AT517253A3 - Vorrichtung zur Behandlung eines scheibenfömigen Substrats sowie Trägeradapter - Google Patents

Vorrichtung zur Behandlung eines scheibenfömigen Substrats sowie Trägeradapter

Info

Publication number
AT517253A3
AT517253A3 ATA50469/2016A AT504692016A AT517253A3 AT 517253 A3 AT517253 A3 AT 517253A3 AT 504692016 A AT504692016 A AT 504692016A AT 517253 A3 AT517253 A3 AT 517253A3
Authority
AT
Austria
Prior art keywords
carrier
disc
shaped substrate
treatment
carrier adapter
Prior art date
Application number
ATA50469/2016A
Other languages
English (en)
Other versions
AT517253B1 (de
AT517253A2 (de
Original Assignee
Suss Microtec Lithography Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh filed Critical Suss Microtec Lithography Gmbh
Publication of AT517253A2 publication Critical patent/AT517253A2/de
Publication of AT517253A3 publication Critical patent/AT517253A3/de
Application granted granted Critical
Publication of AT517253B1 publication Critical patent/AT517253B1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

Eine Vorrichtung (10) zur Behandlung eines scheibenförmigen Substrats ist beschrieben, mit einem Träger (14), der eine Trägerfläche (16) für das scheibenförmige Substrat hat, und einem mit dem Träger (14) koppelbaren Trägeradapter (20), der eine Maske (22) tragen kann, die zur Behandlung des scheibenförmigen Substrats verwendet wird. Eine Schnittstelle (24) ist vorgesehen, die die Koppelung des Trägeradapters (20) mit dem Träger (14) erfasst. Zudem ist eine Steuerung (36) vorgesehen, die mit der Schnittstelle (24) zusammenwirkt und erkennt, ob der Trägeradapter (20) mit dem Träger (14) gekoppelt ist, insbesondere die Schnittstelle (24) belegt ist. Ferner ist ein Trägeradapter (20) zur Verwendung in einer solchen Vorrichtung (10) beschrieben.
ATA50469/2016A 2015-05-27 2016-05-24 Vorrichtung zur Behandlung eines scheibenfömigen Substrats sowie Trägeradapter AT517253B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2014864A NL2014864B1 (en) 2015-05-27 2015-05-27 Device for treating a disc-shaped substrate and support adapter.

Publications (3)

Publication Number Publication Date
AT517253A2 AT517253A2 (de) 2016-12-15
AT517253A3 true AT517253A3 (de) 2018-08-15
AT517253B1 AT517253B1 (de) 2020-07-15

Family

ID=53901079

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50469/2016A AT517253B1 (de) 2015-05-27 2016-05-24 Vorrichtung zur Behandlung eines scheibenfömigen Substrats sowie Trägeradapter

Country Status (8)

Country Link
US (1) US10101672B2 (de)
JP (1) JP6824635B2 (de)
KR (1) KR102584913B1 (de)
CN (1) CN106206401B (de)
AT (1) AT517253B1 (de)
DE (1) DE102016109345A1 (de)
NL (1) NL2014864B1 (de)
TW (1) TWI692004B (de)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1060624A (ja) * 1996-08-20 1998-03-03 Matsushita Electric Ind Co Ltd スパッタリング装置
JP2003131387A (ja) * 2001-10-22 2003-05-09 Hitachi Electronics Eng Co Ltd マスクと露光対象基板との搬送に兼用できる搬送アーム及びそれを備えた露光装置
DE102005005124A1 (de) * 2005-02-04 2006-08-10 Robert Bosch Gmbh Belichtungsmaskeneinrichtung und Verfahren zur Ausrichtung einer Vielzahl von Substraten auf eine Belichtungsmaske
US20060209288A1 (en) * 2005-03-18 2006-09-21 Lg. Philips Lcd Co., Ltd. Proximity type exposure apparatus
US20120037819A1 (en) * 2010-08-12 2012-02-16 Heumueller Michael Mask carrier, mask handling module and method for adjusting a mask
WO2012173692A1 (en) * 2011-06-17 2012-12-20 Applied Materials, Inc. Cvd mask alignment for oled processing
US20150024147A1 (en) * 2013-07-19 2015-01-22 Samsung Display Co., Ltd. Plasma-enhanced chemical vapor deposition apparatus and method of manufacturing display apparatus using the same

