shifting the table to move the flip chip to another location; c) removing the flip chip from the table and placing the flip chip in a cavity having a transparent bottom and causing the bumps Facing the bottom of the cavity; d) taking an image of the flip chip bump and determining the position of the flip chip via the bottom of the hole; and e) removing the flip chip from the hole, moving the overlay Crystallizing onto the substrate and placing the overlay on the substrate. The present invention is also directed to an apparatus for mounting a semiconductor wafer having bumps on a substrate to form a flip chip, the mechanism comprising: a flipping device for flipping and providing a semiconductor wafer to be flip chip; The device has a first cavity for receiving a cuvette with a transparent bottom at a first location and at least one second cavity for receiving a transparent bottom of another flip chip; a camera for passing the The bottom of the cavity determines the position and orientation of the flip chip at the second position; and a pick and place system for moving the first hole and the second hole from the first position to the second position And moving the flip chip on the substrate 200843006 by moving from the second position to the first position. In a preferred solution, the second cavity is located in the second position when the first cavity is in the first position, and vice versa. The invention will now be described in greater detail with reference to the embodiments and drawings. [Embodiment] Fig. 1 shows a cross-sectional view of an apparatus for mounting a semiconductor wafer 2 having bumps 1 as a flip chip, wherein the mechanism is optimized for the method according to the present invention. The three coordinate axes of the Cartesian coordinate system are represented by X, y and z. The y coordinate extends in a plane perpendicular to the drawing. The apparatus comprises a wafer table 3 for supplying semiconductor wafers 2; means 4 for removing and transferring the semiconductor wafers 2 from the wafer table 3 to a flipping device 5, the turning device 5 Turning the semiconductor wafers 2 and providing them into a flip chip; a device 6 for wetting the bumps of the flip chip with a flux; at least one camera 7 for determining the position and orientation of the flip chips; A transport system 8 for supplying and providing the substrates 9; and a pick and place system 10 for receiving the flip chips from the device 6 and placing them on the substrate 9. The pick and place system 1 includes a joint head 1 1 that is movable in the x/y plane and includes at least one suction clip 1 2 for gripping a flip chip 13 . The bond head 1 1 preferably includes two or more suction clips (i.e., a plurality of suction clips) so that it can carry more than one overlay from the device 6 to the substrate 9. It is assumed below that the number of suction jaws of the joint head 11 is n = 2. Preferably, the remaining portion of the device is adjusted to the number n such that, for example, the camera 7 exhibiting n = 2 and the inverting device 5 also includes a suction clamp of n: ζ2. The semiconductor wafers 2 co-produced on a wafer and then separated by dicing into a 200843006 semiconductor wafer are attached to a metal foil held by a frame. The frame is clamped to the wafer table 3. The bumps 1 of the semiconductor wafers 2 face upward. The device 4 includes a pick-up head that is displaceable in the X, y, and z directions and includes at least one suction clip. The wafer stage 3 periodically supplies one semiconductor wafer 2 to the semiconductor