JP2021502259A5 - - Google Patents

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Publication number
JP2021502259A5
JP2021502259A5 JP2020544348A JP2020544348A JP2021502259A5 JP 2021502259 A5 JP2021502259 A5 JP 2021502259A5 JP 2020544348 A JP2020544348 A JP 2020544348A JP 2020544348 A JP2020544348 A JP 2020544348A JP 2021502259 A5 JP2021502259 A5 JP 2021502259A5
Authority
JP
Japan
Prior art keywords
weight
lead
free solder
solder alloy
alloy according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020544348A
Other languages
English (en)
Japanese (ja)
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JP2021502259A (ja
Filing date
Publication date
Priority claimed from US16/022,337 external-priority patent/US11577343B2/en
Application filed filed Critical
Publication of JP2021502259A publication Critical patent/JP2021502259A/ja
Publication of JP2021502259A5 publication Critical patent/JP2021502259A5/ja
Pending legal-status Critical Current

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JP2020544348A 2017-11-09 2018-10-31 高信頼性用途のための標準的なｓａｃ合金への低銀スズ系代替はんだ合金 Pending JP2021502259A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762583934P 2017-11-09 2017-11-09
US62/583,934 2017-11-09
US16/022,337 US11577343B2 (en) 2017-11-09 2018-06-28 Low-silver alternative to standard SAC alloys for high reliability applications
US16/022,337 2018-06-28
PCT/US2018/058463 WO2019094242A1 (en) 2017-11-09 2018-10-31 Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications

Publications (2)

Publication Number Publication Date
JP2021502259A JP2021502259A (ja) 2021-01-28
JP2021502259A5 true JP2021502259A5 (enExample) 2021-12-09

Family

ID=66326662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020544348A Pending JP2021502259A (ja) 2017-11-09 2018-10-31 高信頼性用途のための標準的なｓａｃ合金への低銀スズ系代替はんだ合金

Country Status (9)

Country Link
US (1) US11577343B2 (enExample)
EP (2) EP3707285B1 (enExample)
JP (1) JP2021502259A (enExample)
KR (1) KR102667732B1 (enExample)
CN (1) CN111542624A (enExample)
HU (1) HUE065228T2 (enExample)
SG (1) SG11202004067UA (enExample)
TW (1) TWI782134B (enExample)
WO (1) WO2019094242A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102187085B1 (ko) * 2019-01-24 2020-12-04 주식회사 경동엠텍 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법
TWI814081B (zh) 2019-09-02 2023-09-01 美商阿爾發金屬化工公司 高溫超高可靠性合金、其製造方法及其應用
WO2024034689A1 (ja) * 2022-08-12 2024-02-15 千住金属工業株式会社 はんだ合金、はんだペースト及びはんだ継手
CN117798544B (zh) * 2023-11-10 2024-09-20 苏州优诺电子材料科技有限公司 一种高强抗热疲劳无铅焊料合金及其制备方法
WO2025131329A1 (en) 2023-12-20 2025-06-26 Alpha Assembly Solutions Inc. Solder joint comprising a tin alloy and an encapsulant comprising silica particles in an epoxy resin, and electronic device
CN119525811B (zh) * 2025-01-20 2025-04-08 深圳市唯特偶新材料股份有限公司 一种防枝晶高可靠锡膏及其制备方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6176947B1 (en) 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
SG98429A1 (en) * 1999-10-12 2003-09-19 Singapore Asahi Chemical & Solder Ind Pte Ltd Lead-free solders
JP3599101B2 (ja) * 2000-12-11 2004-12-08 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
US8216395B2 (en) * 2001-06-28 2012-07-10 Senju Metal Industry Co., Ltd. Lead-free solder alloy
JP2004141910A (ja) * 2002-10-23 2004-05-20 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
GB2419137A (en) * 2004-10-15 2006-04-19 Alpha Fry Ltd Solder alloy
EP1889684B1 (en) * 2005-06-03 2016-03-30 Senju Metal Industry Co., Ltd. Lead-free solder alloy
CN100453244C (zh) * 2005-12-16 2009-01-21 浙江亚通焊材有限公司 无铅锡焊料
JP5024380B2 (ja) * 2007-07-13 2012-09-12 千住金属工業株式会社 車載実装用鉛フリーはんだと車載電子回路
DE102009039355A1 (de) * 2009-08-29 2011-03-24 Umicore Ag & Co. Kg Lotlegierung
JP5722302B2 (ja) * 2010-02-16 2015-05-20 株式会社タムラ製作所 鉛フリーはんだ合金と、これを用いたソルダペースト及び実装品
JP2011251310A (ja) 2010-06-02 2011-12-15 Nippon Genma:Kk 鉛フリーはんだ合金
US9024442B2 (en) * 2010-08-18 2015-05-05 Nippon Steel & Sumikin Materials Co., Ltd. Solder ball for semiconductor packaging and electronic member using the same
WO2012127642A1 (ja) * 2011-03-23 2012-09-27 千住金属工業株式会社 鉛フリーはんだ合金
BR112014032941A2 (pt) * 2012-06-30 2017-06-27 Senju Metal Industry Co bola de solda sem chumbo
JP5893528B2 (ja) * 2012-07-27 2016-03-23 新日鉄住金マテリアルズ株式会社 無鉛はんだバンプ接合構造
US20150266137A1 (en) 2012-10-09 2015-09-24 Alpha Metals, Inc. Lead-free and antimony-free tin solder reliable at high temperatures
JP2015077601A (ja) 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
JP5730354B2 (ja) 2013-07-17 2015-06-10 ハリマ化成株式会社 はんだ組成物、ソルダペーストおよび電子回路基板
US9559543B2 (en) * 2013-07-19 2017-01-31 Apple Inc. Adaptive effective C-rate charging of batteries
KR20160053838A (ko) * 2013-09-11 2016-05-13 센주긴조쿠고교 가부시키가이샤 무연 땜납, 무연 땜납 볼, 이 무연 땜납을 사용한 땜납 조인트 및 이 땜납 조인트를 갖는 반도체 회로
JP2016019992A (ja) 2014-07-14 2016-02-04 株式会社日本スペリア社 アルミニウム用はんだ及びはんだ継手
JP5723056B1 (ja) * 2014-12-15 2015-05-27 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
US20160279741A1 (en) 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device
KR102566561B1 (ko) * 2015-07-24 2023-08-11 하리마카세이 가부시기가이샤 땜납 합금, 솔더 페이스트 및 전자 회로 기판
US10195698B2 (en) 2015-09-03 2019-02-05 AIM Metals & Alloys Inc. Lead-free high reliability solder alloys
JP6402127B2 (ja) * 2016-03-09 2018-10-10 株式会社タムラ製作所 電子部品の接合方法
KR101925760B1 (ko) * 2016-03-22 2018-12-05 가부시키가이샤 다무라 세이사쿠쇼 납 프리 땜납 합금, 플럭스 조성물, 솔더 페이스트 조성물, 전자 회로 기판 및 전자 제어 장치
US20180102464A1 (en) * 2016-10-06 2018-04-12 Alpha Assembly Solutions Inc. Advanced Solder Alloys For Electronic Interconnects

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