JP6775531B2 - 高導電性銅フィルムの調製 - Google Patents

高導電性銅フィルムの調製 Download PDF

Info

Publication number
JP6775531B2
JP6775531B2 JP2017563208A JP2017563208A JP6775531B2 JP 6775531 B2 JP6775531 B2 JP 6775531B2 JP 2017563208 A JP2017563208 A JP 2017563208A JP 2017563208 A JP2017563208 A JP 2017563208A JP 6775531 B2 JP6775531 B2 JP 6775531B2
Authority
JP
Japan
Prior art keywords
copper
ink
complex
composition
ring structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017563208A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018525770A (ja
JP2018525770A5 (enExample
Inventor
シャンタル パケ
シャンタル パケ
トーマス ラセル
トーマス ラセル
パトリック アール．エル． マランファン
パトリック アール．エル． マランファン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Research Council of Canada
Original Assignee
National Research Council of Canada
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Research Council of Canada filed Critical National Research Council of Canada
Publication of JP2018525770A publication Critical patent/JP2018525770A/ja
Publication of JP2018525770A5 publication Critical patent/JP2018525770A5/ja
Application granted granted Critical
Publication of JP6775531B2 publication Critical patent/JP6775531B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/06—Coating with compositions not containing macromolecular substances
    • C08J7/065—Low-molecular-weight organic substances, e.g. absorption of additives in the surface of the article
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/08—Heat treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Pyridine Compounds (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Hydrogenated Pyridines (AREA)
JP2017563208A 2015-06-11 2016-02-02 高導電性銅フィルムの調製 Active JP6775531B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562174426P 2015-06-11 2015-06-11
US62/174,426 2015-06-11
PCT/CA2016/050091 WO2016197234A1 (en) 2015-06-11 2016-02-02 Preparation of high conductivity copper films

Publications (3)

Publication Number Publication Date
JP2018525770A JP2018525770A (ja) 2018-09-06
JP2018525770A5 JP2018525770A5 (enExample) 2020-04-23
JP6775531B2 true JP6775531B2 (ja) 2020-10-28

Family

ID=57502729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017563208A Active JP6775531B2 (ja) 2015-06-11 2016-02-02 高導電性銅フィルムの調製

Country Status (8)

Country Link
US (1) US10954406B2 (enExample)
EP (1) EP3307705B1 (enExample)
JP (1) JP6775531B2 (enExample)
KR (1) KR102522823B1 (enExample)
CN (1) CN107614481B (enExample)
CA (1) CA2988797C (enExample)
TW (1) TWI680134B (enExample)
WO (1) WO2016197234A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018118460A1 (en) 2016-12-24 2018-06-28 Electroninks Incorporated Copper based conductive ink composition and method of making the same
US11993719B2 (en) 2017-10-27 2024-05-28 National Research Council Of Canada Boron nitride nanotube coated substrates for sintering of metallic traces by intense pulse light
KR20190131242A (ko) * 2018-05-16 2019-11-26 도레이첨단소재 주식회사 전도성 섬유집합체 및 그 제조방법
TWI853828B (zh) 2018-08-07 2024-09-01 加拿大國家研究委員會 包覆成型的印刷電子零件和其製造方法