wafer at a predetermined position to be collected by the pickup head and transferred to one of the two suction clamps of the inverting device 5. The pickup of the pickup head holds the semiconductor wafer 2 on the side having the bump 1, and the suction clip of the inverting device 5 holds the semiconductor wafer 2 on the rear side. The flipping device 5 flips the semiconductor wafers 2 so that the bumps 1 now face downward. The inverted semiconductor wafer 2 is referred to as flip chip. In Fig. 1, the suction pin 12 of the bonding head U of the picking and placing system 1 holds a * flip chip 13. Two embodiments are described below in which the inverting device 5 transfers two crystals to a device 6 for wetting the bumps 1 with a flux. Example 1 Brother 2 Η Above 0 0 is not the device 6. The apparatus 6 includes a table 15 that is rotatable about a vertical axis 14 and includes holes 1-6 of twice ^ 2, which are indicated by labels A or B depending on their instantaneous positions. The workbench 15 includes a transparent platen 17. The platen 17 is composed of a material that is substantially translucent and non-reflective (e.g., optical glass, preferably optical glass with an anti-reflective coating). In order to form the hole defects 6, a sheet 18 constituting a concave portion is bonded to the plate 17. The n=2 cameras 7 are arranged in a fixed manner at a position B below the holes 16B. The 200843006 field of view of the two cameras 7 faces the platen 107, one of the two holes i 6 B is located in the field of view of the first camera and the other cavity of the two holes 丨 6 B is located Within the field of view of the second camera. The illuminating device is disposed adjacent to the camera 7 for illuminating the holes 16B from below. The apparatus 6 further includes an opening to the container 19 having the help; the threshing agent and a motor 20 for rotating the table 15 about the axis 14. The container 19 rests on the table 15 and thus contacts the sheet 18. Hereinafter, a semiconductor wafer 2 is mounted on a substrate 9 as a crystal 13 in a state in which it is necessary to wet the bump 1 of the semiconductor wafer 2 with a flux. The wafer table 3 is periodically displaced in a manner that a semiconductor wafer 2 is presented one after another at a predetermined position, so that the presented semiconductor wafer 2 is collected and transferred to the inverting device 5 by the pickup. . Once the two suction clips of the turning device 5 have received a semiconductor wafer, the turning device 5 is rotated by 180° about the horizontal axis. Now, the semiconductor wafer flipped in this manner is placed in the two holes 16 of the stage 15 to become the flip chip 13. The bump of the flip chip 13 is immersed in the flux and contacts the transparent platen 17. In Fig. 2, two flip chips 13 are located in the holes 16Α. Β) rotating the table 15 about the vertical axis 14 in this example, about 180°, so that the holes 16 having the flip-chips 1 are shifted from position to position B. The direction of rotation is indicated by arrow 21 in Fig. 2. The bumps 1 of the flip chip 13 are then located within the field of view of the cameras 7. C) The illumination device illuminates the stomach with the flip chip 13 of the bumps 1 • 10 - 200843006 The cameras 7 take an image of the associated flip chip 13 via the transparent bottom. Each camera 7 is associated with an image processing module that evaluates the captured image and determines the actual position and orientation of the individual flip chip 13 or the deviation from the desired position and orientation. D) The pick and place system 1 收集 collects the two flip chips 13 from the holes 16 at position B. E) The pick and place system 10 moves the flip chip 13 to the predetermined substrate position and continuously places the flip chip 13 on the substrate 9.
