JP4297431B2 - 合金型温度ヒューズおよびそれを用いた保護装置 - Google Patents
合金型温度ヒューズおよびそれを用いた保護装置 Download PDFInfo
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- JP4297431B2 JP4297431B2 JP2004109946A JP2004109946A JP4297431B2 JP 4297431 B2 JP4297431 B2 JP 4297431B2 JP 2004109946 A JP2004109946 A JP 2004109946A JP 2004109946 A JP2004109946 A JP 2004109946A JP 4297431 B2 JP4297431 B2 JP 4297431B2
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- alloy
- thermal fuse
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- 230000001681 protective effect Effects 0.000 title claims description 17
- 229910045601 alloy Inorganic materials 0.000 claims description 49
- 239000000956 alloy Substances 0.000 claims description 49
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 42
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 229910052738 indium Inorganic materials 0.000 claims description 11
- 229910052797 bismuth Inorganic materials 0.000 claims description 9
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 9
- 238000009792 diffusion process Methods 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 230000004907 flux Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229910002058 ternary alloy Inorganic materials 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 229910021654 trace metal Inorganic materials 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 101100434911 Mus musculus Angpt1 gene Proteins 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
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Description
重量%および残部がInの3元合金組成で動作温度120〜135℃と広範囲である。また、特許文献2および特許文献3は感温素子と端子リ−ドを接続し、これを絶縁物のケ−スで蓋い、上記絶縁物のケ−スより端子リ−ドを導出する端部を封止してなる温度ヒュ−ズにおいて、感温素子に固液共存域を有し、その液相線温度と固相線温度との差が13℃未満の非共晶合金を用い、これを当該合金が接合し易いめっき材を部分めっきした端子リードのめっき部に接合し、端子リ−ド自体は当該合金が拡散し難い金属から成る鉛フリ−合金型温度ヒュ−ズにおいてIn50〜53重量%、Bi4.5〜6.5重量%、Cu0.1〜0.5重量%、Ag0.1〜0.5重量%で残部Snとするものであるが、その動作温度は100〜105℃とされている。
3 鉛フリー可溶合金
4 フラックス(ロジン、ワックス、活性剤)
5 絶縁容器(ケース)
6、7 気密封着樹脂(エポキシ封止樹脂、樹脂キャップ)
10 保護装置
12 セラミック基板
14、16 温度ヒューズエレメント(2個に分割の鉛フリー可溶合金)
18 薄膜抵抗
21 絶縁基板
22 鉛フリー可溶合金
23、24、25 電極部(AgPt+Niメッキ層)
26 パッケージ
27、28、29 リード部材
x、y、z 導出用ターミナル(リード部材)
Claims (4)
- 一対のリード部材の電極部に可溶合金を接続し、前記リード部材の導出部を除いて絶縁容器または絶縁材で気密パッケージした温度ヒューズにおいて、前記可溶合金はすず(Sn)が5〜15重量%、銀(Ag)が0.5〜4.5重量%、ビスマス(Bi)が0.1〜2.0重量%、および残部がインジウム(In)の組成範囲内で選定され、ニッケル(Ni)、鉄(Fe)およびコバルト(Co)からなる元素群から選択される少なくとも一種の元素を前記電極部または前記可溶合金に付加して相互拡散を抑止した合金型温度ヒューズ。
- 前記電極部はNiを含む金属メッキ層で形成して前記可溶合金と前記電極部との間の中間層生成を阻止することを特徴とする請求項1に記載の合金型温度ヒューズ。
- 前記金属メッキ層がNi、Ni・PまたはNi・Bのいずれかを選択して厚さ1μm以上のメッキ層としたことを特徴とする請求項2に記載の合金型温度ヒューズ。
- すず(Sn)が5〜15重量%、銀(Ag)が0.5〜4.5重量%、ビスマス(Bi)が0.1〜2.0重量%、および残部がインジウム(In)の組成の可溶合金を、一対のリード部材の電極部間に接続し、前記電極部または前記可溶合金にニッケル(Ni)、鉄(Fe)およびコバルト(Co)からなる元素群から選択される少なくとも一種の元素を付加して相互拡散を抑止した合金型温度ヒューズを絶縁基板上に搭載し、この合金型温度ヒューズに近接して抵抗発熱素子を配置したことを特徴とする保護装置。
Priority Applications (1)
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JP2004109946A JP4297431B2 (ja) | 2003-10-23 | 2004-04-02 | 合金型温度ヒューズおよびそれを用いた保護装置 |
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JP2003363627 | 2003-10-23 | ||
JP2004109946A JP4297431B2 (ja) | 2003-10-23 | 2004-04-02 | 合金型温度ヒューズおよびそれを用いた保護装置 |
Publications (3)
Publication Number | Publication Date |
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JP2005150075A JP2005150075A (ja) | 2005-06-09 |
JP2005150075A5 JP2005150075A5 (ja) | 2005-12-02 |
JP4297431B2 true JP4297431B2 (ja) | 2009-07-15 |
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JP2004109946A Expired - Fee Related JP4297431B2 (ja) | 2003-10-23 | 2004-04-02 | 合金型温度ヒューズおよびそれを用いた保護装置 |
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JP (1) | JP4297431B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5283522B2 (ja) * | 2009-01-27 | 2013-09-04 | エヌイーシー ショット コンポーネンツ株式会社 | 感温材およびその製造方法、温度ヒューズ、回路保護素子 |
KR101090111B1 (ko) * | 2009-03-06 | 2011-12-07 | 주식회사 엑사이엔씨 | 페이스트 조성물을 이용한 히터 |
JP5351860B2 (ja) | 2009-09-04 | 2013-11-27 | 乾坤科技股▲ふん▼有限公司 | 保護装置 |
US9025295B2 (en) | 2009-09-04 | 2015-05-05 | Cyntec Co., Ltd. | Protective device and protective module |
US9129769B2 (en) | 2009-09-04 | 2015-09-08 | Cyntec Co., Ltd. | Protective device |
JP5489749B2 (ja) * | 2010-01-27 | 2014-05-14 | 京セラ株式会社 | 抵抗温度ヒューズ |
JP5586370B2 (ja) * | 2010-08-10 | 2014-09-10 | 京セラ株式会社 | セラミックヒューズおよびセラミックヒューズパッケージ |
US11081764B2 (en) * | 2016-11-22 | 2021-08-03 | Panasonic Intellectual Property Management Co., Ltd. | Battery module |
-
2004
- 2004-04-02 JP JP2004109946A patent/JP4297431B2/ja not_active Expired - Fee Related
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