JP2018525770A5 - - Google Patents

Download PDF

Info

Publication number
JP2018525770A5
JP2018525770A5 JP2017563208A JP2017563208A JP2018525770A5 JP 2018525770 A5 JP2018525770 A5 JP 2018525770A5 JP 2017563208 A JP2017563208 A JP 2017563208A JP 2017563208 A JP2017563208 A JP 2017563208A JP 2018525770 A5 JP2018525770 A5 JP 2018525770A5
Authority
JP
Japan
Prior art keywords
copper
composition
ring structure
complex
membered ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017563208A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018525770A (ja
JP6775531B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/CA2016/050091 external-priority patent/WO2016197234A1/en
Publication of JP2018525770A publication Critical patent/JP2018525770A/ja
Publication of JP2018525770A5 publication Critical patent/JP2018525770A5/ja
Application granted granted Critical
Publication of JP6775531B2 publication Critical patent/JP6775531B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017563208A 2015-06-11 2016-02-02 高導電性銅フィルムの調製 Active JP6775531B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562174426P 2015-06-11 2015-06-11
US62/174,426 2015-06-11
PCT/CA2016/050091 WO2016197234A1 (en) 2015-06-11 2016-02-02 Preparation of high conductivity copper films

Publications (3)

Publication Number Publication Date
JP2018525770A JP2018525770A (ja) 2018-09-06
JP2018525770A5 true JP2018525770A5 (enExample) 2020-04-23
JP6775531B2 JP6775531B2 (ja) 2020-10-28

Family

ID=57502729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017563208A Active JP6775531B2 (ja) 2015-06-11 2016-02-02 高導電性銅フィルムの調製

Country Status (8)

Country Link
US (1) US10954406B2 (enExample)
EP (1) EP3307705B1 (enExample)
JP (1) JP6775531B2 (enExample)
KR (1) KR102522823B1 (enExample)
CN (1) CN107614481B (enExample)
CA (1) CA2988797C (enExample)
TW (1) TWI680134B (enExample)
WO (1) WO2016197234A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018118460A1 (en) * 2016-12-24 2018-06-28 Electroninks Incorporated Copper based conductive ink composition and method of making the same
TWI823871B (zh) 2017-10-27 2023-12-01 加拿大國家研究委員會 用於通過強脈衝光燒結金屬線路之塗有氮化硼奈米管之基板
KR20190131242A (ko) * 2018-05-16 2019-11-26 도레이첨단소재 주식회사 전도성 섬유집합체 및 그 제조방법
TWI853828B (zh) 2018-08-07 2024-09-01 加拿大國家研究委員會 包覆成型的印刷電子零件和其製造方法