C 與該等步驟C及D的同時，該裝置4從該晶圓工作台 3收集另外兩個半導體晶片2及將它們放置在位置A上之 空穴1 6中成爲覆晶1 3。 F) 工作台15再次地繞該垂直軸14旋轉180°。該等空 的空穴1 6從位置B移動至位置A。在此程序中，該等空的 空穴1 6在具有該助熔劑之容器1 9下面移動，在該處再次 以助熔劑來塡充該等空的空穴1 6。具有下次覆晶1 3的其它 〇 空穴16從位置A移動至位置B。 因爲以助熔劑塡充該空穴1 6，所以當該拾取及放置系 統10之吸夾12在步驟D中抓取該覆晶13時，該覆晶1 3 之位置及方位不改變。基於此理由，在該吸夾1 2抓取該覆 晶13前，攝影機7可拍攝該覆晶13之圖像。亦有下面的 施用，其中因爲將該助熔劑施加至該基板9，所以不需以 助熔劑潤濕該覆晶1 3之凸塊1。在此情況中，可省略具有 該助熔劑之容器1 9。然後，可能需要以該接合頭1 1之吸夾 -11- 200843006 1 2抓取及握持該覆晶1 3同時該攝影機7拍攝該等凸塊1 之圖像的方式來改變或修改步驟C及D之順序。此外，在 此情況中空八1 6是不需要的，此表示該工作台1 5可以是 一透明板而沒有該黏合薄片1 8。然而，有利地是在此情況 中亦提供空穴’此防止在工作台1 5繞該垂直軸1 4快速旋 轉期間因離心力之發生，該覆晶從工作台1 5射出。 範例2 (、 第3圖以上視圖顯示該裝置6之另一實施例。工作台 15包含四倍n = 2之空穴16。在此實施例中，該工作台15 在每一次旋轉期間旋轉9 0。。在旋轉角度θ = 0 °時，將兩個覆 晶13之每一覆晶存放在相鄰空穴16中；在旋轉角度e = 90。 時’拍攝該等覆晶1 3之凸塊1及從此確定該等覆晶1 3之 位置及方位；在旋轉角度θ = 180。時，該等覆晶13被該拾取 及放置系統1 0所收集及被安裝在該基板9上；以及例如在 旋轉角度θ = 3 15°時，在該工作台15之旋轉期間再次以助熔 ij 劑塡充該等空穴16。 範例3 第4圖以上視圖顯示該裝置6之另一實施例。在此實 施例中，工作台1 5不繞一垂直軸旋轉，然而可在第一位置 X!與第二位置X2間朝該x-方向前後來回移動，其中在該第 一位置X :該翻轉設備5將該等覆晶1 3存放在該等空穴1 6 中及在該第二位置X 2該拾取及放置系統1 〇收集該等覆晶 13 (顯示兩次工作台15，亦即，在該第一位置Xi中以實線 -12- 200843006 來顯示及在該第二位置X 2中以虛線來顯示）。具有該助熔 劑之容器19 一方面與該工作台15 —起在該X -方向上移動 且可在兩個位置Y!與Y2間之y-方向上前後來回移動。工 作台1 5在此範例中包含4個彼此相鄰配置之空穴1 6及於 是呈現4個攝影機7。攝影機7係固定至工作台1 5及因而 與該工作台15緊密在一起，或者如所示在工作台15之第 二位置X2的區域中以固定方式來配置。首先使工作台丄5 位於該第一位置X 1中及以助熔劑塡充該等空穴1 6。依據下 C :: 列步驟安裝該等覆晶： A) 該翻轉設備5在每一空穴16中放置一覆晶13。 B) 使該工作台15在該X-方向上移位至該第二位置χ2。 C) 該等攝影機7拍攝該相關覆晶1 3之凸塊1及確定該 覆晶1 3之位置及方位。依據本實施例，此係在步驟β中之 工作台1 5的移動期間發生，或者一旦該工作台1 5到達該 第二位置Χ2時發生。 1/ D)該拾取及放置系統10從該等空穴16收集該4個覆 晶1 3及將它們放置在該基板上。 Ε)將該工作台在該X-方向上被移回該第一位置χι。 同時’將該容器19在該y -方向上從該等空穴16之一側移 動至該等空穴1 6之另一側。在這樣做當中，以助熔劑塡充 該等空穴16。 最好在下一次通過期間或在步驟E之已結束時，將該 容器19移回至空穴16之第一側。 -13- 200843006 範例1至3提供下面優點：當已以助熔劑潤濕覆J 之凸塊1及已確定該等覆晶1 3之位置及方位時’該拾 放置系統10可收集及安裝該等覆晶13。此大大地減少 取及放置系統1 0之循環時間。 下面描述一實施例，其中用以潤濕該等覆晶之凸 的裝置沒有整合於該工作台1 5中。第5及6圖描述此 方法。 ^ 範例4 Γ — 第5圖示意性地顯示這樣的設備之側視圖。第6 上視圖顯示該設備之部分。不同於第1及2圖所述的 例之處在於：該工作台1 5只有要區分該位置A與該位 之工作，其中該翻轉設備5在該位置A中存放該等覆 及該拾取及放置系統1 〇在該位置B中收集該等覆晶 該台板1 7係一具有或不具有該等空穴1 6之傳統台板 台板1 7在此是否是透明的問題係沒有關係的。用以以 [j 劑潤濕該等覆晶13之凸塊1的裝置6係配置在該工作 之旁邊。它包含一透明台板22，如上所述在該透明台 上黏合例如一具有凹部之薄片1 8，以便形成n = 2之 2 3。以一個空穴2 3位於每一攝影機之視野內的方式， 台板2 2下面配置該η = 2之攝影機7。具有該助熔劑之 19又是一開口向下之容器’該開口向下之容器擱在該 22之薄片18上及可從該等空穴23之一側移動至該等 2 3之另一側。依據下列步驟來安裝： 晶 13 取及 該拾 塊1 解決 圖以 實施 置Β 晶1 3 13 ° 。該 助熔 台15 板22 空穴 在該 容器 台板 空穴 -14. 200843006 A) 該裝置4從該晶圓工作台3收集該等半導體晶片2 及將它們轉移至該翻轉設備5，該翻轉設備5在工作台1 5 上將它們放置成爲覆晶1 3。該等覆晶1 3之凸塊1接觸該台 板1 7。 B) 使該工作台15繞該垂直軸14轉動有約180。，以便 該等覆晶1 3從位置A移動至位置B。 C) 該拾取及放置系統1 〇從工作台1 5收集該兩個覆晶 ^ 1 3、移至該裝置6及降低該等吸夾，直到該等覆晶1 3之凸 塊1浸入該助熔劑及接觸空穴23之底部爲止。 D) 該發光裝置照射具有該等凸塊1之覆晶13的表面， 該等攝影機7之每一攝影機拍攝該相關覆晶1 3之圖像及該 等影像處理模組確定該個別覆晶1 3之位置及方位或離該 期望位置及方位的偏向。 E) 該拾取及放置系統10再次舉起該等吸夾，移動該等 覆晶1 3至該預定基板位置及連續地放置該等覆晶1 3於該 [基板9上。 在該等步驟C及D的同時，該裝置4從該晶圓工作台 3收集另外兩個半導體晶片2及將它們放置在該工作台上 成爲覆晶13。當該等攝影機7已拍攝該圖像及在該等影像 處理模組完成它們的工作前，該拾取及放置系統1 0立即可 在步驟E中舉起該等吸夾。 該等較佳方法共同具有下面相關方法步驟： A)放置該覆晶於一具有透明底部之空穴中且該等凸塊 -15- 200843006 面對該空穴之底部； B) 移動該空穴至一攝影機之視野內； C) 拍攝該覆晶之凸塊的圖像及確定該覆晶之位置； D) 從該空穴取出該覆晶、移動該覆晶至該基板及放置 該覆晶於該基板上。 該覆晶可在步驟C)前或後被該拾取及放置系統10之 接合頭1 1的吸夾1 2所抓取及以剩餘程序來操控。本發明 並非侷限於以該晶圓工作台3、該裝置4及該翻轉設備5 C 一 來提供該寺半導體晶片’亦可以不同於上述之方式供應該 等覆晶至該設備之工作台1 5。該等不同零件之吸夾的數目 不是本發明之主要關聯，然而爲了達成該整個設備之最佳 生產量可有利地彼此調整它們。 最好例如像下面以數個空穴來實施該等方法步驟，： A)將複數個覆晶每個施置在一具有透明底部之空穴中 且該等凸塊面對該空穴之底部； ( B)將該等空穴每個連接移動至一攝影機之視野內； C) 拍攝每一覆晶之凸塊的圖像及確定每一覆晶之位 置； D) 從該等空穴取出該等覆晶、移動該等覆晶至該基板 及放置該等覆晶於相同基板上或不同基板上。 【圖式簡單說明】 第1圖顯示一用以安裝覆晶之設備的剖面圖，其是用 以實施依據本發明之方法之最佳化的設備； -16- 200843006 第2-4圖顯示一用以以助熔劑潤濕該覆晶之凸塊及確 定該覆晶之位置及方位的裝置之不同實施例的上視圖； 第5圖顯示另一設備之剖面；以及 第6圖顯示該設備之一剖分的上視圖。 