JP6802799B2 - 硬化性樹脂組成物、ドライフィルムおよびそれを用いたプリント配線板 - Google Patents

硬化性樹脂組成物、ドライフィルムおよびそれを用いたプリント配線板 Download PDF

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JP6802799B2
JP6802799B2 JP2017543472A JP2017543472A JP6802799B2 JP 6802799 B2 JP6802799 B2 JP 6802799B2 JP 2017543472 A JP2017543472 A JP 2017543472A JP 2017543472 A JP2017543472 A JP 2017543472A JP 6802799 B2 JP6802799 B2 JP 6802799B2
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resin composition
resin
hydrotalcite
printed wiring
ion scavenger
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JPWO2017057431A1 (ja
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宮部 英和
英和 宮部
横山 裕
裕 横山
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Taiyo Ink Manufacturing Co Ltd
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Taiyo Ink Manufacturing Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/10Metal compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/14Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2017543472A 2015-09-30 2016-09-28 硬化性樹脂組成物、ドライフィルムおよびそれを用いたプリント配線板 Active JP6802799B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015194907 2015-09-30
JP2015194907 2015-09-30
PCT/JP2016/078573 WO2017057431A1 (ja) 2015-09-30 2016-09-28 硬化性樹脂組成物、ドライフィルムおよびそれを用いたプリント配線板

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JPWO2017057431A1 JPWO2017057431A1 (ja) 2018-07-19
JP6802799B2 true JP6802799B2 (ja) 2020-12-23

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JP2017543472A Active JP6802799B2 (ja) 2015-09-30 2016-09-28 硬化性樹脂組成物、ドライフィルムおよびそれを用いたプリント配線板

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JP (1) JP6802799B2 (zh)
KR (1) KR102574957B1 (zh)
CN (1) CN108137791A (zh)
TW (1) TWI758257B (zh)
WO (1) WO2017057431A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7276161B2 (ja) * 2018-02-07 2023-05-18 三菱ケミカル株式会社 光硬化性組成物、造形物及びハイドロゲル
CN110607052B (zh) * 2019-09-23 2022-06-03 广东生益科技股份有限公司 一种预浸料、层压板及印制电路板
CN112638028A (zh) * 2020-12-02 2021-04-09 昆山国显光电有限公司 抗氧化混合物、电路板和显示面板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002069270A (ja) * 2000-01-11 2002-03-08 Nippon Kayaku Co Ltd 難燃性非ハロゲンエポキシ樹脂組成物及びその用途
JP5055668B2 (ja) * 2001-07-19 2012-10-24 凸版印刷株式会社 プリント配線板用熱硬化性樹脂組成物
JP2003213083A (ja) * 2002-01-24 2003-07-30 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料。
JP4008273B2 (ja) * 2002-03-26 2007-11-14 太陽インキ製造株式会社 アルカリ現像型感光性樹脂組成物及びそれを用いたプリント配線基板
JP4774070B2 (ja) * 2007-03-05 2011-09-14 株式会社日本触媒 画像形成用感光性樹脂組成物及びその製造方法
JP2009186510A (ja) * 2008-02-01 2009-08-20 Fujifilm Corp 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
TWI431049B (zh) * 2008-03-18 2014-03-21 Nippon Kayaku Kk 使用具有難燃性之反應性化合物的活性能量線硬化型樹脂組成物及其硬化物
JP5261242B2 (ja) * 2009-03-23 2013-08-14 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5183540B2 (ja) * 2009-03-23 2013-04-17 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5349113B2 (ja) 2009-03-30 2013-11-20 太陽ホールディングス株式会社 感光性樹脂組成物、それを用いたドライフィルム及びプリント配線板
WO2012173241A1 (ja) * 2011-06-17 2012-12-20 太陽インキ製造株式会社 難燃性硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP6061576B2 (ja) * 2012-09-10 2017-01-18 株式会社タムラ製作所 感光性樹脂組成物及び感光性樹脂組成物の硬化被膜を有するプリント配線板
KR101562964B1 (ko) * 2013-09-02 2015-10-26 주식회사 케이씨씨 신뢰성이 우수한 감광성 수지 조성물 및 그 제조방법
JP5917602B2 (ja) * 2014-06-03 2016-05-18 太陽ホールディングス株式会社 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Also Published As

Publication number Publication date
CN108137791A (zh) 2018-06-08
TW201730220A (zh) 2017-09-01
KR20180063171A (ko) 2018-06-11
KR102574957B1 (ko) 2023-09-05
TWI758257B (zh) 2022-03-21
WO2017057431A1 (ja) 2017-04-06
JPWO2017057431A1 (ja) 2018-07-19

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