JP5864142B2 - 熱伝導シートの製造方法 - Google Patents

熱伝導シートの製造方法 Download PDF

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Publication number
JP5864142B2
JP5864142B2 JP2011135124A JP2011135124A JP5864142B2 JP 5864142 B2 JP5864142 B2 JP 5864142B2 JP 2011135124 A JP2011135124 A JP 2011135124A JP 2011135124 A JP2011135124 A JP 2011135124A JP 5864142 B2 JP5864142 B2 JP 5864142B2
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Japan
Prior art keywords
sheet
indium
heat conductive
conductive sheet
stage
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Japanese (ja)
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JP2013001968A5 (enExample
JP2013001968A (ja
Inventor
卓也 黒澤
卓也 黒澤
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2011135124A priority Critical patent/JP5864142B2/ja
Publication of JP2013001968A publication Critical patent/JP2013001968A/ja
Publication of JP2013001968A5 publication Critical patent/JP2013001968A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

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  • Powder Metallurgy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2011135124A 2011-06-17 2011-06-17 熱伝導シートの製造方法 Active JP5864142B2 (ja)

Priority Applications (1)

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JP2011135124A JP5864142B2 (ja) 2011-06-17 2011-06-17 熱伝導シートの製造方法

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Application Number Priority Date Filing Date Title
JP2011135124A JP5864142B2 (ja) 2011-06-17 2011-06-17 熱伝導シートの製造方法

Publications (3)

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JP2013001968A JP2013001968A (ja) 2013-01-07
JP2013001968A5 JP2013001968A5 (enExample) 2014-06-26
JP5864142B2 true JP5864142B2 (ja) 2016-02-17

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JP (1) JP5864142B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108817377B (zh) * 2018-06-22 2020-04-14 深圳市绚图新材科技有限公司 一种导电片状银包铜粉的制备方法
CN114874758B (zh) * 2022-05-31 2025-02-21 广东光钛领先新材料有限公司 一种铟基高效导热垫片

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06318655A (ja) * 1993-05-06 1994-11-15 Tanaka Denshi Kogyo Kk 半導体チップ用放熱部材及びその製造方法
JP2000012748A (ja) * 1998-06-22 2000-01-14 Hitachi Ltd 電子回路装置
JP2002160090A (ja) * 2000-11-27 2002-06-04 Tanaka Kikinzoku Kogyo Kk Ａｇ−Ｃｕ−Ｉｎ系ろう材及びＡｇ−Ｃｕ−Ｉｎ系ろう材の製造方法
JP3736452B2 (ja) * 2000-12-21 2006-01-18 株式会社日立製作所 はんだ箔

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JP2013001968A (ja) 2013-01-07

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