HUE065228T2 - Alacsony ezüsttartalmú ónalapú alternatív forrasztóötvözet a szabványos sac ötvözetekhez, nagy megbízhatóságú alkalmazásokhoz - Google Patents
Alacsony ezüsttartalmú ónalapú alternatív forrasztóötvözet a szabványos sac ötvözetekhez, nagy megbízhatóságú alkalmazásokhozInfo
- Publication number
- HUE065228T2 HUE065228T2 HUE18804799A HUE18804799A HUE065228T2 HU E065228 T2 HUE065228 T2 HU E065228T2 HU E18804799 A HUE18804799 A HU E18804799A HU E18804799 A HUE18804799 A HU E18804799A HU E065228 T2 HUE065228 T2 HU E065228T2
- Authority
- HU
- Hungary
- Prior art keywords
- low
- high reliability
- solder alloy
- tin based
- silver tin
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title 2
- 239000000956 alloy Substances 0.000 title 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title 1
- 229910052709 silver Inorganic materials 0.000 title 1
- 239000004332 silver Substances 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Glass Compositions (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762583934P | 2017-11-09 | 2017-11-09 | |
| US16/022,337 US11577343B2 (en) | 2017-11-09 | 2018-06-28 | Low-silver alternative to standard SAC alloys for high reliability applications |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HUE065228T2 true HUE065228T2 (hu) | 2024-05-28 |
Family
ID=66326662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HUE18804799A HUE065228T2 (hu) | 2017-11-09 | 2018-10-31 | Alacsony ezüsttartalmú ónalapú alternatív forrasztóötvözet a szabványos sac ötvözetekhez, nagy megbízhatóságú alkalmazásokhoz |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11577343B2 (hu) |
| EP (2) | EP3707285B1 (hu) |
| JP (1) | JP2021502259A (hu) |
| KR (1) | KR102667732B1 (hu) |
| CN (1) | CN111542624A (hu) |
| HU (1) | HUE065228T2 (hu) |
| SG (1) | SG11202004067UA (hu) |
| TW (1) | TWI782134B (hu) |
| WO (1) | WO2019094242A1 (hu) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102187085B1 (ko) * | 2019-01-24 | 2020-12-04 | 주식회사 경동엠텍 | 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법 |
| TWI814081B (zh) | 2019-09-02 | 2023-09-01 | 美商阿爾發金屬化工公司 | 高溫超高可靠性合金、其製造方法及其應用 |
| CN117798544A (zh) * | 2023-11-10 | 2024-04-02 | 苏州优诺电子材料科技有限公司 | 一种高强抗热疲劳无铅焊料合金及其制备方法 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6176947B1 (en) | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
| SG98429A1 (en) * | 1999-10-12 | 2003-09-19 | Singapore Asahi Chemical & Solder Ind Pte Ltd | Lead-free solders |
| JP3599101B2 (ja) * | 2000-12-11 | 2004-12-08 | 株式会社トッパンＮｅｃサーキットソリューションズ | はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法 |
| US8216395B2 (en) * | 2001-06-28 | 2012-07-10 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
| JP2004141910A (ja) * | 2002-10-23 | 2004-05-20 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
| GB2419137A (en) * | 2004-10-15 | 2006-04-19 | Alpha Fry Ltd | Solder alloy |
| EP1889684B1 (en) * | 2005-06-03 | 2016-03-30 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
| CN100453244C (zh) * | 2005-12-16 | 2009-01-21 | 浙江亚通焊材有限公司 | 无铅锡焊料 |
| US8845826B2 (en) * | 2007-07-13 | 2014-09-30 | Senju Metal Industry Co., Ltd. | Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder |
