JP2003217415A - 鉛フリ−合金型温度ヒュ−ズ - Google Patents
鉛フリ−合金型温度ヒュ−ズInfo
- Publication number
- JP2003217415A JP2003217415A JP2002009742A JP2002009742A JP2003217415A JP 2003217415 A JP2003217415 A JP 2003217415A JP 2002009742 A JP2002009742 A JP 2002009742A JP 2002009742 A JP2002009742 A JP 2002009742A JP 2003217415 A JP2003217415 A JP 2003217415A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- lead
- temperature
- terminal lead
- joined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 75
- 239000000956 alloy Substances 0.000 title claims abstract description 75
- 229910000743 fusible alloy Inorganic materials 0.000 claims abstract description 28
- 238000007747 plating Methods 0.000 claims abstract description 28
- 229910052709 silver Inorganic materials 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 239000006023 eutectic alloy Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 12
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910052718 tin Inorganic materials 0.000 claims abstract description 6
- 229910020830 Sn-Bi Inorganic materials 0.000 claims abstract description 4
- 229910020888 Sn-Cu Inorganic materials 0.000 claims abstract description 4
- 229910018728 Sn—Bi Inorganic materials 0.000 claims abstract description 4
- 229910019204 Sn—Cu Inorganic materials 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 9
- 229910052738 indium Inorganic materials 0.000 claims 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 18
- 229910052793 cadmium Inorganic materials 0.000 abstract description 6
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011810 insulating material Substances 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 32
- 230000008018 melting Effects 0.000 description 23
- 238000002844 melting Methods 0.000 description 23
- 230000008859 change Effects 0.000 description 8
- 238000009736 wetting Methods 0.000 description 7
- 238000003860 storage Methods 0.000 description 6
- 230000005496 eutectics Effects 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- IUVCFHHAEHNCFT-INIZCTEOSA-N 2-[(1s)-1-[4-amino-3-(3-fluoro-4-propan-2-yloxyphenyl)pyrazolo[3,4-d]pyrimidin-1-yl]ethyl]-6-fluoro-3-(3-fluorophenyl)chromen-4-one Chemical compound C1=C(F)C(OC(C)C)=CC=C1C(C1=C(N)N=CN=C11)=NN1[C@@H](C)C1=C(C=2C=C(F)C=CC=2)C(=O)C2=CC(F)=CC=C2O1 IUVCFHHAEHNCFT-INIZCTEOSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 239000012190 activator Substances 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 229910052745 lead Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H2037/768—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material characterised by the composition of the fusible material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002009742A JP2003217415A (ja) | 2002-01-18 | 2002-01-18 | 鉛フリ−合金型温度ヒュ−ズ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002009742A JP2003217415A (ja) | 2002-01-18 | 2002-01-18 | 鉛フリ−合金型温度ヒュ−ズ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003217415A true JP2003217415A (ja) | 2003-07-31 |
| JP2003217415A5 JP2003217415A5 (enExample) | 2005-07-28 |
Family
ID=27647668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002009742A Withdrawn JP2003217415A (ja) | 2002-01-18 | 2002-01-18 | 鉛フリ−合金型温度ヒュ−ズ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003217415A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007504005A (ja) * | 2003-08-29 | 2007-03-01 | ピーピージー・インダストリーズ・オハイオ・インコーポレイテッド | 半田付け方法および半田組成物 |
| JP2007113050A (ja) * | 2005-10-19 | 2007-05-10 | Senju Metal Ind Co Ltd | 温度ヒューズ用合金 |
| JP2007294117A (ja) * | 2006-04-21 | 2007-11-08 | Uchihashi Estec Co Ltd | 保護素子及び保護素子の動作方法 |
| JP2008153144A (ja) * | 2006-12-20 | 2008-07-03 | Matsushita Electric Ind Co Ltd | 温度ヒューズおよびその製造方法 |
| CN102522263A (zh) * | 2011-12-31 | 2012-06-27 | 上海长园维安电子线路保护有限公司 | 一种可经过回流焊接的温度熔断器 |
-
2002
- 2002-01-18 JP JP2002009742A patent/JP2003217415A/ja not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007504005A (ja) * | 2003-08-29 | 2007-03-01 | ピーピージー・インダストリーズ・オハイオ・インコーポレイテッド | 半田付け方法および半田組成物 |
| JP2007113050A (ja) * | 2005-10-19 | 2007-05-10 | Senju Metal Ind Co Ltd | 温度ヒューズ用合金 |
| JP2007294117A (ja) * | 2006-04-21 | 2007-11-08 | Uchihashi Estec Co Ltd | 保護素子及び保護素子の動作方法 |
| JP2008153144A (ja) * | 2006-12-20 | 2008-07-03 | Matsushita Electric Ind Co Ltd | 温度ヒューズおよびその製造方法 |
| CN102522263A (zh) * | 2011-12-31 | 2012-06-27 | 上海长园维安电子线路保护有限公司 | 一种可经过回流焊接的温度熔断器 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041210 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041210 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20070319 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070404 |