WO2012099430A3 - 알루미늄 재질의 캐리어층을 갖는 동박 적층판 제조용 동박 필름 및 이를 구비하는 동박 적층판 - Google Patents

알루미늄 재질의 캐리어층을 갖는 동박 적층판 제조용 동박 필름 및 이를 구비하는 동박 적층판 Download PDF

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Publication number
WO2012099430A3
WO2012099430A3 PCT/KR2012/000515 KR2012000515W WO2012099430A3 WO 2012099430 A3 WO2012099430 A3 WO 2012099430A3 KR 2012000515 W KR2012000515 W KR 2012000515W WO 2012099430 A3 WO2012099430 A3 WO 2012099430A3
Authority
WO
WIPO (PCT)
Prior art keywords
copper clad
clad laminate
layer
manufacturing
carrier layer
Prior art date
Application number
PCT/KR2012/000515
Other languages
English (en)
French (fr)
Other versions
WO2012099430A2 (ko
Inventor
이미연
최융지
이성규
Original Assignee
Lee Mi Yeon
Choi Yung Ji
Lee Sung Gue
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lee Mi Yeon, Choi Yung Ji, Lee Sung Gue filed Critical Lee Mi Yeon
Publication of WO2012099430A2 publication Critical patent/WO2012099430A2/ko
Publication of WO2012099430A3 publication Critical patent/WO2012099430A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

본 발명은 절연 물질의 프리프레그에 동박이 적층된 동박 적층판의 제조에 사용되는 동박 적층판 제조용 동박 필름에 있어서, 상기 동박 적층판 제조시 상기 프리프레그에 접합되는 동박층과, 상기 접합시 상기 동박층을 보호할 수 있도록 상기 동박층을 덮으며 상기 동박층에 회로패턴을 형성할 때 상기 동박층에서 분리되는 캐리어층을 포함하고, 상기 캐리어층은 알루미늄 재질로 형성되고, 상기 동박층은 상기 캐리어층 상에 무전해 도금에 의해 형성되는 것을 특징으로 하는 동박 적층판 제조용 동박 필름 및 이를 구비한 동박 적층판을 개시한다.
PCT/KR2012/000515 2011-01-20 2012-01-19 알루미늄 재질의 캐리어층을 갖는 동박 적층판 제조용 동박 필름 및 이를 구비하는 동박 적층판 WO2012099430A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0005806 2011-01-20
KR1020110005806A KR20120084441A (ko) 2011-01-20 2011-01-20 알루미늄 재질의 캐리어층을 갖는 동박 적층판 제조용 동박 필름 및 이를 구비하는 동박 적층판

Publications (2)

Publication Number Publication Date
WO2012099430A2 WO2012099430A2 (ko) 2012-07-26
WO2012099430A3 true WO2012099430A3 (ko) 2012-12-06

Family

ID=46516262

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/000515 WO2012099430A2 (ko) 2011-01-20 2012-01-19 알루미늄 재질의 캐리어층을 갖는 동박 적층판 제조용 동박 필름 및 이를 구비하는 동박 적층판

Country Status (2)

Country Link
KR (1) KR20120084441A (ko)
WO (1) WO2012099430A2 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9758889B2 (en) 2014-05-08 2017-09-12 Ymt Co., Ltd. Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby
KR102188778B1 (ko) 2019-09-03 2020-12-09 세메스 주식회사 기판 처리 시스템 및 기판 처리 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000043188A (ja) * 1998-05-29 2000-02-15 Mitsui Mining & Smelting Co Ltd 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法
KR20040038761A (ko) * 2002-10-31 2004-05-08 후루카와서키트호일가부시끼가이샤 케리어 부착 극박(極薄) 동박(銅薄), 그 제조방법 및케리어 부착 극박 동박을 이용한 프린트 배선기판
KR20050025277A (ko) * 2003-09-01 2005-03-14 후루카와서키트호일가부시끼가이샤 케리어 부착 극박 동박의 제조방법 및 이 제조방법으로제조된 케리어 부착 극박동박, 프린트 배선기판, 다층프린트 배선판 및 칩온필름용 배선판
KR20080094970A (ko) * 2004-03-16 2008-10-27 미쓰이 긴조꾸 고교 가부시키가이샤 절연층 형성용의 수지층을 구비한 캐리어박 부착 전해 동박, 동박 적층판, 및 프린트 배선판

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000043188A (ja) * 1998-05-29 2000-02-15 Mitsui Mining & Smelting Co Ltd 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法
KR20040038761A (ko) * 2002-10-31 2004-05-08 후루카와서키트호일가부시끼가이샤 케리어 부착 극박(極薄) 동박(銅薄), 그 제조방법 및케리어 부착 극박 동박을 이용한 프린트 배선기판
KR20050025277A (ko) * 2003-09-01 2005-03-14 후루카와서키트호일가부시끼가이샤 케리어 부착 극박 동박의 제조방법 및 이 제조방법으로제조된 케리어 부착 극박동박, 프린트 배선기판, 다층프린트 배선판 및 칩온필름용 배선판
KR20080094970A (ko) * 2004-03-16 2008-10-27 미쓰이 긴조꾸 고교 가부시키가이샤 절연층 형성용의 수지층을 구비한 캐리어박 부착 전해 동박, 동박 적층판, 및 프린트 배선판

Also Published As

Publication number Publication date
KR20120084441A (ko) 2012-07-30
WO2012099430A2 (ko) 2012-07-26

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