JP6861602B2 - 保持部材、保持部材の製造方法、保持機構及び製品の製造装置 - Google Patents

保持部材、保持部材の製造方法、保持機構及び製品の製造装置 Download PDF

Info

Publication number
JP6861602B2
JP6861602B2 JP2017177223A JP2017177223A JP6861602B2 JP 6861602 B2 JP6861602 B2 JP 6861602B2 JP 2017177223 A JP2017177223 A JP 2017177223A JP 2017177223 A JP2017177223 A JP 2017177223A JP 6861602 B2 JP6861602 B2 JP 6861602B2
Authority
JP
Japan
Prior art keywords
holding member
product
bga
cured resin
held
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017177223A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019051645A (ja
JP2019051645A5 (enExample
Inventor
幹司 石橋
幹司 石橋
貴俊 尾関
貴俊 尾関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2017177223A priority Critical patent/JP6861602B2/ja
Priority to KR1020180080962A priority patent/KR102157533B1/ko
Priority to CN201810889280.4A priority patent/CN109509708B/zh
Priority to TW107128275A priority patent/TWI726230B/zh
Publication of JP2019051645A publication Critical patent/JP2019051645A/ja
Publication of JP2019051645A5 publication Critical patent/JP2019051645A5/ja
Application granted granted Critical
Publication of JP6861602B2 publication Critical patent/JP6861602B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Dicing (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2017177223A 2017-09-15 2017-09-15 保持部材、保持部材の製造方法、保持機構及び製品の製造装置 Active JP6861602B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017177223A JP6861602B2 (ja) 2017-09-15 2017-09-15 保持部材、保持部材の製造方法、保持機構及び製品の製造装置
KR1020180080962A KR102157533B1 (ko) 2017-09-15 2018-07-12 보유 지지 부재, 보유 지지 부재의 제조 방법, 보유 지지 기구 및 제품의 제조 장치
CN201810889280.4A CN109509708B (zh) 2017-09-15 2018-08-07 保持构件及其制造方法、保持机构以及制品的制造装置
TW107128275A TWI726230B (zh) 2017-09-15 2018-08-14 保持構件、保持構件的製造方法、保持機構以及製品的製造裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017177223A JP6861602B2 (ja) 2017-09-15 2017-09-15 保持部材、保持部材の製造方法、保持機構及び製品の製造装置

Publications (3)

Publication Number Publication Date
JP2019051645A JP2019051645A (ja) 2019-04-04
JP2019051645A5 JP2019051645A5 (enExample) 2019-10-24
JP6861602B2 true JP6861602B2 (ja) 2021-04-21

Family

ID=65745574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017177223A Active JP6861602B2 (ja) 2017-09-15 2017-09-15 保持部材、保持部材の製造方法、保持機構及び製品の製造装置

Country Status (4)

Country Link
JP (1) JP6861602B2 (enExample)
KR (1) KR102157533B1 (enExample)
CN (1) CN109509708B (enExample)
TW (1) TWI726230B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240071983A1 (en) * 2022-08-30 2024-02-29 Samsung Electronics Co., Ltd. Solder ball attaching apparatus

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6952737B2 (ja) * 2019-05-24 2021-10-20 Ｔｏｗａ株式会社 保持部材、検査機構、切断装置、保持対象物の製造方法及び保持部材の製造方法
CN110853507B (zh) * 2019-06-14 2022-08-09 荣耀终端有限公司 一种显示屏和电子设备
KR102888135B1 (ko) * 2021-03-18 2025-11-19 토와 가부시기가이샤 가공 장치 및 가공품의 제조 방법
JP7464575B2 (ja) * 2021-12-14 2024-04-09 Ｔｏｗａ株式会社 切断装置、及び切断品の製造方法
JP7586067B2 (ja) * 2021-12-23 2024-11-19 三菱電機株式会社 チップトレイおよび半導体装置の製造方法
JP2025018098A (ja) * 2023-07-26 2025-02-06 Ｔｏｗａ株式会社 保持部材、搬送装置、切断用テーブル、切断装置、半導体製造装置、保持部材の製造方法、及び、半導体装置の製造方法
CN119451321B (zh) * 2025-01-03 2025-10-17 惠州市弘正光电有限公司 Smd-led灯珠及其封装工艺