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3192844A (en) * 1963-03-05 1965-07-06 Kulicke And Soffa Mfg Company Mask alignment fixture
JPS506513B2 (de) * 1972-11-24 1975-03-14
US3912844A (en) 1973-06-01 1975-10-14 Canon Kk Thermal recording method
US3858978A (en) * 1973-08-10 1975-01-07 Kasper Instruments Chuck for use in out-of-contact optical alignment and exposure apparatus
JPS5226214A (en) * 1975-08-25 1977-02-26 Hitachi Ltd Method for coating resist
JPH0248196A (ja) * 1988-06-15 1990-02-16 Canon Inc 搬送装置
JP2919158B2 (ja) * 1992-02-10 1999-07-12 キヤノン株式会社 基板保持装置
JPH09180978A (ja) * 1995-12-27 1997-07-11 Nikon Corp 近接効果補正方法
JPH10270535A (ja) * 1997-03-25 1998-10-09 Nikon Corp 移動ステージ装置、及び該ステージ装置を用いた回路デバイス製造方法
JPH1160624A (ja) 1997-08-19 1999-03-02 Tosoh Corp オレフィン重合用触媒およびポリオレフィンの製造方法
JP2001244313A (ja) 2000-02-28 2001-09-07 Nikon Corp 搬送方法及び搬送装置、露光方法及び露光装置
JP3959283B2 (ja) * 2002-02-19 2007-08-15 株式会社日立ハイテクノロジーズ 露光装置及び露光方法
JP2004095883A (ja) * 2002-08-30 2004-03-25 Tokyo Seimitsu Co Ltd マスク搬送用トレー
JP5006513B2 (ja) 2004-11-05 2012-08-22 キヤノン株式会社 露光装置及びデバイス製造方法
CN100456136C (zh) * 2005-12-02 2009-01-28 上海微电子装备有限公司 一种步进扫描投影光刻机多总线时序同步控制方法
JP2009266886A (ja) * 2008-04-22 2009-11-12 Nikon Corp マスク、マスク保持装置、露光装置及びデバイスの製造方法
JP5533227B2 (ja) * 2010-05-13 2014-06-25 凸版印刷株式会社 露光装置
US8895943B2 (en) * 2010-12-14 2014-11-25 Mapper Lithography Ip B.V. Lithography system and method of processing substrates in such a lithography system
KR101539153B1 (ko) 2010-12-14 2015-07-23 가부시키가이샤 니콘 노광 방법 및 노광 장치, 그리고 디바이스 제조 방법
US9368379B2 (en) * 2012-03-14 2016-06-14 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods of controlling semiconductor wafer fabrication processes

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1060624A (ja) * 1996-08-20 1998-03-03 Matsushita Electric Ind Co Ltd スパッタリング装置
JP2003131387A (ja) * 2001-10-22 2003-05-09 Hitachi Electronics Eng Co Ltd マスクと露光対象基板との搬送に兼用できる搬送アーム及びそれを備えた露光装置
DE102005005124A1 (de) * 2005-02-04 2006-08-10 Robert Bosch Gmbh Belichtungsmaskeneinrichtung und Verfahren zur Ausrichtung einer Vielzahl von Substraten auf eine Belichtungsmaske
US20060209288A1 (en) * 2005-03-18 2006-09-21 Lg. Philips Lcd Co., Ltd. Proximity type exposure apparatus
US20120037819A1 (en) * 2010-08-12 2012-02-16 Heumueller Michael Mask carrier, mask handling module and method for adjusting a mask
WO2012173692A1 (en) * 2011-06-17 2012-12-20 Applied Materials, Inc. Cvd mask alignment for oled processing
US20150024147A1 (en) * 2013-07-19 2015-01-22 Samsung Display Co., Ltd. Plasma-enhanced chemical vapor deposition apparatus and method of manufacturing display apparatus using the same

Also Published As

Publication number Publication date
AT517253B1 (de) 2020-07-15
DE102016109345A1 (de) 2016-12-01
US10101672B2 (en) 2018-10-16
KR20160140462A (ko) 2016-12-07
US20160370715A1 (en) 2016-12-22
CN106206401A (zh) 2016-12-07
JP2016224435A (ja) 2016-12-28
JP6824635B2 (ja) 2021-02-03
NL2014864B1 (en) 2017-01-31
TWI692004B (zh) 2020-04-21
AT517253A2 (de) 2016-12-15
TW201709276A (zh) 2017-03-01
NL2014864A (en) 2016-12-08
CN106206401B (zh) 2021-06-29
KR102584913B1 (ko) 2023-10-05

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