MX2018002650A - Aleaciones para soldadura sin plomo de alta confiabilidad. - Google Patents

Aleaciones para soldadura sin plomo de alta confiabilidad.

Info

Publication number
MX2018002650A
MX2018002650A MX2018002650A MX2018002650A MX2018002650A MX 2018002650 A MX2018002650 A MX 2018002650A MX 2018002650 A MX2018002650 A MX 2018002650A MX 2018002650 A MX2018002650 A MX 2018002650A MX 2018002650 A MX2018002650 A MX 2018002650A
Authority
MX
Mexico
Prior art keywords
lead
high temperature
solder alloys
free
tin
Prior art date
Application number
MX2018002650A
Other languages
English (en)
Inventor
MAALEKIAN Mehran
Seelig Karl
Original Assignee
Aim Metals & Alloys Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aim Metals & Alloys Inc filed Critical Aim Metals & Alloys Inc
Publication of MX2018002650A publication Critical patent/MX2018002650A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Details Of Resistors (AREA)

Abstract

Una aleación de soldadura a base de estaño sin plomo contiene aproximadamente 0.6 a 0.8 % en peso de cobre, aproximadamente 2.8 a aproximadamente 3.2% en peso de plata, aproximadamente 2.8 a aproximadamente 3.2% en peso de bismuto, aproximadamente 0.5 a 0.7 % en peso de antimonio, aproximadamente 0.04 a 0.07% en peso de níquel y aproximadamente 0.007 a 0.015% en peso de titanio, presenta una temperatura de fusión relativamente baja, un intervalo angosto de solidificación y subenfriamiento, alta dureza y resistencia a la tracción a temperatura ambiente y alta temperatura, buena conformabilidad, desempeño de confiabilidad superior tal como resistencia a la fluencia a alta temperatura, mejor resistencia de la fatiga de ciclo térmico en dispositivos de montaje superficiales sin plomo (QFN y BGA), microestructura estable a alta temperatura, muy buen desempeño de soldabilidad, baja formación de huecos en componentes terminados en el fondo, y reducción en el crecimiento de filamentos de estaño en comparación con otras aleaciones de soldadura sin plomo.
MX2018002650A 2015-09-03 2016-09-01 Aleaciones para soldadura sin plomo de alta confiabilidad. MX2018002650A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562213893P 2015-09-03 2015-09-03
US15/252,347 US10195698B2 (en) 2015-09-03 2016-08-31 Lead-free high reliability solder alloys
PCT/CA2016/000224 WO2017035632A1 (en) 2015-09-03 2016-09-01 Lead-free high reliability solder alloys

Publications (1)

Publication Number Publication Date
MX2018002650A true MX2018002650A (es) 2018-11-09

Family

ID=58186375

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018002650A MX2018002650A (es) 2015-09-03 2016-09-01 Aleaciones para soldadura sin plomo de alta confiabilidad.

Country Status (3)

Country Link
US (1) US10195698B2 (es)
MX (1) MX2018002650A (es)
WO (1) WO2017035632A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107245602B (zh) * 2017-06-09 2019-03-22 升贸科技股份有限公司 无铅锡合金及使用其的镀锡铜线
US11577343B2 (en) 2017-11-09 2023-02-14 Alpha Assembly Solutions Inc. Low-silver alternative to standard SAC alloys for high reliability applications
US11732330B2 (en) * 2017-11-09 2023-08-22 Alpha Assembly Solutions, Inc. High reliability lead-free solder alloy for electronic applications in extreme environments
US10957030B2 (en) 2018-08-14 2021-03-23 International Business Machines Corporation Image conduction apparatus for soldering inner void analysis
TWI814081B (zh) * 2019-09-02 2023-09-01 美商阿爾發金屬化工公司 高溫超高可靠性合金、其製造方法及其應用
CN113275556B (zh) * 2021-05-10 2023-05-02 浙江工业大学 一种具有低过冷度的Sn基多元素金属微球及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4667871A (en) 1985-07-24 1987-05-26 Gte Products Corporation Tin based ductile brazing alloys
JPH0845940A (ja) 1994-07-28 1996-02-16 Tanaka Denshi Kogyo Kk 半田ワイヤ及び半田バンプ電極
JP3673021B2 (ja) * 1996-06-12 2005-07-20 内橋エステック株式会社 電子部品実装用無鉛はんだ
GB9701819D0 (en) 1997-01-29 1997-03-19 Alpha Fry Ltd Lead-free tin alloy
WO2000076717A1 (fr) * 1999-06-11 2000-12-21 Nippon Sheet Glass Co., Ltd. Soudure sans plomb
WO2001036148A1 (fr) * 1999-11-18 2001-05-25 Nippon Steel Corporation Alliage de soudage, element electronique dote de globule et de bossage de soudure
WO2002099146A1 (en) 2001-06-05 2002-12-12 The Penn State Research Foundation Novel high-temperature laed-free solders
US9260768B2 (en) 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
KR101406174B1 (ko) 2007-06-18 2014-06-12 엠케이전자 주식회사 주석, 은 및 비스무스를 함유하는 무연솔더
US20090065097A1 (en) 2007-09-09 2009-03-12 Chen Minghan lead-free solder of sn-0.7wt%cu
TW201210733A (en) * 2010-08-26 2012-03-16 Dynajoin Corp Variable melting point solders
WO2012127642A1 (ja) * 2011-03-23 2012-09-27 千住金属工業株式会社 鉛フリーはんだ合金
EP2799181B1 (en) 2011-12-27 2018-09-26 Senju Metal Industry Co., Ltd Sn-Cu-Al-Ti BASED LEAD-FREE SOLDER ALLOY
CN110900036B (zh) 2012-10-09 2022-10-28 阿尔法组装解决方案公司 高温可靠的无铅并且无锑的锡焊料

Also Published As

Publication number Publication date
US10195698B2 (en) 2019-02-05
WO2017035632A1 (en) 2017-03-09
US20170066089A1 (en) 2017-03-09

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