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2801655B2 (ja) 1989-07-03 1998-09-21 電気化学工業株式会社 半導体集積回路装置搬送用トレーの製造法
JPH10209260A (ja) * 1997-01-20 1998-08-07 Kyokuto Shokai:Kk シンジオタクチックスポリスチレンを用いた半導体用搬送トレー
JP3771084B2 (ja) 1999-04-30 2006-04-26 Ｎｅｃエレクトロニクス株式会社 半導体集積回路装置用トレイ
JP2001139089A (ja) 1999-11-17 2001-05-22 Nec Corp 半導体パッケージの収納トレー
JP5366452B2 (ja) * 2008-06-23 2013-12-11 東芝機械株式会社 被成型品の成型方法および成型装置
JP5250868B2 (ja) * 2008-08-04 2013-07-31 セイコーＮｐｃ株式会社 チップ収納トレイ
WO2010114483A1 (en) * 2009-04-03 2010-10-07 Ether Precision, Inc. Methods and devices for manufacturing an array of lenses
KR20130066234A (ko) * 2011-12-12 2013-06-20 삼성전자주식회사 반도체 장치의 제조 방법 및 이에 사용되는 반도체 장치의 픽업 장치
JP5627618B2 (ja) * 2012-02-23 2014-11-19 Ｔｏｗａ株式会社 固定治具の製造方法及び固定治具
JP5918003B2 (ja) * 2012-04-27 2016-05-18 Ｔｏｗａ株式会社 個片化装置用真空吸着シート及びそれを用いた固定治具の製造方法
JP6000902B2 (ja) * 2013-06-24 2016-10-05 Ｔｏｗａ株式会社 電子部品用の収容治具、その製造方法及び個片化装置
JP6333648B2 (ja) * 2014-07-16 2018-05-30 Ｔｏｗａ株式会社 個片化物品の移送方法、製造方法及び製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240071983A1 (en) * 2022-08-30 2024-02-29 Samsung Electronics Co., Ltd. Solder ball attaching apparatus

Also Published As

Publication number Publication date
TW201914797A (zh) 2019-04-16
CN109509708A (zh) 2019-03-22
TWI726230B (zh) 2021-05-01
KR20190031130A (ko) 2019-03-25
KR102157533B1 (ko) 2020-09-18
CN109509708B (zh) 2022-07-12
JP2019051645A (ja) 2019-04-04

Similar Documents

Publication Publication Date Title
JP6861602B2 (ja) 保持部材、保持部材の製造方法、保持機構及び製品の製造装置
JP5897686B1 (ja) ワーク吸着板、ワーク切断装置、ワーク切断方法、およびワーク吸着板の製造方法
KR102157530B1 (ko) 보유 지지 부재의 제조 방법
CN107533965B (zh) 吸附机构、吸附方法、制造装置及制造方法
US6653731B2 (en) Semiconductor device and method for fabricating same
JP4299721B2 (ja) 半導体装置の搬送方法および半導体装置の製造方法
JP6000902B2 (ja) 電子部品用の収容治具、その製造方法及び個片化装置
CN1638071A (zh) 半导体器件的制造方法
JP6785735B2 (ja) 切断装置及び半導体パッケージの搬送方法
KR20040019173A (ko) 웨이퍼 테이블과, 이를 이용한 웨이퍼 쏘잉/소자 접착장치와, 웨이퍼 쏘잉/소자 분류 장치
JP2015211091A (ja) 樹脂封止電子部品の製造方法、突起電極付き板状部材、及び樹脂封止電子部品
JP7303635B2 (ja) ワークの保持方法及びワークの処理方法
KR102813002B1 (ko) 캐리어판의 제거 방법
TWI718447B (zh) 成型模、樹脂成型裝置及樹脂成型品的製造方法
JP7068409B2 (ja) 切断装置及び切断品の製造方法
TW201742231A (zh) 半導體元件載體及包括該半導體元件載體的元件處理器
JP2011181936A (ja) 半導体装置の製造方法
KR100571512B1 (ko) 소잉소터장치의 반도체 패키지 이송방법 및 그 시스템
KR102493451B1 (ko) 기판 공급용 로딩 유닛
JP5507725B2 (ja) 半導体装置の製造方法
KR20230151732A (ko) 반도체 패키지용 몰딩 장치 및 반도체 패키지의 제조 방법
JP4769839B2 (ja) 半導体装置の製造方法
CN112440166A (zh) 法兰盘端面修正装置及方法、切断装置及切断方法
KR102890672B1 (ko) 보유 지지 부재, 반송 장치, 절단용 테이블, 절단 장치, 반도체 제조 장치, 보유 지지 부재의 제조 방법 및 반도체 장치의 제조 방법
WO2025191936A1 (ja) 切断品の製造方法、固定ジグ及び切断装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190910

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190910

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200630

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200908

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20201008

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210316

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210330

R150 Certificate of patent or registration of utility model

Ref document number: 6861602

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250