JP2020530049A5 - - Google Patents
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- Publication number
- JP2020530049A5 JP2020530049A5 JP2020505466A JP2020505466A JP2020530049A5 JP 2020530049 A5 JP2020530049 A5 JP 2020530049A5 JP 2020505466 A JP2020505466 A JP 2020505466A JP 2020505466 A JP2020505466 A JP 2020505466A JP 2020530049 A5 JP2020530049 A5 JP 2020530049A5
- Authority
- JP
- Japan
- Prior art keywords
- ink
- copper
- substrate
- coating
- ink according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 8
- 229910052802 copper Inorganic materials 0.000 claims 8
- 239000010949 copper Substances 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 7
- 238000000034 method Methods 0.000 claims 6
- 239000011248 coating agent Substances 0.000 claims 5
- 238000000576 coating method Methods 0.000 claims 5
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims 4
- 239000005750 Copper hydroxide Substances 0.000 claims 4
- 229910001956 copper hydroxide Inorganic materials 0.000 claims 4
- 239000000945 filler Substances 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000011230 binding agent Substances 0.000 claims 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims 2
- 229920000728 polyester Polymers 0.000 claims 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims 2
- NPKITLFRFSTZCI-UHFFFAOYSA-L O.[OH-].[OH-].[Cu++] Chemical compound O.[OH-].[OH-].[Cu++] NPKITLFRFSTZCI-UHFFFAOYSA-L 0.000 claims 1
- 238000000354 decomposition reaction Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000002105 nanoparticle Substances 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 229910001961 silver nitrate Inorganic materials 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762539610P | 2017-08-01 | 2017-08-01 | |
| US62/539,610 | 2017-08-01 | ||
| PCT/IB2018/055727 WO2019025970A1 (en) | 2017-08-01 | 2018-07-31 | COPPER INK |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020530049A JP2020530049A (ja) | 2020-10-15 |
| JP2020530049A5 true JP2020530049A5 (enExample) | 2021-09-02 |
| JP7241734B2 JP7241734B2 (ja) | 2023-03-17 |
Family
ID=65233440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020505466A Active JP7241734B2 (ja) | 2017-08-01 | 2018-07-31 | 銅インク |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11505712B2 (enExample) |
| EP (1) | EP3662027B1 (enExample) |
| JP (1) | JP7241734B2 (enExample) |
| KR (1) | KR102643783B1 (enExample) |
| CN (1) | CN111051442B (enExample) |
| CA (1) | CA3071505A1 (enExample) |
| FI (1) | FI3662027T3 (enExample) |
| TW (1) | TWI856947B (enExample) |
| WO (1) | WO2019025970A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023097480A1 (zh) * | 2021-11-30 | 2023-06-08 | 中国科学院深圳先进技术研究院 | 一种基于金属有机分解油墨的导电织物、制备方法及其应用 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2728465C2 (de) | 1977-06-24 | 1982-04-22 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | Gedruckte Schaltung |
| JPH01168868A (ja) | 1987-12-24 | 1989-07-04 | Mitsubishi Gas Chem Co Inc | 銅膜形成物品の製造法 |
| JPH01168867A (ja) | 1987-12-24 | 1989-07-04 | Mitsubishi Gas Chem Co Inc | 銅膜形成物品の製造法 |
