JP2003217415A5 - - Google Patents

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Publication number
JP2003217415A5
JP2003217415A5 JP2002009742A JP2002009742A JP2003217415A5 JP 2003217415 A5 JP2003217415 A5 JP 2003217415A5 JP 2002009742 A JP2002009742 A JP 2002009742A JP 2002009742 A JP2002009742 A JP 2002009742A JP 2003217415 A5 JP2003217415 A5 JP 2003217415A5
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JP
Japan
Prior art keywords
lead
metal
alloy
terminal lead
eutectic alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002009742A
Other languages
English (en)
Japanese (ja)
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JP2003217415A (ja
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Publication date
Application filed filed Critical
Priority to JP2002009742A priority Critical patent/JP2003217415A/ja
Priority claimed from JP2002009742A external-priority patent/JP2003217415A/ja
Publication of JP2003217415A publication Critical patent/JP2003217415A/ja
Publication of JP2003217415A5 publication Critical patent/JP2003217415A5/ja
Withdrawn legal-status Critical Current

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JP2002009742A 2002-01-18 2002-01-18 鉛フリ−合金型温度ヒュ−ズ Withdrawn JP2003217415A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002009742A JP2003217415A (ja) 2002-01-18 2002-01-18 鉛フリ−合金型温度ヒュ−ズ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002009742A JP2003217415A (ja) 2002-01-18 2002-01-18 鉛フリ−合金型温度ヒュ−ズ

Publications (2)

Publication Number Publication Date
JP2003217415A JP2003217415A (ja) 2003-07-31
JP2003217415A5 true JP2003217415A5 (enExample) 2005-07-28

Family

ID=27647668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002009742A Withdrawn JP2003217415A (ja) 2002-01-18 2002-01-18 鉛フリ−合金型温度ヒュ−ズ

Country Status (1)

Country Link
JP (1) JP2003217415A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7159756B2 (en) * 2003-08-29 2007-01-09 Ppg Industries Ohio, Inc. Method of soldering and solder compositions
JP4692822B2 (ja) * 2005-10-19 2011-06-01 千住金属工業株式会社 温度ヒューズ用合金
JP2007294117A (ja) * 2006-04-21 2007-11-08 Uchihashi Estec Co Ltd 保護素子及び保護素子の動作方法
JP4946419B2 (ja) * 2006-12-20 2012-06-06 パナソニック株式会社 温度ヒューズおよびその製造方法
CN102522263A (zh) * 2011-12-31 2012-06-27 上海长园维安电子线路保护有限公司 一种可经过回流焊接的温度熔断器

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