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5413260B2 (enExample) 1973-09-04 1979-05-29
DE3810958A1 (de) 1988-03-31 1989-10-12 Basf Ag Tinten fuer ink-jet-aufzeichnungsverfahren
CN1071182A (zh) 1991-09-28 1993-04-21 胡贵友 热敏变色油墨
JP3912844B2 (ja) 1997-04-09 2007-05-09 キヤノン株式会社 有機金属を含有するインク並びに電極、電子放出素子および画像形成装置の製造方法
US5980622A (en) 1997-08-29 1999-11-09 Hewlett-Packard Company Magenta dyes for ink-jet inks
JP3813750B2 (ja) 1998-08-27 2006-08-23 大日精化工業株式会社 カラーフィルターの製造方法及びカラーフィルター
DE50000718D1 (de) 1999-09-27 2002-12-12 Ciba Sc Holding Ag Magentafärbende Tinten enthaltend Kupferkomplexazofarbstoffe auf der Bais von 1-Naphthol-di-oder trisulfonsäuren
US6369256B1 (en) * 2000-06-09 2002-04-09 National Research Council Of Canada Self-reducible copper(II) source reagents for chemical vapor deposition of copper metal
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
CN1602314A (zh) * 2001-12-12 2005-03-30 纳幕尔杜邦公司 采用甲酸铜配合物的铜沉积方法
JP2005520053A (ja) * 2002-01-18 2005-07-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 原子層堆積によって銅薄膜を堆積させるための揮発性銅（ｉｉ）錯体
WO2004015164A1 (en) * 2002-08-09 2004-02-19 E.I. Du Pont De Nemours And Company Pyrrolyl complexes of copper for copper metal deposition
TW200416261A (en) 2002-10-18 2004-09-01 Nippon Kayaku Kk Phthalocyanine compound for ink-jet printing, water-soluble green ink composition containing such compound and coloring substance using such composition
JP2004162110A (ja) 2002-11-12 2004-06-10 Mitsubishi Paper Mills Ltd 銅／アミン組成物
JP4964152B2 (ja) 2005-03-04 2012-06-27 インクテック カンパニー リミテッド 導電性インク組成物及びこの製造方法
JP5205717B2 (ja) * 2006-07-04 2013-06-05 セイコーエプソン株式会社 ギ酸銅錯体、銅粒子の製造方法および配線基板の製造方法
JP5045015B2 (ja) * 2006-07-28 2012-10-10 セイコーエプソン株式会社 ギ酸銅の製造方法、銅粒子の製造方法および配線基板の製造方法
JP2008205430A (ja) 2007-01-26 2008-09-04 Konica Minolta Holdings Inc 金属パターン形成方法及び金属塩混合物
KR20080083790A (ko) 2007-03-13 2008-09-19 삼성전자주식회사 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법
CN101519356A (zh) * 2008-02-28 2009-09-02 华东理工大学 螺环双亚胺和制备方法及其应用
JP2009256218A (ja) 2008-04-14 2009-11-05 Toray Ind Inc 銅前駆体組成物およびそれを用いた銅膜の製造方法。
US9095898B2 (en) * 2008-09-15 2015-08-04 Lockheed Martin Corporation Stabilized metal nanoparticles and methods for production thereof
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
KR20120036476A (ko) * 2010-10-08 2012-04-18 에스케이이노베이션 주식회사 구리(ⅱ) 포르메이트 착제를 포함하는 잉크 조성물의 제조방법
CN102605355B (zh) * 2012-02-21 2014-07-02 北京化工大学 基材表面的铜膜、其制备方法及应用
JP5876749B2 (ja) * 2012-02-29 2016-03-02 国立大学法人広島大学 導電性物質前駆体組成物、及びそれを用いた導電性物質の製造方法
EP2820093B1 (en) * 2012-02-29 2024-09-18 Singapore Asahi Chemical & Solder Ind. Pte. Ltd. Inks containing metal precursors nanoparticles
JP5923351B2 (ja) * 2012-03-16 2016-05-24 株式会社Adeka 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法
JP2013206722A (ja) * 2012-03-28 2013-10-07 Fujifilm Corp 液状組成物、金属銅膜、及び導体配線、並びに金属銅膜の製造方法
JP6027613B2 (ja) 2012-07-09 2016-11-16 四国化成工業株式会社 銅被膜形成剤及び銅被膜の形成方法
KR101288106B1 (ko) * 2012-12-20 2013-07-26 (주)피이솔브 금속 전구체 및 이를 이용한 금속 전구체 잉크
JP2014182913A (ja) * 2013-03-19 2014-09-29 Fujifilm Corp 導電膜形成用組成物およびこれを用いる導電膜の製造方法
KR20140142406A (ko) * 2013-06-03 2014-12-12 고성국 유기 동 전구체를 사용한 잉크 조성물 및 그 제조방법
JP6156991B2 (ja) * 2013-07-25 2017-07-05 株式会社Adeka 銅膜形成用組成物及びそれを用いた銅膜の製造方法
CN104341860B (zh) * 2013-08-01 2019-04-09 索尼公司 纳米导电墨水及其制备方法
KR102233293B1 (ko) * 2014-01-15 2021-03-29 (주)창성 구리포메이트-아민 컴플렉스를 포함하는 잉크 조성물의 제조방법
JP6468889B2 (ja) * 2014-03-11 2019-02-13 三井金属鉱業株式会社 導電性組成物、及びそれを用いた導電体の製造方法
SG11201610182SA (en) 2014-06-19 2017-01-27 Nat Res Council Canada Molecular inks
US20160057866A1 (en) * 2014-08-19 2016-02-25 Jsr Corporation Metal film forming method and conductive ink used in said method
US9809489B2 (en) * 2014-09-12 2017-11-07 Jsr Corporation Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device
JP7186709B2 (ja) * 2016-10-25 2022-12-09 イー２アイピー テクノロジーズ インコーポレイテッド プリンテッド・エレクトロニクス

