KR102597252B1 - 범프를 구비하는 반도체를 기판의 기판 위치상에 장착하기 위한 방법 - Google Patents

범프를 구비하는 반도체를 기판의 기판 위치상에 장착하기 위한 방법 Download PDF

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KR102597252B1
KR102597252B1 KR1020160103073A KR20160103073A KR102597252B1 KR 102597252 B1 KR102597252 B1 KR 102597252B1 KR 1020160103073 A KR1020160103073 A KR 1020160103073A KR 20160103073 A KR20160103073 A KR 20160103073A KR 102597252 B1 KR102597252 B1 KR 102597252B1
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South Korea
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substrate
camera
bonding head
optical marking
flip chip
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KR1020160103073A
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Korean (ko)
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KR20170026136A (ko
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플로리안 슈페르
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베시 스위처랜드 아게
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020160103073A 2015-08-31 2016-08-12 범프를 구비하는 반도체를 기판의 기판 위치상에 장착하기 위한 방법 KR102597252B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH12482015 2015-08-31
CH1248/15 2015-08-31
CH01404/15A CH711536B1 (de) 2015-08-31 2015-09-28 Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.
CH1404/15 2015-09-28

Publications (2)

Publication Number Publication Date
KR20170026136A KR20170026136A (ko) 2017-03-08
KR102597252B1 true KR102597252B1 (ko) 2023-11-01

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KR1020160103073A KR102597252B1 (ko) 2015-08-31 2016-08-12 범프를 구비하는 반도체를 기판의 기판 위치상에 장착하기 위한 방법

Country Status (7)

Country Link
JP (1) JP6868982B2 (zh)
KR (1) KR102597252B1 (zh)
CN (1) CN106486400B (zh)
CH (1) CH711536B1 (zh)
MY (1) MY176667A (zh)
SG (1) SG10201606167WA (zh)
TW (1) TWI700767B (zh)

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JP7164314B2 (ja) * 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
CN109079367B (zh) * 2018-07-23 2020-07-24 中电科技（合肥）博微信息发展有限责任公司 一种芯片智能焊接方法
JP2023077928A (ja) * 2021-11-25 2023-06-06 キヤノン株式会社 接合装置および接合方法

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