JP5628106B2 - 複合金属箔及びその製造方法並びにプリント配線板 - Google Patents

複合金属箔及びその製造方法並びにプリント配線板 Download PDF

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Publication number
JP5628106B2
JP5628106B2 JP2011152207A JP2011152207A JP5628106B2 JP 5628106 B2 JP5628106 B2 JP 5628106B2 JP 2011152207 A JP2011152207 A JP 2011152207A JP 2011152207 A JP2011152207 A JP 2011152207A JP 5628106 B2 JP5628106 B2 JP 5628106B2
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Prior art keywords
layer
carrier
metal foil
composite metal
release layer
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JP2011152207A
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English (en)
Japanese (ja)
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JP2012096527A (ja
JP2012096527A5 (enExample
Inventor
行弘 大城
行弘 大城
秀樹 河原
秀樹 河原
忠広 稲守
忠広 稲守
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fukuda Metal Foil and Powder Co Ltd
Oike and Co Ltd
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Fukuda Metal Foil and Powder Co Ltd
Oike and Co Ltd
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Application filed by Fukuda Metal Foil and Powder Co Ltd, Oike and Co Ltd filed Critical Fukuda Metal Foil and Powder Co Ltd
Priority to JP2011152207A priority Critical patent/JP5628106B2/ja
Publication of JP2012096527A publication Critical patent/JP2012096527A/ja
Publication of JP2012096527A5 publication Critical patent/JP2012096527A5/ja
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  • Laminated Bodies (AREA)
JP2011152207A 2011-07-08 2011-07-08 複合金属箔及びその製造方法並びにプリント配線板 Active JP5628106B2 (ja)

Priority Applications (1)

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JP2011152207A JP5628106B2 (ja) 2011-07-08 2011-07-08 複合金属箔及びその製造方法並びにプリント配線板

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JP2011152207A JP5628106B2 (ja) 2011-07-08 2011-07-08 複合金属箔及びその製造方法並びにプリント配線板

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JP2010247574A Division JP4824828B1 (ja) 2010-11-04 2010-11-04 複合金属箔及びその製造方法並びにプリント配線板

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JP2012096527A JP2012096527A (ja) 2012-05-24
JP2012096527A5 JP2012096527A5 (enExample) 2013-08-22
JP5628106B2 true JP5628106B2 (ja) 2014-11-19

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6550811B2 (ja) * 2015-03-16 2019-07-31 大日本印刷株式会社 導電性パターンシートの製造方法、導電性パターンシート、タッチパネルセンサおよび画像表示装置
CN111295055A (zh) * 2018-12-10 2020-06-16 广州方邦电子股份有限公司 一种复合金属箔的制备方法
CN113038688A (zh) * 2019-12-24 2021-06-25 广州方邦电子股份有限公司 一种复合金属箔、带载体的基板及挠性覆箔板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP2002292788A (ja) * 2001-03-30 2002-10-09 Nippon Denkai Kk 複合銅箔及び該複合銅箔の製造方法
JP2005260058A (ja) * 2004-03-12 2005-09-22 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、キャリア付き極薄銅箔の製造方法および配線板
JP4365445B1 (ja) * 2008-08-21 2009-11-18 尾池工業株式会社 支持体付き金属箔、及び該金属箔の製造方法、並びにフレキシブル回路基板
JP4824828B1 (ja) * 2010-11-04 2011-11-30 福田金属箔粉工業株式会社 複合金属箔及びその製造方法並びにプリント配線板

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