RU2017124202A - Электропроводный расклинивающий наполнитель и способы его получения и применения - Google Patents
Электропроводный расклинивающий наполнитель и способы его получения и применения Download PDFInfo
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- RU2017124202A RU2017124202A RU2017124202A RU2017124202A RU2017124202A RU 2017124202 A RU2017124202 A RU 2017124202A RU 2017124202 A RU2017124202 A RU 2017124202A RU 2017124202 A RU2017124202 A RU 2017124202A RU 2017124202 A RU2017124202 A RU 2017124202A
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- particles
- proppant
- electrically conductive
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- 239000002245 particle Substances 0.000 claims 34
- 238000012856 packing Methods 0.000 claims 13
- 239000000243 solution Substances 0.000 claims 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 10
- 229910052751 metal Inorganic materials 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 9
- 239000011248 coating agent Substances 0.000 claims 8
- 238000000576 coating method Methods 0.000 claims 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 6
- 239000012798 spherical particle Substances 0.000 claims 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 5
- 229910052763 palladium Inorganic materials 0.000 claims 5
- 229910052709 silver Inorganic materials 0.000 claims 5
- 239000004332 silver Substances 0.000 claims 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 4
- 239000011149 active material Substances 0.000 claims 4
- 239000003638 chemical reducing agent Substances 0.000 claims 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 4
- 239000004576 sand Substances 0.000 claims 4
- 239000011135 tin Substances 0.000 claims 4
- 229910052718 tin Inorganic materials 0.000 claims 4
- 230000003213 activating effect Effects 0.000 claims 3
- 230000005484 gravity Effects 0.000 claims 3
- 229910052759 nickel Inorganic materials 0.000 claims 3
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 2
- 239000012670 alkaline solution Substances 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 229910052703 rhodium Inorganic materials 0.000 claims 2
- 239000010948 rhodium Substances 0.000 claims 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims 2
- 239000012279 sodium borohydride Substances 0.000 claims 2
- 229910000033 sodium borohydride Inorganic materials 0.000 claims 2
- BEOOHQFXGBMRKU-UHFFFAOYSA-N sodium cyanoborohydride Chemical compound [Na+].[B-]C#N BEOOHQFXGBMRKU-UHFFFAOYSA-N 0.000 claims 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims 2
- 229910052725 zinc Inorganic materials 0.000 claims 2
- 239000011701 zinc Substances 0.000 claims 2
- 230000004913 activation Effects 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K8/00—Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
- C09K8/60—Compositions for stimulating production by acting on the underground formation
- C09K8/80—Compositions for reinforcing fractures, e.g. compositions of proppants used to keep the fractures open
- C09K8/805—Coated proppants
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
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- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B43/00—Methods or apparatus for obtaining oil, gas, water, soluble or meltable materials or a slurry of minerals from wells
- E21B43/25—Methods for stimulating production
- E21B43/26—Methods for stimulating production by forming crevices or fractures
- E21B43/267—Methods for stimulating production by forming crevices or fractures reinforcing fractures by propping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/10—Solid density
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- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24372—Particulate matter
- Y10T428/2438—Coated
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Claims (31)
1. Набивка из расклинивающего наполнителя, содержащая:
множество частиц, причем каждая указанная частица содержит по существу равномерное покрытие из электропроводного металла с толщиной по меньшей мере 10 нм, образованное на наружной поверхности каждой указанной частицы, причем каждая частица характеризуется удельной массой менее 4 и размером от приблизительно 80 меш до приблизительно 10 меш, причем набивка характеризуется электропроводностью по меньшей мере приблизительно 5 См/м, и причем увеличение нагрузки на набивку в 2 раза повышает электропроводность набивки по меньшей мере на 50%.
2. Набивка из расклинивающего наполнителя по п. 1, в которой множество частиц выбрано из группы, состоящей из песка, покрытого смолой песка и обожженных, по существу круглых и сферических частиц.
3. Набивка из расклинивающего наполнителя по п. 2, в которой увеличение нагрузки на набивку в 2 раза снижает электрическое удельное сопротивление набивки на величину от приблизительно 5% до приблизительно 25%.
4. Набивка из расклинивающего наполнителя по п. 1, в которой электропроводный металл имеет толщину от приблизительно 500 нм до приблизительно 1200 нм.
5. Набивка из расклинивающего наполнителя по п. 1, в которой электропроводный металл имеет толщину от приблизительно 50 нм до приблизительно 200 нм.
6. Набивка из расклинивающего наполнителя по п. 5, в которой каждая указанная частица характеризуется шероховатостью менее 5 мкм.
