KR102597252B1 - 범프를 구비하는 반도체를 기판의 기판 위치상에 장착하기 위한 방법 - Google Patents

범프를 구비하는 반도체를 기판의 기판 위치상에 장착하기 위한 방법 Download PDF

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KR102597252B1
KR102597252B1 KR1020160103073A KR20160103073A KR102597252B1 KR 102597252 B1 KR102597252 B1 KR 102597252B1 KR 1020160103073 A KR1020160103073 A KR 1020160103073A KR 20160103073 A KR20160103073 A KR 20160103073A KR 102597252 B1 KR102597252 B1 KR 102597252B1
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substrate
camera
bonding head
optical marking
flip chip
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KR20170026136A (ko
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플로리안 슈페르
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베시 스위처랜드 아게
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020160103073A 2015-08-31 2016-08-12 범프를 구비하는 반도체를 기판의 기판 위치상에 장착하기 위한 방법 Active KR102597252B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH12482015 2015-08-31
CH1248/15 2015-08-31
CH1404/15 2015-09-28
CH01404/15A CH711536B1 (de) 2015-08-31 2015-09-28 Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.

Publications (2)

Publication Number Publication Date
KR20170026136A KR20170026136A (ko) 2017-03-08
KR102597252B1 true KR102597252B1 (ko) 2023-11-01

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Country Status (7)

Country Link
JP (1) JP6868982B2 (enrdf_load_stackoverflow)
KR (1) KR102597252B1 (enrdf_load_stackoverflow)
CN (1) CN106486400B (enrdf_load_stackoverflow)
CH (1) CH711536B1 (enrdf_load_stackoverflow)
MY (1) MY176667A (enrdf_load_stackoverflow)
SG (1) SG10201606167WA (enrdf_load_stackoverflow)
TW (1) TWI700767B (enrdf_load_stackoverflow)

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JP7164314B2 (ja) * 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
CN109079367B (zh) * 2018-07-23 2020-07-24 中电科技（合肥）博微信息发展有限责任公司 一种芯片智能焊接方法
JP7582928B2 (ja) * 2021-11-25 2024-11-13 キヤノン株式会社 接合装置および接合方法

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