JP2013001968A5 - - Google Patents
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- Publication number
- JP2013001968A5 JP2013001968A5 JP2011135124A JP2011135124A JP2013001968A5 JP 2013001968 A5 JP2013001968 A5 JP 2013001968A5 JP 2011135124 A JP2011135124 A JP 2011135124A JP 2011135124 A JP2011135124 A JP 2011135124A JP 2013001968 A5 JP2013001968 A5 JP 2013001968A5
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- metal material
- indium
- metal
- heat conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007769 metal material Substances 0.000 claims 14
- 229910052738 indium Inorganic materials 0.000 claims 11
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 6
- 229910052802 copper Inorganic materials 0.000 claims 6
- 239000010949 copper Substances 0.000 claims 6
- 239000002923 metal particle Substances 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011135124A JP5864142B2 (ja) | 2011-06-17 | 2011-06-17 | 熱伝導シートの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011135124A JP5864142B2 (ja) | 2011-06-17 | 2011-06-17 | 熱伝導シートの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013001968A JP2013001968A (ja) | 2013-01-07 |
| JP2013001968A5 true JP2013001968A5 (enExample) | 2014-06-26 |
| JP5864142B2 JP5864142B2 (ja) | 2016-02-17 |
Family
ID=47670854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011135124A Active JP5864142B2 (ja) | 2011-06-17 | 2011-06-17 | 熱伝導シートの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5864142B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108817377B (zh) * | 2018-06-22 | 2020-04-14 | 深圳市绚图新材科技有限公司 | 一种导电片状银包铜粉的制备方法 |
| CN114874758B (zh) * | 2022-05-31 | 2025-02-21 | 广东光钛领先新材料有限公司 | 一种铟基高效导热垫片 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06318655A (ja) * | 1993-05-06 | 1994-11-15 | Tanaka Denshi Kogyo Kk | 半導体チップ用放熱部材及びその製造方法 |
| JP2000012748A (ja) * | 1998-06-22 | 2000-01-14 | Hitachi Ltd | 電子回路装置 |
| JP2002160090A (ja) * | 2000-11-27 | 2002-06-04 | Tanaka Kikinzoku Kogyo Kk | Ａｇ−Ｃｕ−Ｉｎ系ろう材及びＡｇ−Ｃｕ−Ｉｎ系ろう材の製造方法 |
| JP3736452B2 (ja) * | 2000-12-21 | 2006-01-18 | 株式会社日立製作所 | はんだ箔 |
-
2011
- 2011-06-17 JP JP2011135124A patent/JP5864142B2/ja active Active
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