JP2012096527A5 - - Google Patents
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- Publication number
- JP2012096527A5 JP2012096527A5 JP2011152207A JP2011152207A JP2012096527A5 JP 2012096527 A5 JP2012096527 A5 JP 2012096527A5 JP 2011152207 A JP2011152207 A JP 2011152207A JP 2011152207 A JP2011152207 A JP 2011152207A JP 2012096527 A5 JP2012096527 A5 JP 2012096527A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- release layer
- metal foil
- composite metal
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 14
- 239000002184 metal Substances 0.000 claims 14
- 239000002131 composite material Substances 0.000 claims 9
- 238000009792 diffusion process Methods 0.000 claims 9
- 239000011888 foil Substances 0.000 claims 9
- 238000000034 method Methods 0.000 claims 6
- 238000007747 plating Methods 0.000 claims 5
- 230000002265 prevention Effects 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 230000002378 acidificating effect Effects 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 230000004888 barrier function Effects 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011152207A JP5628106B2 (ja) | 2011-07-08 | 2011-07-08 | 複合金属箔及びその製造方法並びにプリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011152207A JP5628106B2 (ja) | 2011-07-08 | 2011-07-08 | 複合金属箔及びその製造方法並びにプリント配線板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010247574A Division JP4824828B1 (ja) | 2010-11-04 | 2010-11-04 | 複合金属箔及びその製造方法並びにプリント配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012096527A JP2012096527A (ja) | 2012-05-24 |
| JP2012096527A5 true JP2012096527A5 (enExample) | 2013-08-22 |
| JP5628106B2 JP5628106B2 (ja) | 2014-11-19 |
Family
ID=46389007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011152207A Active JP5628106B2 (ja) | 2011-07-08 | 2011-07-08 | 複合金属箔及びその製造方法並びにプリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5628106B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6550811B2 (ja) * | 2015-03-16 | 2019-07-31 | 大日本印刷株式会社 | 導電性パターンシートの製造方法、導電性パターンシート、タッチパネルセンサおよび画像表示装置 |
| CN111295055A (zh) * | 2018-12-10 | 2020-06-16 | 广州方邦电子股份有限公司 | 一种复合金属箔的制备方法 |
| CN113038688A (zh) * | 2019-12-24 | 2021-06-25 | 广州方邦电子股份有限公司 | 一种复合金属箔、带载体的基板及挠性覆箔板 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7026059B2 (en) * | 2000-09-22 | 2006-04-11 | Circuit Foil Japan Co., Ltd. | Copper foil for high-density ultrafine printed wiring boad |
| JP2002292788A (ja) * | 2001-03-30 | 2002-10-09 | Nippon Denkai Kk | 複合銅箔及び該複合銅箔の製造方法 |
| JP2005260058A (ja) * | 2004-03-12 | 2005-09-22 | Furukawa Circuit Foil Kk | キャリア付き極薄銅箔、キャリア付き極薄銅箔の製造方法および配線板 |
| JP4365445B1 (ja) * | 2008-08-21 | 2009-11-18 | 尾池工業株式会社 | 支持体付き金属箔、及び該金属箔の製造方法、並びにフレキシブル回路基板 |
| JP4824828B1 (ja) * | 2010-11-04 | 2011-11-30 | 福田金属箔粉工業株式会社 | 複合金属箔及びその製造方法並びにプリント配線板 |
-
2011
- 2011-07-08 JP JP2011152207A patent/JP5628106B2/ja active Active
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