| EP0322764B1 (en) | 1987-12-24 | 1993-03-17 | Mitsubishi Gas Chemical Company, Inc. | Method for producing copper film-formed articles |
| JP2619289B2 (ja) | 1989-06-20 | 1997-06-11 | 三井金属鉱業株式会社 | 銅導電性組成物 |
| US5882722A (en) | 1995-07-12 | 1999-03-16 | Partnerships Limited, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds |
| JP2004259464A (ja) | 2003-02-24 | 2004-09-16 | Mitsubishi Paper Mills Ltd | 銅／アミン組成物 |
| JP2004277868A (ja) | 2003-03-19 | 2004-10-07 | Mitsubishi Paper Mills Ltd | 導電性組成物の作製方法 |
| US20060078686A1 (en) | 2004-10-08 | 2006-04-13 | Hodge Robert L | Penetration of copper-ethanolamine complex in wood |
| JP4799881B2 (ja) | 2004-12-27 | 2011-10-26 | 三井金属鉱業株式会社 | 導電性インク |
| US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
| PL1853671T3 (pl) | 2005-03-04 | 2014-01-31 | Inktec Co Ltd | Tusze przewodzące i sposób ich wytwarzania |
| US7517382B2 (en) | 2005-04-20 | 2009-04-14 | Gang Zhao | Production of fine particle copper powders |
| US7566375B2 (en) * | 2006-01-25 | 2009-07-28 | Ben Huang | Panel grip with cut-outs and inserts |
| JP2008205430A (ja) | 2007-01-26 | 2008-09-04 | Konica Minolta Holdings Inc | 金属パターン形成方法及び金属塩混合物 |
| US8506849B2 (en) * | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
| JP5117420B2 (ja) | 2008-03-27 | 2013-01-16 | 古河電気工業株式会社 | 銅微粒子分散水溶液の製造方法及び銅微粒子分散水溶液の保管方法 |
| KR20100031843A (ko) | 2008-09-16 | 2010-03-25 | (주)창성 | 전도성 금속 전극 형성용 잉크조성물 및 그 제조방법 |
| JP2010242118A (ja) | 2009-04-01 | 2010-10-28 | Adeka Corp | 銅薄膜形成用組成物および該組成物を用いた銅薄膜の製造方法 |
| KR20150006091A (ko) * | 2012-02-29 | 2015-01-15 | 이슘 리서치 디벨롭먼트 컴퍼니 오브 더 히브루 유니버시티 오브 예루살렘, 엘티디. | 금속 전구체 나노입자들을 함유한 잉크 |
| JP5923351B2 (ja) * | 2012-03-16 | 2016-05-24 | 株式会社Adeka | 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法 |
| KR101401571B1 (ko) * | 2012-08-27 | 2014-06-05 | 한국과학기술연구원 | 전도성 이온 잉크 조성물, 그 제조방법 및 이를 이용한 고전도성 패턴 또는 막의 형성방법 |
| JP2014051569A (ja) * | 2012-09-06 | 2014-03-20 | Tosoh Corp | 導電性銅インク組成物 |
| CN103084581B (zh) | 2013-01-08 | 2015-02-04 | 河南大学 | 一种铜纳米线的制备方法 |
| JP2014148732A (ja) | 2013-02-04 | 2014-08-21 | Yamagata Univ | 新規被覆銅微粒子及びその製造方法 |
| JP2014182913A (ja) * | 2013-03-19 | 2014-09-29 | Fujifilm Corp | 導電膜形成用組成物およびこれを用いる導電膜の製造方法 |
| JP6156991B2 (ja) * | 2013-07-25 | 2017-07-05 | 株式会社Adeka | 銅膜形成用組成物及びそれを用いた銅膜の製造方法 |
| JP6254025B2 (ja) | 2014-03-12 | 2017-12-27 | 株式会社Adeka | 銅膜形成用組成物及びそれを用いた銅膜の製造方法 |
| US9809489B2 (en) | 2014-09-12 | 2017-11-07 | Jsr Corporation | Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device |
-
2018
- 2018-07-30 TW TW107126333A patent/TWI856947B/zh active
- 2018-07-31 WO PCT/IB2018/055727 patent/WO2019025970A1/en not_active Ceased
- 2018-07-31 FI FIEP18841557.4T patent/FI3662027T3/fi active
- 2018-07-31 KR KR1020207005838A patent/KR102643783B1/ko active Active
- 2018-07-31 US US16/634,934 patent/US11505712B2/en active Active
- 2018-07-31 JP JP2020505466A patent/JP7241734B2/ja active Active
- 2018-07-31 CN CN201880058165.0A patent/CN111051442B/zh active Active
- 2018-07-31 EP EP18841557.4A patent/EP3662027B1/en active Active
- 2018-07-31 CA CA3071505A patent/CA3071505A1/en active Pending
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