CN109509708B - 保持构件及其制造方法、保持机构以及制品的制造装置 - Google Patents

保持构件及其制造方法、保持机构以及制品的制造装置 Download PDF

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Publication number
CN109509708B
CN109509708B CN201810889280.4A CN201810889280A CN109509708B CN 109509708 B CN109509708 B CN 109509708B CN 201810889280 A CN201810889280 A CN 201810889280A CN 109509708 B CN109509708 B CN 109509708B
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China
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holding member
cured resin
holding
resin
bga
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CN201810889280.4A
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English (en)
Chinese (zh)
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CN109509708A (zh
Inventor
石桥干司
尾関贵俊
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Towa Corp
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Towa Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Dicing (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN201810889280.4A 2017-09-15 2018-08-07 保持构件及其制造方法、保持机构以及制品的制造装置 Active CN109509708B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017177223A JP6861602B2 (ja) 2017-09-15 2017-09-15 保持部材、保持部材の製造方法、保持機構及び製品の製造装置
JP2017-177223 2017-09-15

Publications (2)

Publication Number Publication Date
CN109509708A CN109509708A (zh) 2019-03-22
CN109509708B true CN109509708B (zh) 2022-07-12

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Family Applications (1)

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CN201810889280.4A Active CN109509708B (zh) 2017-09-15 2018-08-07 保持构件及其制造方法、保持机构以及制品的制造装置

Country Status (4)

Country Link
JP (1) JP6861602B2 (enExample)
KR (1) KR102157533B1 (enExample)
CN (1) CN109509708B (enExample)
TW (1) TWI726230B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6952737B2 (ja) * 2019-05-24 2021-10-20 Ｔｏｗａ株式会社 保持部材、検査機構、切断装置、保持対象物の製造方法及び保持部材の製造方法
CN110853507B (zh) * 2019-06-14 2022-08-09 荣耀终端有限公司 一种显示屏和电子设备
KR102888135B1 (ko) * 2021-03-18 2025-11-19 토와 가부시기가이샤 가공 장치 및 가공품의 제조 방법
JP7464575B2 (ja) * 2021-12-14 2024-04-09 Ｔｏｗａ株式会社 切断装置、及び切断品の製造方法
JP7586067B2 (ja) * 2021-12-23 2024-11-19 三菱電機株式会社 チップトレイおよび半導体装置の製造方法
KR20240030352A (ko) * 2022-08-30 2024-03-07 삼성전자주식회사 솔더볼 부착 장치
JP2025018098A (ja) * 2023-07-26 2025-02-06 Ｔｏｗａ株式会社 保持部材、搬送装置、切断用テーブル、切断装置、半導体製造装置、保持部材の製造方法、及び、半導体装置の製造方法
CN119451321B (zh) * 2025-01-03 2025-10-17 惠州市弘正光电有限公司 Smd-led灯珠及其封装工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013125131A1 (ja) * 2012-02-23 2013-08-29 Ｔｏｗａ株式会社 固定治具の製造方法及び固定治具
CN104245234A (zh) * 2012-04-27 2014-12-24 东和株式会社 单片化装置用真空吸附片和固定夹具的制造方法
CN104241113A (zh) * 2013-06-24 2014-12-24 东和株式会社 电子器件用的收容工具、其制造方法及单片化装置
CN105304542A (zh) * 2014-07-16 2016-02-03 东和株式会社 单片化物品的移送方法、制造方法以及制造装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2801655B2 (ja) 1989-07-03 1998-09-21 電気化学工業株式会社 半導体集積回路装置搬送用トレーの製造法
JPH10209260A (ja) * 1997-01-20 1998-08-07 Kyokuto Shokai:Kk シンジオタクチックスポリスチレンを用いた半導体用搬送トレー
JP3771084B2 (ja) 1999-04-30 2006-04-26 Ｎｅｃエレクトロニクス株式会社 半導体集積回路装置用トレイ
JP2001139089A (ja) 1999-11-17 2001-05-22 Nec Corp 半導体パッケージの収納トレー
JP5366452B2 (ja) * 2008-06-23 2013-12-11 東芝機械株式会社 被成型品の成型方法および成型装置
JP5250868B2 (ja) * 2008-08-04 2013-07-31 セイコーＮｐｃ株式会社 チップ収納トレイ
WO2010114483A1 (en) * 2009-04-03 2010-10-07 Ether Precision, Inc. Methods and devices for manufacturing an array of lenses
KR20130066234A (ko) * 2011-12-12 2013-06-20 삼성전자주식회사 반도체 장치의 제조 방법 및 이에 사용되는 반도체 장치의 픽업 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013125131A1 (ja) * 2012-02-23 2013-08-29 Ｔｏｗａ株式会社 固定治具の製造方法及び固定治具
CN104245234A (zh) * 2012-04-27 2014-12-24 东和株式会社 单片化装置用真空吸附片和固定夹具的制造方法
CN104241113A (zh) * 2013-06-24 2014-12-24 东和株式会社 电子器件用的收容工具、其制造方法及单片化装置
CN105304542A (zh) * 2014-07-16 2016-02-03 东和株式会社 单片化物品的移送方法、制造方法以及制造装置

Also Published As

Publication number Publication date
TW201914797A (zh) 2019-04-16
JP6861602B2 (ja) 2021-04-21
CN109509708A (zh) 2019-03-22
TWI726230B (zh) 2021-05-01
KR20190031130A (ko) 2019-03-25
KR102157533B1 (ko) 2020-09-18
JP2019051645A (ja) 2019-04-04

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