【主要元件符號說明】 1 凸塊 2 半導體晶片 3 晶圓工作台 4 裝置 5 翻轉設備 6 裝置 7 攝影機 8 運輸系統 9 基板 10 拾取及放置系統 11 接合頭 12 吸夾 13 覆晶 14 垂直軸 15 工作台 16 空穴 16A 空穴 1 6B 空穴 17 透明台板 18 薄片 -17- 200843006 19 開 □ 向 下之容器 20 馬 達 21 箭 頭 22 透 明 台 板 23 空 穴 A 位 置 B 位 置 Xl 第 一 位 置 X2 第 二 位 置 Yl 位 置 γ2 位 置C. At the same time as the steps C and D, the apparatus 4 collects the other two semiconductor wafers 2 from the wafer stage 3 and places them in the holes 16 in the position A to become the flip chip 13 . F) The table 15 is again rotated 180° about the vertical axis 14. The empty holes 16 move from position B to position A. In this procedure, the empty voids 16 are moved underneath the vessel 19 having the flux, where the voids 16 are again filled with flux. The other 空穴 hole 16 having the next flip chip 13 moves from position A to position B. Since the hole 16 is filled with the flux, when the suction pin 12 of the pick-and-place system 10 picks up the flip chip 13 in step D, the position and orientation of the flip chip 13 do not change. For this reason, the camera 7 can take an image of the flip chip 13 before the suction pin 12 grips the flip chip 13. There is also the application below, wherein since the flux is applied to the substrate 9, it is not necessary to wet the bump 1 of the flip chip 13 with a flux. In this case, the container 19 having the flux can be omitted. Then, it may be necessary to change or modify step C by grasping and holding the flip chip 1 3 with the suction clip -11- 200843006 1 2 of the bonding head 1 1 while the camera 7 captures an image of the bumps 1 . And the order of D. Further, in this case, the hollow 186 is not required, which means that the table 15 can be a transparent plate without the adhesive sheet 18. However, it is advantageous to also provide voids in this case. This prevents the flip-chip from exiting from the table 15 during the rapid rotation of the table 15 about the vertical axis 14 due to centrifugal forces. Example 2 (Figure 3 above shows another embodiment of the device 6. The table 15 contains four times n = 2 of holes 16. In this embodiment, the table 15 is rotated 9 during each rotation. When the rotation angle θ = 0 °, each of the two flip-chips 13 is stored in the adjacent cavity 16; when the rotation angle e = 90, the convexity of the flip-chip 1 3 is taken. Block 1 and determining the position and orientation of the flip chip 13; and when the rotation angle θ = 180, the flip chip 13 is collected by the pick and place system 10 and mounted on the substrate 9; For example, at a rotation angle θ = 3 15°, the holes 16 are again filled with the flux ij during the rotation of the table 15. Example 3 Figure 4 is a view showing another embodiment of the device 6. In this embodiment, the table 15 does not rotate about a vertical axis, but can move back and forth between the first position X! and the second position X2 in the x-direction, wherein in the first position X: the flip The device 5 stores the flip-chips 1 3 in the holes 16 and in the second position X 2 the pick-and-place system 1 collects the overlays 13 (The workbench 15 is displayed twice, that is, in the first position Xi, shown by the solid line -12-200843006 and in the second position X2 as a broken line.) The container 19 having the flux On the one hand, it moves in the X-direction together with the table 15 and can move back and forth in the y-direction between the two positions Y! and Y2. The workbench 15 includes four adjacent to each other in this example. The configured holes 1 6 then present four cameras 7. The camera 7 is fixed