7. Набивка из расклинивающего наполнителя по п. 1, в которой электропроводный металл выбран из группы, состоящей из алюминия, олова, цинка, меди, серебра, никеля, золота, платины, палладия и родия.
8. Набивка из расклинивающего наполнителя по п. 3, в которой электропроводный металл осаждается на наружную поверхность каждой указанной частицы при помощи автокаталитического осаждения.
9. Набивка из расклинивающего наполнителя по п. 1, причем набивка из расклинивающего наполнителя характеризуется электрическим удельным сопротивлением менее 0,5 Ом-см.
10. Набивка из расклинивающего наполнителя по п. 1, в которой наружная поверхность каждой указанной частицы содержит палладий, серебро или любую их комбинацию.
11. Набивка из расклинивающего наполнителя по п. 1, причем набивка из расклинивающего наполнителя характеризуется длительной удельной проводимостью флюида при 7500 фунтах/кв. дюйм по меньшей мере приблизительно 100 мД-фут.
12. Способ получения электропроводных частиц расклинивающего наполнителя, включающий:
контакт множества частиц с щелочным раствором с рН свыше 8 для получения обработанных частиц и
контакт обработанных частиц с раствором для нанесения покрытия, содержащим один или более электропроводных металлов, для получения электропроводных частиц расклинивающего наполнителя, содержащих по существу равномерное покрытие из электропроводного металла с толщиной по меньшей мере 10 нм, образованное на наружной поверхности каждой указанной частицы, причем набивка из электропроводных частиц расклинивающего наполнителя характеризуется электропроводностью по меньшей мере приблизительно 5 См/м, и причем увеличение нагрузки на набивку в 2 раза повышает электропроводность набивки по меньшей мере на 50%.
13. Способ по п. 12, дополнительно включающий:
контакт обработанных частиц с активирующим раствором, содержащим каталитически активный материал, для получения активированных частиц, причем каталитически активный материал включает олово, палладий или серебро или любую их комбинацию; и
контакт активированных частиц с раствором для нанесения покрытия для получения электропроводных частиц расклинивающего наполнителя.
14. Способ по п. 12, дополнительно включающий:
контакт обработанных частиц с раствором восстанавливающего средства для получения активированных частиц, причем раствор восстанавливающего средства содержит боргидрид натрия, гипофосфит натрия или цианоборгидрид натрия или любую их комбинацию; и
контакт активированных частиц с раствором для нанесения покрытия для получения электропроводных частиц расклинивающего наполнителя.
15. Способ по п. 12, в котором множество частиц выбирают из группы, состоящей из песка, покрытого смолой песка и обожженных, по существу круглых и сферических частиц.
16. Способ по п. 14, в котором каждая из множества частиц характеризуется удельной массой менее 3,8.
17. Способ получения электропроводных частиц расклинивающего наполнителя, включающий:
активацию множества обожженных, по существу круглых и сферических частиц для получения активированных частиц, причем каждая из множества обожженных, по существу круглых и сферических частиц характеризуется удельной массой менее 4 и размером от приблизительно 80 меш до приблизительно 10 меш; и
контакт активированных частиц с раствором для нанесения покрытия, содержащим один или более электропроводных металлов, для получения электропроводных частиц расклинивающего наполнителя, содержащих по существу равномерное покрытие из электропроводного металла с толщиной по меньшей мере 10 нм, образованное на наружной поверхности каждой указанной частицы, причем набивка из электропроводных частиц расклинивающего наполнителя характеризуется электропроводностью по меньшей мере приблизительно 5 См/м, и причем увеличение нагрузки на набивку в 2 раза повышает электропроводность набивки по меньшей мере на 50%.
18. Способ по п. 17, в котором активация обработанных частиц включает одно из:
контакта множества обожженных, по существу круглых и сферических частиц с активирующим раствором, содержащим каталитически активный материал, для получения активированных частиц, причем каталитически активный материал включает олово, палладий или серебро или любую их комбинацию; или
контакта множества обожженных, по существу круглых и сферических частиц с раствором восстанавливающего средства для получения активированных частиц, причем раствор восстанавливающего средства содержит боргидрид натрия, гипофосфит натрия или цианоборгидрид натрия или любую их комбинацию.
19. Способ по п. 17, в котором электропроводный металл выбирают из группы, состоящей из алюминия, олова, цинка, меди, серебра, никеля, золота, платины, палладия и родия.
20. Способ по п. 19, в котором раствор для нанесения покрытия представляет собой щелочной раствор, содержащий никель.
