JP2003217415A5 - - Google Patents

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Publication number
JP2003217415A5
JP2003217415A5 JP2002009742A JP2002009742A JP2003217415A5 JP 2003217415 A5 JP2003217415 A5 JP 2003217415A5 JP 2002009742 A JP2002009742 A JP 2002009742A JP 2002009742 A JP2002009742 A JP 2002009742A JP 2003217415 A5 JP2003217415 A5 JP 2003217415A5
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JP
Japan
Prior art keywords
lead
metal
alloy
terminal lead
eutectic alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002009742A
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Japanese (ja)
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JP2003217415A (en
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Publication date
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Priority to JP2002009742A priority Critical patent/JP2003217415A/en
Priority claimed from JP2002009742A external-priority patent/JP2003217415A/en
Publication of JP2003217415A publication Critical patent/JP2003217415A/en
Publication of JP2003217415A5 publication Critical patent/JP2003217415A5/ja
Withdrawn legal-status Critical Current

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Claims (4)

端子リードに接続した非共晶合金の感温素子を絶縁ケースで蓋い、この絶縁ケースより前記端子リードの導出端部を封止した温度ヒューズにおいて、前記端子リードは前記非共晶合金が拡散し難い金属素地材に前記非共晶合金が接合し易いめっき材を部分めっきした電極部を設け、この電極部に前記非共晶合金を接合したことを特徴とする鉛フリー合金型温度ヒューズ。In a thermal fuse in which a non-eutectic alloy temperature sensing element connected to a terminal lead is covered with an insulating case and the lead-out end of the terminal lead is sealed from the insulating case, the non-eutectic alloy diffuses in the terminal lead. A lead-free alloy type thermal fuse, wherein an electrode part obtained by partially plating a plating material that is easy to join the non-eutectic alloy is provided on a metal base material that is difficult to perform, and the non-eutectic alloy is joined to the electrode part. 前記非共晶合金は固液共存域を有しその液相線温度と固相線温度との差が１２℃未満であって、その組成がＩｎを５０〜５３重量％、Ｂｉを４．５〜６．５重量％、Ｃｕを０．１〜１．０重量％、Ａｇを０．１〜１．０重量％および残部Ｓｎからなることを特徴とする請求項１に記載の鉛フリー合金型温度ヒューズ。The non-eutectic alloy has a solid-liquid coexistence region, the difference between the liquidus temperature and the solidus temperature is less than 12 ° C., and the composition thereof is 50 to 53 wt% In and Bi is 4.5%. The lead-free alloy mold according to claim 1, comprising: -6.5% by weight, Cu: 0.1-1.0% by weight, Ag: 0.1-1.0% by weight and the balance Sn. Thermal fuse. 前記端子リードの金属素地材がＮｉであり、前記電極部がＳｎ、ＣｕおよびＡｇを含む金属群のいずれかの金属であることを特徴とする請求項１または２に記載の金属パッケージ。3. The metal package according to claim 1, wherein a metal base material of the terminal lead is Ni, and the electrode portion is any metal of a metal group including Sn, Cu, and Ag. 前記端子リードの金属素地材がＮｉであり、前記電極部がＳｎ−ＣｕまたはＳｎ−Ｂｉいずれかの合金であることを特徴とする請求項１または２に記載の金属パッケージ。3. The metal package according to claim 1, wherein the metal base material of the terminal lead is Ni, and the electrode portion is an alloy of either Sn—Cu or Sn—Bi.
JP2002009742A 2002-01-18 2002-01-18 Lead-free alloy thermal fuse Withdrawn JP2003217415A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002009742A JP2003217415A (en) 2002-01-18 2002-01-18 Lead-free alloy thermal fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002009742A JP2003217415A (en) 2002-01-18 2002-01-18 Lead-free alloy thermal fuse

Publications (2)

Publication Number Publication Date
JP2003217415A JP2003217415A (en) 2003-07-31
JP2003217415A5 true JP2003217415A5 (en) 2005-07-28

Family

ID=27647668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002009742A Withdrawn JP2003217415A (en) 2002-01-18 2002-01-18 Lead-free alloy thermal fuse

Country Status (1)

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JP (1) JP2003217415A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7159756B2 (en) * 2003-08-29 2007-01-09 Ppg Industries Ohio, Inc. Method of soldering and solder compositions
JP4692822B2 (en) * 2005-10-19 2011-06-01 千住金属工業株式会社 Alloy for thermal fuse
JP2007294117A (en) * 2006-04-21 2007-11-08 Uchihashi Estec Co Ltd Protection element and operation method of protection element
JP4946419B2 (en) * 2006-12-20 2012-06-06 パナソニック株式会社 Thermal fuse and manufacturing method thereof
CN102522263A (en) * 2011-12-31 2012-06-27 上海长园维安电子线路保护有限公司 Temperature fuse capable of being soldered through reflow

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