to the table 15 and thus to the table 15 or, as shown, in the region of the second position X2 of the table 15 It is configured in a fixed manner. First, the table 5 is placed in the first position X 1 and the holes are filled with the flux 16. The flip chip is installed according to the following C:: column step: A) the flip Device 5 places a flip chip 13 in each cavity 16. B) The table 15 is displaced in the X-direction to the second position χ2. C) The cameras 7 take the bumps 1 of the associated flip chip 13 and determine the position and orientation of the flip chip 13. According to this embodiment, this occurs during the movement of the table 15 in step β or once the table 15 reaches the second position Χ2. 1/ D) The pick and place system 10 collects the four crystals 13 from the holes 16 and places them on the substrate. Ε) The workbench is moved back to the first position χι in the X-direction. At the same time, the container 19 is moved from one side of the holes 16 to the other side of the holes 16 in the y-direction. In doing so, the holes 16 are filled with a flux. Preferably, the container 19 is moved back to the first side of the cavity 16 during the next pass or at the end of step E. -13- 200843006 Examples 1 to 3 provide the advantage that the pick-and-place system 10 can collect and install the bump 1 that has been wetted by the flux and the position and orientation of the flip chip 13 have been determined Isomorphous crystal 13. This greatly reduces the cycle time for taking and placing the system 10 . An embodiment is described below in which the means for wetting the bumps are not integrated into the table 15. Figures 5 and 6 depict this method. ^ Example 4 Γ - Figure 5 schematically shows a side view of such a device. The sixth upper view shows the part of the device. The difference from the example described in Figures 1 and 2 is that the workbench 15 has only the work of distinguishing between the position A and the position, wherein the turning device 5 stores the cover and the pick-up in the position A. Placing system 1 收集 collecting the flip-chip in the position B. The problem of whether the conventional platen plate 7 with or without the holes 16 is transparent here is irrelevant. . A device 6 for wetting the bumps 1 of the flip chip 13 is disposed beside the work. It comprises a transparent platen 22 to which, for example, a sheet 18 having a recess is bonded to the transparent table as described above to form n = 2 of 23. The camera 7 of n = 2 is disposed below the platen 2 2 in such a manner that a cavity 2 3 is located in the field of view of each camera. The fluxing agent 19 is in turn an open-down container. The opening-down container rests on the sheet 18 of the 22 and is movable from one side of the holes 23 to the other side of the cubes . Install according to the following steps: Crystal 13 Take the pick 1 and solve the figure to implement the crystal 1 3 13 °. The fusing table 15 plate 22 is in the container platen cavity. 14. 200843006 A) The device 4 collects the semiconductor wafers 2 from the wafer table 3 and transfers them to the inverting device 5, the inversion The device 5 places them on the table 15 as a flip chip 13 . The bumps 1 of the flip chip 1 3 are in contact with the plate 17. B) The table 15 is rotated about the vertical axis 14 by about 180. So that the flip chip 13 moves from position A to position B. C) The pick and place system 1 收集 collects the two flip chips from the work station 15 , moves to the device 6 and lowers the suction clips until the bumps 1 of the flip chip 1 3 are