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5413260B2 (enExample) 1973-09-04 1979-05-29
DE3810958A1 (de) 1988-03-31 1989-10-12 Basf Ag Tinten fuer ink-jet-aufzeichnungsverfahren
CN1071182A (zh) 1991-09-28 1993-04-21 胡贵友 热敏变色油墨
JP3912844B2 (ja) 1997-04-09 2007-05-09 キヤノン株式会社 有機金属を含有するインク並びに電極、電子放出素子および画像形成装置の製造方法
US5980622A (en) 1997-08-29 1999-11-09 Hewlett-Packard Company Magenta dyes for ink-jet inks
JP3813750B2 (ja) 1998-08-27 2006-08-23 大日精化工業株式会社 カラーフィルターの製造方法及びカラーフィルター
ES2185549T3 (es) 1999-09-27 2003-05-01 Ciba Sc Holding Ag Tintas de color rojo carmesi (magenta) que contienen colorantes azoicos de complejo de cobre basados en acidos 1-naftol-di- o -trisulfonicos.
US6369256B1 (en) * 2000-06-09 2002-04-09 National Research Council Of Canada Self-reducible copper(II) source reagents for chemical vapor deposition of copper metal
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
JP2005513117A (ja) 2001-12-12 2005-05-12 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 銅ホルメート錯体を用いる銅の沈着
US6939578B2 (en) * 2002-01-18 2005-09-06 E. I. Du Pont De Nemours And Company Volatile copper(II) complexes for deposition of copper films by atomic layer deposition
EP1527207A1 (en) * 2002-08-09 2005-05-04 E.I. Du Pont De Nemours And Company Pyrrolyl complexes of copper for copper metal deposition
TW200416261A (en) 2002-10-18 2004-09-01 Nippon Kayaku Kk Phthalocyanine compound for ink-jet printing, water-soluble green ink composition containing such compound and coloring substance using such composition
JP2004162110A (ja) 2002-11-12 2004-06-10 Mitsubishi Paper Mills Ltd 銅/アミン組成物
PL1853671T3 (pl) 2005-03-04 2014-01-31 Inktec Co Ltd Tusze przewodzące i sposób ich wytwarzania
JP5205717B2 (ja) * 2006-07-04 2013-06-05 セイコーエプソン株式会社 ギ酸銅錯体、銅粒子の製造方法および配線基板の製造方法
JP5045015B2 (ja) * 2006-07-28 2012-10-10 セイコーエプソン株式会社 ギ酸銅の製造方法、銅粒子の製造方法および配線基板の製造方法
JP2008205430A (ja) 2007-01-26 2008-09-04 Konica Minolta Holdings Inc 金属パターン形成方法及び金属塩混合物
KR20080083790A (ko) 2007-03-13 2008-09-19 삼성전자주식회사 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법
CN101519356A (zh) * 2008-02-28 2009-09-02 华东理工大学 螺环双亚胺和制备方法及其应用
JP2009256218A (ja) 2008-04-14 2009-11-05 Toray Ind Inc 銅前駆体組成物およびそれを用いた銅膜の製造方法。
US9095898B2 (en) * 2008-09-15 2015-08-04 Lockheed Martin Corporation Stabilized metal nanoparticles and methods for production thereof
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
KR20120036476A (ko) * 2010-10-08 2012-04-18 에스케이이노베이션 주식회사 구리(ⅱ) 포르메이트 착제를 포함하는 잉크 조성물의 제조방법
CN102605355B (zh) * 2012-02-21 2014-07-02 北京化工大学 基材表面的铜膜、其制备方法及应用
EP2820093B1 (en) * 2012-02-29 2024-09-18 Singapore Asahi Chemical & Solder Ind. Pte. Ltd. Inks containing metal precursors nanoparticles
JP5876749B2 (ja) * 2012-02-29 2016-03-02 国立大学法人広島大学 導電性物質前駆体組成物、及びそれを用いた導電性物質の製造方法
JP5923351B2 (ja) * 2012-03-16 2016-05-24 株式会社Adeka 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法
JP2013206722A (ja) * 2012-03-28 2013-10-07 Fujifilm Corp 液状組成物、金属銅膜、及び導体配線、並びに金属銅膜の製造方法
WO2014010328A1 (ja) * 2012-07-09 2014-01-16 四国化成工業株式会社 銅被膜形成剤及び銅被膜の形成方法
KR101288106B1 (ko) * 2012-12-20 2013-07-26 (주)피이솔브 금속 전구체 및 이를 이용한 금속 전구체 잉크
JP2014182913A (ja) * 2013-03-19 2014-09-29 Fujifilm Corp 導電膜形成用組成物およびこれを用いる導電膜の製造方法
KR20140142406A (ko) * 2013-06-03 2014-12-12 고성국 유기 동 전구체를 사용한 잉크 조성물 및 그 제조방법
JP6156991B2 (ja) * 2013-07-25 2017-07-05 株式会社Adeka 銅膜形成用組成物及びそれを用いた銅膜の製造方法
CN104341860B (zh) * 2013-08-01 2019-04-09 索尼公司 纳米导电墨水及其制备方法
KR102233293B1 (ko) * 2014-01-15 2021-03-29 (주)창성 구리포메이트-아민 컴플렉스를 포함하는 잉크 조성물의 제조방법
JP6468889B2 (ja) * 2014-03-11 2019-02-13 三井金属鉱業株式会社 導電性組成物、及びそれを用いた導電体の製造方法
KR102387043B1 (ko) * 2014-06-19 2022-04-14 내셔날 리서치 카운실 오브 캐나다 분자 잉크
US20160057866A1 (en) * 2014-08-19 2016-02-25 Jsr Corporation Metal film forming method and conductive ink used in said method
US9809489B2 (en) * 2014-09-12 2017-11-07 Jsr Corporation Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device
CA3045167A1 (en) * 2016-10-25 2018-05-03 Ggi International Printed electronics

Similar Documents

Publication Publication Date Title
JP2018525770A5 (enExample)
JP2013527599A5 (enExample)
JP2014063155A5 (enExample)
JP2010021554A5 (enExample)
JP2013194257A5 (enExample)
TWI602947B (zh) Composition for copper film formation, and the manufacturing method of the copper film using the same
CN106433025A (zh) 树脂组合物
JPWO2021132667A5 (enExample)
CA3052742A1 (en) Printable molecular ink
GB2518772A (en) Method for preparing a semiconducting layer
CN104975269B (zh) 钽源前驱体及其制备方法和TaN薄膜电阻的制备方法
JP2012503867A5 (enExample)
JP2014063156A5 (enExample)
CN107614481B (zh) 高导电性铜膜的制备
JP2009533852A5 (enExample)
US9217093B1 (en) Palladium ink compositions
JP2020510740A5 (enExample)
JP2013166930A5 (enExample)
JP2018177860A5 (enExample)
JP2013209671A5 (enExample)
JPWO2023276690A5 (ja) ダイアタッチ材用導電性樹脂組成物、高熱伝導性材料および半導体装置
JP2012096527A5 (enExample)
CN101221846A (zh) 过温过流保护芯片、其制造方法及表面贴装型过温过流保护元件
JP2017118068A5 (enExample)
JP2020530049A5 (enExample)