JP6824635B2 - 円盤状基板を取り扱う装置、及び支持アダプター - Google Patents
円盤状基板を取り扱う装置、及び支持アダプター Download PDFInfo
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- 239000000758 substrate Substances 0.000 claims description 63
- 230000005855 radiation Effects 0.000 claims description 8
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- 230000008569 process Effects 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
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- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
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Description
図1〜図4は、微細構造部品の生産中の様々な工程において円盤状基板を取り扱うための装置10を示す。
したがって、インタフェース24は電気機械インタフェースである。
図5は、支持部14に固定された支持アダプター20の平面図である。支持アダプター20は、保持部分40を備え、この保持部分40を通してマスク22が支持アダプター20に規定位置に固定可能である。
Claims (12)
- 円盤状基板(18)を取り扱うための装置(10)であって、
支持部(14)を備え、この支持部は、円盤状基板(18)用の支持面(16)、及び、当該支持部(14)に結合可能で、円盤状基板(18)を取り扱うために使用されるマスク(22)を支持可能な支持アダプター(20)を有し、
ここで、支持部(14)への支持アダプター(20)の結合を検出するインタフェース(24)が設けられており、
さらに、インタフェース(24)と協働し、かつ支持アダプター(20)が支持部(14)に結合されたか否かを検出するコントロールシステム(36)が設けられている、
装置。 - 支持アダプター(20)は、インタフェース(24)によって支持部(14)を、制御ソフトウェア(36)がソフトウェアにおける別のプログラムにアクセスするような方法で、コード化する、請求項1に記載の装置。
- 円盤状基板(18)を取り扱うための装置(10)であって、
支持部(14)を備え、この支持部は、円盤状基板(18)用の支持面(16)、及び、当該支持部(14)に結合可能で、円盤状基板(18)を取り扱うために使用されるマスク(22)を支持可能な支持アダプター(20)を有し、
ここで、支持部(14)への支持アダプター(20)の結合を検出するインタフェース(24)が設けられており、
さらに、インタフェース(24)と協働し、かつ支持アダプター(20)が支持部(14)に結合されたか否かを検出するコントロールシステム(36)が設けられており、
コントロールシステム(36)は、メモリ(38)に接続される、あるいは、支持部(14)及び支持アダプター(20)の値が格納されているメモリを備える、
装置。 - 少なくとも1の放射源(34)、及び/又はマスク(22)を保持可能な1つの保持手段(32)が設けられる、請求項1又は2に記載の装置。
- コントロールシステム(36)は、放射源(34)及び/又は保持手段(32)を作動させる、請求項4に記載の装置。
- 円盤状基板(18)を取り扱うための装置(10)であって、
支持部(14)を備え、この支持部は、円盤状基板(18)用の支持面(16)、及び、当該支持部(14)に結合可能で、円盤状基板(18)を取り扱うために使用されるマスク(22)を支持可能な支持アダプター(20)を有し、
ここで、支持部(14)への支持アダプター(20)の結合を検出するインタフェース(24)が設けられており、
さらに、インタフェース(24)と協働し、かつ支持アダプター(20)が支持部(14)に結合されたか否かを検出するコントロールシステム(36)が設けられており、
インタフェース(24)は、支持アダプター(20)における第1コード化エレメント(26)及び支持部(14)における第2コード化エレメント(28)を備え、第1コード化エレメント及び第2コード化エレメントは、支持部(14)をコード化するために支持アダプター(20)が支持部(14)に結合された状態にて協働する、
装置。 - 第1コード化エレメント(26)はコード化するピンであり、第2コード化エレメント(28)はコード化する開口であり、支持アダプター(20)が支持部(14)に結合した状態でコード化するピンは、コード化する開口に係合する、請求項6に記載の装置。
- 円盤状基板(18)を取り扱うための装置(10)であって、
支持部(14)を備え、この支持部は、円盤状基板(18)用の支持面(16)、及び、当該支持部(14)に結合可能で、円盤状基板(18)を取り扱うために使用されるマスク(22)を支持可能な支持アダプター(20)を有し、