| DE202009019184U1 (de) * | 2009-08-29 | 2017-11-14 | Umicore Ag & Co. Kg | Lotlegierung |
| WO2011102034A1 (ja) * | 2010-02-16 | 2011-08-25 | 株式会社タムラ製作所 | 鉛フリーはんだ合金と、これを用いたソルダペースト及び実装品 |
| JP2011251310A (ja) | 2010-06-02 | 2011-12-15 | Nippon Genma:Kk | 鉛フリーはんだ合金 |
| CN102666002B (zh) * | 2010-08-18 | 2014-09-10 | 新日铁住金高新材料株式会社 | 半导体安装用钎料球和电子部件 |
| WO2012127642A1 (ja) * | 2011-03-23 | 2012-09-27 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| EP2886243B1 (en) * | 2012-06-30 | 2018-03-14 | Senju Metal Industry Co., Ltd. | Lead-free solder ball |
| JP5893528B2 (ja) * | 2012-07-27 | 2016-03-23 | 新日鉄住金マテリアルズ株式会社 | 無鉛はんだバンプ接合構造 |
| CN103889644B (zh) | 2012-10-09 | 2019-12-31 | 阿尔法组装解决方案公司 | 高温可靠的无铅并且无锑的锡焊料 |
| JP2015077601A (ja) | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| JP5730354B2 (ja) | 2013-07-17 | 2015-06-10 | ハリマ化成株式会社 | はんだ組成物、ソルダペーストおよび電子回路基板 |
| US9559543B2 (en) * | 2013-07-19 | 2017-01-31 | Apple Inc. | Adaptive effective C-rate charging of batteries |
| WO2015037279A1 (ja) * | 2013-09-11 | 2015-03-19 | 千住金属工業株式会社 | 鉛フリーはんだ、鉛フリーはんだボール、この鉛フリーはんだを使用したはんだ継手およびこのはんだ継手を有する半導体回路 |
| JP2016019992A (ja) | 2014-07-14 | 2016-02-04 | 株式会社日本スペリア社 | アルミニウム用はんだ及びはんだ継手 |
| JP5723056B1 (ja) * | 2014-12-15 | 2015-05-27 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
| CN106001978B (zh) * | 2015-03-24 | 2020-02-07 | 株式会社田村制作所 | 无铅软钎料合金、电子电路基板和电子控制装置 |
| US10518362B2 (en) * | 2015-07-24 | 2019-12-31 | Harima Chemicals, Incorporated | Solder alloy, solder paste, and electronic circuit board |
| US10195698B2 (en) | 2015-09-03 | 2019-02-05 | AIM Metals & Alloys Inc. | Lead-free high reliability solder alloys |
| JP6402127B2 (ja) * | 2016-03-09 | 2018-10-10 | 株式会社タムラ製作所 | 電子部品の接合方法 |
| KR102052448B1 (ko) * | 2016-03-22 | 2019-12-05 | 가부시키가이샤 다무라 세이사쿠쇼 | 납 프리 땜납 합금, 플럭스 조성물, 솔더 페이스트 조성물, 전자 회로 기판 및 전자 제어 장치 |
| US20180102464A1 (en) * | 2016-10-06 | 2018-04-12 | Alpha Assembly Solutions Inc. | Advanced Solder Alloys For Electronic Interconnects |
-
2018
- 2018-06-28 US US16/022,337 patent/US11577343B2/en active Active
- 2018-10-31 CN CN201880072408.6A patent/CN111542624A/zh active Pending
- 2018-10-31 WO PCT/US2018/058463 patent/WO2019094242A1/en unknown
- 2018-10-31 KR KR1020207015369A patent/KR102667732B1/ko active IP Right Grant
- 2018-10-31 EP EP18804799.7A patent/EP3707285B1/en active Active
- 2018-10-31 HU HUE18804799A patent/HUE065228T2/hu unknown
- 2018-10-31 EP EP23202671.6A patent/EP4299238A3/en active Pending
- 2018-10-31 SG SG11202004067UA patent/SG11202004067UA/en unknown
- 2018-10-31 JP JP2020544348A patent/JP2021502259A/ja active Pending
- 2018-11-08 TW TW107139607A patent/TWI782134B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| SG11202004067UA (en) | 2020-05-28 |
| EP4299238A2 (en) | 2024-01-03 |
| CN111542624A (zh) | 2020-08-14 |
| EP3707285B1 (en) | 2023-11-29 |
| EP4299238A3 (en) | 2024-03-27 |
| US20190134758A1 (en) | 2019-05-09 |
| EP3707285A1 (en) | 2020-09-16 |
| TWI782134B (zh) | 2022-11-01 |
| JP2021502259A (ja) | 2021-01-28 |
| WO2019094242A1 (en) | 2019-05-16 |
| KR20200089273A (ko) | 2020-07-24 |
| US11577343B2 (en) | 2023-02-14 |
| TW201923103A (zh) | 2019-06-16 |
| KR102667732B1 (ko) | 2024-05-20 |
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