immersed in the help The flux and the bottom of the contact hole 23 are as follows. D) the illuminating device illuminates the surface of the flip chip 13 having the bumps 1, each camera of the cameras 7 takes an image of the associated flip chip 13 and the image processing modules determine the individual flip chip 1 The position and orientation of 3 or the deviation from the desired position and orientation. E) The pick and place system 10 lifts the suction clips again, moves the flip chip 13 to the predetermined substrate position, and continuously places the flip chip 13 on the [substrate 9. At the same time as the steps C and D, the apparatus 4 collects the other two semiconductor wafers 2 from the wafer stage 3 and places them on the stage to become the flip chip 13. The pick and place system 10 can immediately lift the suction clips in step E when the cameras 7 have taken the images and before the image processing modules have completed their work. The preferred methods have the following related method steps: A) placing the flip chip in a cavity having a transparent bottom and the bumps -15-200843006 facing the bottom of the cavity; B) moving the hole Go to the field of view of the camera; C) take an image of the flip chip and determine the position of the flip chip; D) take the flip chip from the hole, move the flip chip to the substrate, and place the flip chip On the substrate. The flip chip can be grasped by the suction pin 12 of the bonding head 1 of the pick and place system 10 before or after the step C) and manipulated with the remaining program. The present invention is not limited to providing the temple semiconductor wafer by the wafer table 3, the device 4, and the inverting device 5 C. The same can be supplied to the table 15 of the device in a manner different from the above. . The number of suction jaws of the different parts is not a primary association of the present invention, however, it may be advantageous to adjust them to each other in order to achieve an optimum throughput of the entire apparatus. Preferably, the method steps are carried out, for example, by a number of cavities, as follows: A) applying a plurality of flip-chips each in a cavity having a transparent bottom and the bumps facing the bottom of the cavity (B) moving each connection of the holes into the field of view of a camera; C) taking an image of each flip chip and determining the position of each flip chip; D) taking out the holes The flipping, moving the flip-chip to the substrate and placing the flip-chip on the same substrate or on different substrates. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing an apparatus for mounting a flip chip, which is an apparatus for implementing an optimization method according to the present invention; -16- 200843006 a top view of a different embodiment of a device for wetting a bump of the flip chip with a flux and determining the position and orientation of the flip chip; Figure 5 shows a cross section of another device; and Figure 6 shows the device A top view of a split. [Main component symbol description] 1 bump 2 semiconductor wafer 3 wafer table 4 device 5 flip device 6 device 7 camera 8 transport system 9 substrate 10 pick and place system 11 bond head 12 suction clip 13 flip chip 14 vertical axis 15 work Table 16 Hole 16A Hole 1 6B Hole 17 Transparent platen 18 Sheet -17- 200843006 19 Open □ Lower container 20 Motor 21 Arrow 22 Transparent platen 23 Hole A Position B Position Xl First position X2 Second Position Yl position γ2 position
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