Also Published As

Publication number Publication date
TW201643172A (zh) 2016-12-16
CA2988797A1 (en) 2016-12-15
EP3307705A1 (en) 2018-04-18
EP3307705B1 (en) 2021-05-05
CN107614481A (zh) 2018-01-19
CN107614481B (zh) 2021-05-07
TWI680134B (zh) 2019-12-21
CA2988797C (en) 2023-08-01
JP2018525770A (ja) 2018-09-06
US20180134909A1 (en) 2018-05-17
KR102522823B1 (ko) 2023-04-18
US10954406B2 (en) 2021-03-23
KR20180018694A (ko) 2018-02-21
WO2016197234A1 (en) 2016-12-15
EP3307705A4 (en) 2019-01-23

Similar Documents

Publication Publication Date Title
CN109790409B (zh) 铜油墨和由其制成的导电可焊接铜迹线
JP6775531B2 (ja) 高導電性銅フィルムの調製
TWI607114B (zh) 導電膜的製造方法以及導電膜
Deore et al. Formulation of screen-printable Cu molecular ink for conductive/flexible/solderable Cu traces
TWI567231B (zh) 銅覆膜形成劑及銅覆膜之形成方法
WO2007140480A2 (en) Printed resistors and processes for forming same
TWI602947B (zh) Composition for copper film formation, and the manufacturing method of the copper film using the same
CN104169462A (zh) 液态组合物、金属膜和导体配线以及金属膜的制造方法
Knapp et al. Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper
DE102016225051A1 (de) Zwischenschichtzusammensetzung für elektronisches drucken
TW201437266A (zh) 導電膜形成用組成物及使用其的導電膜的製造方法
WO2015045932A1 (ja) 銅薄膜形成組成物
KR101782799B1 (ko) 구리-아민 코-콤플렉스의 제조방법 및 이를 포함하는 전도성 이온 잉크 및 이를 이용한 미세 패턴전극의 제조방법
CN111051442B (zh) 铜油墨
KR20160114175A (ko) 구리막 형성용 조성물 및 그것을 이용한 구리막의 제조방법
Farraj et al. Ink-jet printed copper complex MOD ink for plastic electronics
US20250059393A1 (en) Ink, method for manufacturing ink, and method for manufacturing multilayer ceramic capacitor
TWI783103B (zh) 用於高傳導性精細印刷之銅油墨
TW201503163A (zh) 導電膜形成用組成物及使用其的導電膜的製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20181108

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20191217

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20200316

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200526

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200825

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200908

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20201006

R150 Certificate of patent or registration of utility model

Ref document number: 6775531

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250