JP6792106B2 - ワークキャリア及びワークキャリアの製造方法 - Google Patents

ワークキャリア及びワークキャリアの製造方法 Download PDF

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Publication number
JP6792106B2
JP6792106B2 JP2017068834A JP2017068834A JP6792106B2 JP 6792106 B2 JP6792106 B2 JP 6792106B2 JP 2017068834 A JP2017068834 A JP 2017068834A JP 2017068834 A JP2017068834 A JP 2017068834A JP 6792106 B2 JP6792106 B2 JP 6792106B2
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JP
Japan
Prior art keywords
side recess
work
hole
back side
front side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017068834A
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English (en)
Japanese (ja)
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JP2018167383A (ja
Inventor
将貴 杉山
将貴 杉山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Priority to JP2017068834A priority Critical patent/JP6792106B2/ja
Priority to KR1020180027540A priority patent/KR102447660B1/ko
Priority to CN201810250478.8A priority patent/CN108687656B/zh
Priority to TW107110240A priority patent/TWI723256B/zh
Publication of JP2018167383A publication Critical patent/JP2018167383A/ja
Application granted granted Critical
Publication of JP6792106B2 publication Critical patent/JP6792106B2/ja
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Gears, Cams (AREA)
  • Catalysts (AREA)
JP2017068834A 2017-03-30 2017-03-30 ワークキャリア及びワークキャリアの製造方法 Active JP6792106B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017068834A JP6792106B2 (ja) 2017-03-30 2017-03-30 ワークキャリア及びワークキャリアの製造方法
KR1020180027540A KR102447660B1 (ko) 2017-03-30 2018-03-08 워크 캐리어 및 워크 캐리어의 제조 방법
CN201810250478.8A CN108687656B (zh) 2017-03-30 2018-03-26 工件游星轮及工件游星轮的制造方法
TW107110240A TWI723256B (zh) 2017-03-30 2018-03-26 工件遊星輪及工件遊星輪的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017068834A JP6792106B2 (ja) 2017-03-30 2017-03-30 ワークキャリア及びワークキャリアの製造方法

Publications (2)

Publication Number Publication Date
JP2018167383A JP2018167383A (ja) 2018-11-01
JP6792106B2 true JP6792106B2 (ja) 2020-11-25

Family

ID=63844586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017068834A Active JP6792106B2 (ja) 2017-03-30 2017-03-30 ワークキャリア及びワークキャリアの製造方法

Country Status (4)

Country Link
JP (1) JP6792106B2 (zh)
KR (1) KR102447660B1 (zh)
CN (1) CN108687656B (zh)
TW (1) TWI723256B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102434418B1 (ko) * 2022-03-10 2022-08-22 (주)뉴이스트 반도체 웨이퍼의 연마 공정에 사용되는 캐리어 제조 방법
CN115847281A (zh) * 2022-12-07 2023-03-28 西安奕斯伟材料科技有限公司 一种硅片的双面抛光用的载具以及装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3086591B2 (ja) 1994-06-15 2000-09-11 三洋電機株式会社 監視用ビデオカメラ
JPH10135137A (ja) * 1996-10-31 1998-05-22 Semiconductor Energy Lab Co Ltd 結晶性半導体作製方法
JP3482130B2 (ja) * 1998-07-10 2003-12-22 株式会社岸田製作所 脆性薄板の平面研磨における保持装置
JP2001179615A (ja) * 1999-12-27 2001-07-03 Seiko Epson Corp 研磨用キャリア、表面研磨装置及び表面研磨方法
ES2261437T3 (es) * 2000-07-05 2006-11-16 Astellas Pharma Inc. Derivados de propano-1,3-diona.
JP3439726B2 (ja) * 2000-07-10 2003-08-25 住友ベークライト株式会社 被研磨物保持材及びその製造方法
MY118114A (en) * 2000-07-10 2004-08-30 Sumitomo Bakelite Co Holder for polished work and manufacturing method thereof
KR20020018708A (ko) 2000-09-04 2002-03-09 구광시 자기기록매체의 제조방법
KR100398141B1 (ko) * 2000-10-12 2003-09-13 아남반도체 주식회사 화학적 기계적 연마 슬러리 조성물 및 이를 이용한반도체소자의 제조방법
JP5114113B2 (ja) * 2007-07-02 2013-01-09 スピードファム株式会社 ワークキャリア
KR100890458B1 (ko) 2007-07-27 2009-03-26 (주식회사)문창 스테인레스 강판제 물탱크
JP2009260272A (ja) * 2008-03-25 2009-11-05 Panasonic Corp 基板の加工方法および半導体チップの製造方法ならびに樹脂接着層付き半導体チップの製造方法
JP2010179375A (ja) 2009-02-03 2010-08-19 Sumco Corp 被研磨物キャリア及び研磨製品の製造方法
JP5578704B2 (ja) * 2010-03-09 2014-08-27 Ｓｈマテリアル株式会社 半導体素子搭載用基板及びその製造方法
JP2012169316A (ja) * 2011-02-10 2012-09-06 Think Laboratory Co Ltd エッチングマスク付基材及びその製造方法
SG11201604185PA (en) * 2013-11-29 2016-07-28 Hoya Corp Carrier for polishing processing, method for manufacturing carrier for polishing processing, and method for manufacturingmagnetic-disk substrate
CN104759983A (zh) * 2015-02-11 2015-07-08 苏州新美光纳米科技有限公司 游星轮
CN205835021U (zh) * 2016-07-18 2016-12-28 湖南普照信息材料有限公司 游星轮
JP6800402B2 (ja) * 2016-10-06 2020-12-16 スピードファム株式会社 ワークキャリア及びワークキャリアの製造方法
CN107457689B (zh) * 2017-10-03 2024-04-05 德清晶生光电科技有限公司 用于单面打磨的游星轮

Also Published As

Publication number Publication date
JP2018167383A (ja) 2018-11-01
KR102447660B1 (ko) 2022-09-26
TW201836768A (zh) 2018-10-16
TWI723256B (zh) 2021-04-01
CN108687656B (zh) 2021-05-28
KR20180111523A (ko) 2018-10-11
CN108687656A (zh) 2018-10-23

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