MX2018002650A - Aleaciones para soldadura sin plomo de alta confiabilidad. - Google Patents
Aleaciones para soldadura sin plomo de alta confiabilidad.Info
- Publication number
- MX2018002650A MX2018002650A MX2018002650A MX2018002650A MX2018002650A MX 2018002650 A MX2018002650 A MX 2018002650A MX 2018002650 A MX2018002650 A MX 2018002650A MX 2018002650 A MX2018002650 A MX 2018002650A MX 2018002650 A MX2018002650 A MX 2018002650A
- Authority
- MX
- Mexico
- Prior art keywords
- lead
- high temperature
- solder alloys
- free
- tin
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Details Of Resistors (AREA)
Abstract
Una aleación de soldadura a base de estaño sin plomo contiene aproximadamente 0.6 a 0.8 % en peso de cobre, aproximadamente 2.8 a aproximadamente 3.2% en peso de plata, aproximadamente 2.8 a aproximadamente 3.2% en peso de bismuto, aproximadamente 0.5 a 0.7 % en peso de antimonio, aproximadamente 0.04 a 0.07% en peso de níquel y aproximadamente 0.007 a 0.015% en peso de titanio, presenta una temperatura de fusión relativamente baja, un intervalo angosto de solidificación y subenfriamiento, alta dureza y resistencia a la tracción a temperatura ambiente y alta temperatura, buena conformabilidad, desempeño de confiabilidad superior tal como resistencia a la fluencia a alta temperatura, mejor resistencia de la fatiga de ciclo térmico en dispositivos de montaje superficiales sin plomo (QFN y BGA), microestructura estable a alta temperatura, muy buen desempeño de soldabilidad, baja formación de huecos en componentes terminados en el fondo, y reducción en el crecimiento de filamentos de estaño en comparación con otras aleaciones de soldadura sin plomo.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562213893P | 2015-09-03 | 2015-09-03 | |
US15/252,347 US10195698B2 (en) | 2015-09-03 | 2016-08-31 | Lead-free high reliability solder alloys |
PCT/CA2016/000224 WO2017035632A1 (en) | 2015-09-03 | 2016-09-01 | Lead-free high reliability solder alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2018002650A true MX2018002650A (es) | 2018-11-09 |
Family
ID=58186375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2018002650A MX2018002650A (es) | 2015-09-03 | 2016-09-01 | Aleaciones para soldadura sin plomo de alta confiabilidad. |
Country Status (3)
Country | Link |
---|---|
US (1) | US10195698B2 (es) |
MX (1) | MX2018002650A (es) |
WO (1) | WO2017035632A1 (es) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107245602B (zh) * | 2017-06-09 | 2019-03-22 | 升贸科技股份有限公司 | 无铅锡合金及使用其的镀锡铜线 |
US11577343B2 (en) | 2017-11-09 | 2023-02-14 | Alpha Assembly Solutions Inc. | Low-silver alternative to standard SAC alloys for high reliability applications |
US11732330B2 (en) * | 2017-11-09 | 2023-08-22 | Alpha Assembly Solutions, Inc. | High reliability lead-free solder alloy for electronic applications in extreme environments |
US10957030B2 (en) | 2018-08-14 | 2021-03-23 | International Business Machines Corporation | Image conduction apparatus for soldering inner void analysis |
TWI814081B (zh) * | 2019-09-02 | 2023-09-01 | 美商阿爾發金屬化工公司 | 高溫超高可靠性合金、其製造方法及其應用 |
CN113275556B (zh) * | 2021-05-10 | 2023-05-02 | 浙江工业大学 | 一种具有低过冷度的Sn基多元素金属微球及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4667871A (en) | 1985-07-24 | 1987-05-26 | Gte Products Corporation | Tin based ductile brazing alloys |
JPH0845940A (ja) | 1994-07-28 | 1996-02-16 | Tanaka Denshi Kogyo Kk | 半田ワイヤ及び半田バンプ電極 |
JP3673021B2 (ja) * | 1996-06-12 | 2005-07-20 | 内橋エステック株式会社 | 電子部品実装用無鉛はんだ |
GB9701819D0 (en) | 1997-01-29 | 1997-03-19 | Alpha Fry Ltd | Lead-free tin alloy |
WO2000076717A1 (fr) * | 1999-06-11 | 2000-12-21 | Nippon Sheet Glass Co., Ltd. | Soudure sans plomb |
WO2001036148A1 (fr) * | 1999-11-18 | 2001-05-25 | Nippon Steel Corporation | Alliage de soudage, element electronique dote de globule et de bossage de soudure |
WO2002099146A1 (en) | 2001-06-05 | 2002-12-12 | The Penn State Research Foundation | Novel high-temperature laed-free solders |
US9260768B2 (en) | 2005-12-13 | 2016-02-16 | Indium Corporation | Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
KR101406174B1 (ko) | 2007-06-18 | 2014-06-12 | 엠케이전자 주식회사 | 주석, 은 및 비스무스를 함유하는 무연솔더 |
US20090065097A1 (en) | 2007-09-09 | 2009-03-12 | Chen Minghan | lead-free solder of sn-0.7wt%cu |
TW201210733A (en) * | 2010-08-26 | 2012-03-16 | Dynajoin Corp | Variable melting point solders |
WO2012127642A1 (ja) * | 2011-03-23 | 2012-09-27 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
EP2799181B1 (en) | 2011-12-27 | 2018-09-26 | Senju Metal Industry Co., Ltd | Sn-Cu-Al-Ti BASED LEAD-FREE SOLDER ALLOY |
CN110900036B (zh) | 2012-10-09 | 2022-10-28 | 阿尔法组装解决方案公司 | 高温可靠的无铅并且无锑的锡焊料 |
-
2016
- 2016-08-31 US US15/252,347 patent/US10195698B2/en active Active
- 2016-09-01 MX MX2018002650A patent/MX2018002650A/es unknown
- 2016-09-01 WO PCT/CA2016/000224 patent/WO2017035632A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US10195698B2 (en) | 2019-02-05 |
WO2017035632A1 (en) | 2017-03-09 |
US20170066089A1 (en) | 2017-03-09 |
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