JP2009081142A5 - - Google Patents
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- Publication number
- JP2009081142A5 JP2009081142A5 JP2008302037A JP2008302037A JP2009081142A5 JP 2009081142 A5 JP2009081142 A5 JP 2009081142A5 JP 2008302037 A JP2008302037 A JP 2008302037A JP 2008302037 A JP2008302037 A JP 2008302037A JP 2009081142 A5 JP2009081142 A5 JP 2009081142A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- conductive material
- manufacturing
- electrically
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 29
- 229910052751 metal Inorganic materials 0.000 claims 29
- 239000004020 conductor Substances 0.000 claims 27
- 238000004519 manufacturing process Methods 0.000 claims 13
- 229910000765 intermetallic Inorganic materials 0.000 claims 7
- 238000002844 melting Methods 0.000 claims 7
- 230000008018 melting Effects 0.000 claims 7
- 239000002245 particle Substances 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008302037A JP5018752B2 (ja) | 2008-11-27 | 2008-11-27 | 導電材料、及び導電材料の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008302037A JP5018752B2 (ja) | 2008-11-27 | 2008-11-27 | 導電材料、及び導電材料の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005211992A Division JP4254757B2 (ja) | 2005-07-22 | 2005-07-22 | 導電材料及び導電性ペースト及び基板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011196862A Division JP5252050B2 (ja) | 2011-09-09 | 2011-09-09 | 回路基板、及び回路基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009081142A JP2009081142A (ja) | 2009-04-16 |
| JP2009081142A5 true JP2009081142A5 (enExample) | 2011-10-27 |
| JP5018752B2 JP5018752B2 (ja) | 2012-09-05 |
Family
ID=40655712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008302037A Expired - Lifetime JP5018752B2 (ja) | 2008-11-27 | 2008-11-27 | 導電材料、及び導電材料の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5018752B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106575537A (zh) | 2014-08-28 | 2017-04-19 | E.I.内穆尔杜邦公司 | 具有铜电极的太阳能电池 |
| DE112014006907T5 (de) | 2014-08-28 | 2017-06-08 | E.I. Du Pont De Nemours And Company | Kupfer enthaltende leitfähige Pasten und daraus hergestellte Elektroden |
| DE112014006910B4 (de) | 2014-08-28 | 2024-11-28 | Solar Paste, Llc | Kupferhaltige leitfähige Pasten |
| JP6756569B2 (ja) * | 2016-10-11 | 2020-09-16 | トヨタ自動車株式会社 | 多層配線板の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61198507A (ja) * | 1985-02-28 | 1986-09-02 | 日本鉱業株式会社 | 電子部品用複合材料及びその製造方法 |
| JPH0287416A (ja) * | 1988-09-22 | 1990-03-28 | Fujikura Ltd | 無酸素マグネシウム銅被覆ジルコニウム銅複合体 |
| JPH0813424B2 (ja) * | 1991-05-27 | 1996-02-14 | 住友軽金属工業株式会社 | スポット溶接用電極 |
| TW340132B (en) * | 1994-10-20 | 1998-09-11 | Ibm | Structure for use as an electrical interconnection means and process for preparing the same |
| JP3721660B2 (ja) * | 1996-10-18 | 2005-11-30 | 富士通株式会社 | 導電材料及び導電性ペースト |
-
2008
- 2008-11-27 JP JP2008302037A patent/JP5018752B2/ja not_active Expired - Lifetime
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