ここで、支持部(14)への支持アダプター(20)の結合を検出するインタフェース(24)が設けられており、
さらに、インタフェース(24)と協働し、かつ支持アダプター(20)が支持部(14)に結合されたか否かを検出するコントロールシステム(36)が設けられており、
支持アダプター(20)は、真空インタフェース(30)によって支持部(14)に結合されている、
装置。 - 円盤状基板(18)を取り扱うための装置(10)であって、
支持部(14)を備え、この支持部は、円盤状基板(18)用の支持面(16)、及び、当該支持部(14)に結合可能で、円盤状基板(18)を取り扱うために使用されるマスク(22)を支持可能な支持アダプター(20)を有し、
ここで、支持部(14)への支持アダプター(20)の結合を検出するインタフェース(24)が設けられており、
さらに、インタフェース(24)と協働し、かつ支持アダプター(20)が支持部(14)に結合されたか否かを検出するコントロールシステム(36)が設けられており、
支持アダプター(20)は、角部領域において、マスク(22)を支持アダプター(20)に保持可能にする保持部分(40)をさらに備える、
装置。 - 円盤状基板(18)を取り扱うための装置(10)であって、
支持部(14)を備え、この支持部は、円盤状基板(18)用の支持面(16)、及び、当該支持部(14)に結合可能で、円盤状基板(18)を取り扱うために使用されるマスク(22)を支持可能な支持アダプター(20)を有し、
ここで、支持部(14)への支持アダプター(20)の結合を検出するインタフェース(24)が設けられており、
さらに、インタフェース(24)と協働し、かつ支持アダプター(20)が支持部(14)に結合されたか否かを検出するコントロールシステム(36)が設けられており、
支持部(14)に関して支持アダプター(20)の回転を防ぐ回転防止(50)が設けられている、
装置。 - 請求項1に記載の装置(10)において使用するための支持アダプター(20)であって、
コード化するエレメント(26)を備える、
支持アダプター。 - 円盤状基板(18)を取り扱うための装置(10)であって、
支持部(14)を備え、この支持部は、円盤状基板(18)用の支持面(16)、及び、当該支持部(14)に結合可能で、円盤状基板(18)を取り扱うために使用されるマスク(22)を支持可能な支持アダプター(20)を有し、
ここで、支持部(14)への支持アダプター(20)の結合を検出するインタフェース(24)が設けられており、
さらに、インタフェース(24)と協働し、かつ支持アダプター(20)が支持部(14)に結合されたか否かを検出するコントロールシステム(36)が設けられており、
インタフェース(24)は、電気機械インタフェースであり、電気機械エレメントが支持部(14)及び/又は支持アダプター(20)に設けられ、ここで電気機械エレメントは、インタフェースの一部であり検出用に使用される、
装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2014864A NL2014864B1 (en) | 2015-05-27 | 2015-05-27 | Device for treating a disc-shaped substrate and support adapter. |
NL2014864 | 2015-05-27 |
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JP2016224435A JP2016224435A (ja) | 2016-12-28 |
JP6824635B2 true JP6824635B2 (ja) | 2021-02-03 |
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US (1) | US10101672B2 (ja) |
JP (1) | JP6824635B2 (ja) |
KR (1) | KR102584913B1 (ja) |
CN (1) | CN106206401B (ja) |
AT (1) | AT517253B1 (ja) |
DE (1) | DE102016109345A1 (ja) |
NL (1) | NL2014864B1 (ja) |
TW (1) | TWI692004B (ja) |
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US10101672B2 (en) | 2018-10-16 |
AT517253A3 (de) | 2018-08-15 |
NL2014864B1 (en) | 2017-01-31 |
CN106206401A (zh) | 2016-12-07 |
TW201709276A (zh) | 2017-03-01 |
AT517253B1 (de) | 2020-07-15 |
JP2016224435A (ja) | 2016-12-28 |
NL2014864A (en) | 2016-12-08 |
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