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| US14/572,486 US9434875B1 (en) | 2014-12-16 | 2014-12-16 | Electrically-conductive proppant and methods for making and using same |
| US14/572,486 | 2014-12-16 | ||
| PCT/US2015/065354 WO2016100135A2 (en) | 2014-12-16 | 2015-12-11 | Electrically-conductive proppant and methods for making and using same |
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| WO2012087175A1 (en) | 2010-12-21 | 2012-06-28 | Schlumberger Holdings Limited | Method for estimating properties of a subterranean formation |
| US8773132B2 (en) | 2011-01-05 | 2014-07-08 | Conocophillips Company | Fracture detection via self-potential methods with an electrically reactive proppant |
| BR112013018398A2 (pt) | 2011-01-21 | 2017-08-01 | Groundmetrics Inc | métodos, sistemas e aparatos para sentir e medir o campo elétrico dentro da terra |
| WO2012128747A1 (en) * | 2011-03-18 | 2012-09-27 | William Marsh Rice University | Graphite oxide coated particulate material and uses thereof |
| US8680866B2 (en) | 2011-04-20 | 2014-03-25 | Saudi Arabian Oil Company | Borehole to surface electromagnetic transmitter |
| US8993489B2 (en) * | 2011-05-03 | 2015-03-31 | Preferred Technology, Llc | Coated and cured proppants |
| US20140239957A1 (en) | 2011-07-19 | 2014-08-28 | Schlumberger Technology Corporation | Using Low Frequency For Detecting Formation Structures Filled With Magnetic Fluid |
| US9176930B2 (en) | 2011-11-29 | 2015-11-03 | Exxonmobil Upstream Research Company | Methods for approximating hessian times vector operation in full wavefield inversion |
| US20140374091A1 (en) | 2013-06-20 | 2014-12-25 | Schlumberger Technology Corporation | Electromagnetic Imaging Of Proppant In Induced Fractures |
| CA2877147A1 (en) | 2012-06-29 | 2014-01-03 | Schlumberger Canada Limited | Electromagnetic imaging of proppant in induced fractures |
| US20140041862A1 (en) | 2012-08-07 | 2014-02-13 | Halliburton Energy Services, Inc. | Use of Magnetic Liquids for Imaging and Mapping Porous Subterranean Formations |
| US9657558B2 (en) | 2012-12-28 | 2017-05-23 | Schlumberger Technology Corporation | Method for treating and measuring subterranean formations |
| US9434875B1 (en) * | 2014-12-16 | 2016-09-06 | Carbo Ceramics Inc. | Electrically-conductive proppant and methods for making and using same |
| BR112015015733A2 (pt) | 2013-01-04 | 2017-07-11 | Carbo Ceramics Inc | partículas de areia revestidas com resina eletricamente condutivas e métodos para detectar, localizar e caracterizar as partículas de areia eletricamente condutivas |
| US8633700B1 (en) | 2013-03-05 | 2014-01-21 | Hunt Energy Enterprises, Llc | Sensors for passive electroseismic and seismoelectric surveying |
| US20160040514A1 (en) | 2013-03-15 | 2016-02-11 | Board Of Regents, The University Of Texas System | Reservoir Characterization and Hydraulic Fracture Evaluation |
| US10100247B2 (en) * | 2013-05-17 | 2018-10-16 | Preferred Technology, Llc | Proppant with enhanced interparticle bonding |
| US10132952B2 (en) | 2013-06-10 | 2018-11-20 | Saudi Arabian Oil Company | Sensor for measuring the electromagnetic fields on land and underwater |
-
2014
- 2014-12-16 US US14/572,486 patent/US9434875B1/en active Active
-
2015
- 2015-12-11 WO PCT/US2015/065354 patent/WO2016100135A2/en active Application Filing
- 2015-12-11 BR BR112017012689A patent/BR112017012689A2/pt not_active Application Discontinuation
- 2015-12-11 RU RU2017124202A patent/RU2722911C2/ru active
- 2015-12-11 CN CN201580073401.2A patent/CN107109206A/zh active Pending
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2016
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2018
- 2018-12-31 US US16/236,982 patent/US20190136122A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016100135A3 (en) | 2016-09-01 |
| US20160369163A1 (en) | 2016-12-22 |
| US20160237342A1 (en) | 2016-08-18 |
| US10167422B2 (en) | 2019-01-01 |
| RU2722911C2 (ru) | 2020-06-04 |
| BR112017012689A2 (pt) | 2018-01-02 |
| US20190136122A1 (en) | 2019-05-09 |
| CN107109206A (zh) | 2017-08-29 |
| US9434875B1 (en) | 2016-09-06 |
| WO2016100135A2 (en) | 2016-06-23 |
| RU2017124202A3 (ru) | 2019-07-17 |
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