FI3662027T3 - Kuparimuste - Google Patents
Kuparimuste Download PDFInfo
- Publication number
- FI3662027T3 FI3662027T3 FIEP18841557.4T FI18841557T FI3662027T3 FI 3662027 T3 FI3662027 T3 FI 3662027T3 FI 18841557 T FI18841557 T FI 18841557T FI 3662027 T3 FI3662027 T3 FI 3662027T3
- Authority
- FI
- Finland
- Prior art keywords
- ink
- copper
- weight
- substrate
- copper hydroxide
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 10
- 229910052802 copper Inorganic materials 0.000 claims 10
- 239000010949 copper Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 10
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims 9
- 239000005750 Copper hydroxide Substances 0.000 claims 9
- 229910001956 copper hydroxide Inorganic materials 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 7
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims 6
- 239000011248 coating agent Substances 0.000 claims 5
- 238000000576 coating method Methods 0.000 claims 5
- 239000011230 binding agent Substances 0.000 claims 4
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims 4
- 239000000945 filler Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 239000002105 nanoparticle Substances 0.000 claims 2
- 229920000728 polyester Polymers 0.000 claims 2
- 229910001961 silver nitrate Inorganic materials 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- NPKITLFRFSTZCI-UHFFFAOYSA-L O.[OH-].[OH-].[Cu++] Chemical compound O.[OH-].[OH-].[Cu++] NPKITLFRFSTZCI-UHFFFAOYSA-L 0.000 claims 1
- 238000000354 decomposition reaction Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/0081—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/104—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Electromagnetism (AREA)
- General Health & Medical Sciences (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Electric Cables (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762539610P | 2017-08-01 | 2017-08-01 | |
| PCT/IB2018/055727 WO2019025970A1 (en) | 2017-08-01 | 2018-07-31 | COPPER INK |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FI3662027T3 true FI3662027T3 (fi) | 2023-09-29 |
Family
ID=65233440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FIEP18841557.4T FI3662027T3 (fi) | 2017-08-01 | 2018-07-31 | Kuparimuste |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11505712B2 (enExample) |
| EP (1) | EP3662027B1 (enExample) |
| JP (1) | JP7241734B2 (enExample) |
| KR (1) | KR102643783B1 (enExample) |
| CN (1) | CN111051442B (enExample) |
| CA (1) | CA3071505A1 (enExample) |
| FI (1) | FI3662027T3 (enExample) |
| TW (1) | TWI856947B (enExample) |
| WO (1) | WO2019025970A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023097480A1 (zh) * | 2021-11-30 | 2023-06-08 | 中国科学院深圳先进技术研究院 | 一种基于金属有机分解油墨的导电织物、制备方法及其应用 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2728465C2 (de) | 1977-06-24 | 1982-04-22 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | Gedruckte Schaltung |
| JPH01168867A (ja) * | 1987-12-24 | 1989-07-04 | Mitsubishi Gas Chem Co Inc | 銅膜形成物品の製造法 |
| KR960010822B1 (ko) | 1987-12-24 | 1996-08-09 | 미쓰비시 가스 가가꾸 가부시끼가이샤 | 구리 필름 발포체의 제조방법 |
| JPH01168868A (ja) * | 1987-12-24 | 1989-07-04 | Mitsubishi Gas Chem Co Inc | 銅膜形成物品の製造法 |
| JP2619289B2 (ja) | 1989-06-20 | 1997-06-11 | 三井金属鉱業株式会社 | 銅導電性組成物 |
| US5882722A (en) | 1995-07-12 | 1999-03-16 | Partnerships Limited, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds |
| JP2004259464A (ja) * | 2003-02-24 | 2004-09-16 | Mitsubishi Paper Mills Ltd | 銅／アミン組成物 |
| JP2004277868A (ja) | 2003-03-19 | 2004-10-07 | Mitsubishi Paper Mills Ltd | 導電性組成物の作製方法 |
| US20060078686A1 (en) | 2004-10-08 | 2006-04-13 | Hodge Robert L | Penetration of copper-ethanolamine complex in wood |
| JP4799881B2 (ja) | 2004-12-27 | 2011-10-26 | 三井金属鉱業株式会社 | 導電性インク |
| US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
| PL1853671T3 (pl) | 2005-03-04 | 2014-01-31 | Inktec Co Ltd | Tusze przewodzące i sposób ich wytwarzania |
| KR101145566B1 (ko) | 2005-04-20 | 2012-05-22 | 피브로-테크, 인코포레이티드 | 미립자 구리 분말의 제조 방법 |
| US7566375B2 (en) * | 2006-01-25 | 2009-07-28 | Ben Huang | Panel grip with cut-outs and inserts |
| JP2008205430A (ja) | 2007-01-26 | 2008-09-04 | Konica Minolta Holdings Inc | 金属パターン形成方法及び金属塩混合物 |
| US8506849B2 (en) * | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
| JP5117420B2 (ja) * | 2008-03-27 | 2013-01-16 | 古河電気工業株式会社 | 銅微粒子分散水溶液の製造方法及び銅微粒子分散水溶液の保管方法 |
| KR20100031843A (ko) * | 2008-09-16 | 2010-03-25 | (주)창성 | 전도성 금속 전극 형성용 잉크조성물 및 그 제조방법 |
| JP2010242118A (ja) | 2009-04-01 | 2010-10-28 | Adeka Corp | 銅薄膜形成用組成物および該組成物を用いた銅薄膜の製造方法 |
| EP2820093B1 (en) * | 2012-02-29 | 2024-09-18 | Singapore Asahi Chemical & Solder Ind. Pte. Ltd. | Inks containing metal precursors nanoparticles |
| JP5923351B2 (ja) | 2012-03-16 | 2016-05-24 | 株式会社Adeka | 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法 |
| KR101401571B1 (ko) | 2012-08-27 | 2014-06-05 | 한국과학기술연구원 | 전도성 이온 잉크 조성물, 그 제조방법 및 이를 이용한 고전도성 패턴 또는 막의 형성방법 |
| JP2014051569A (ja) * | 2012-09-06 | 2014-03-20 | Tosoh Corp | 導電性銅インク組成物 |
| CN103084581B (zh) | 2013-01-08 | 2015-02-04 | 河南大学 | 一种铜纳米线的制备方法 |
| JP2014148732A (ja) | 2013-02-04 | 2014-08-21 | Yamagata Univ | 新規被覆銅微粒子及びその製造方法 |
| JP2014182913A (ja) * | 2013-03-19 | 2014-09-29 | Fujifilm Corp | 導電膜形成用組成物およびこれを用いる導電膜の製造方法 |
| JP6156991B2 (ja) * | 2013-07-25 | 2017-07-05 | 株式会社Adeka | 銅膜形成用組成物及びそれを用いた銅膜の製造方法 |
| JP6254025B2 (ja) * | 2014-03-12 | 2017-12-27 | 株式会社Adeka | 銅膜形成用組成物及びそれを用いた銅膜の製造方法 |
| US9809489B2 (en) | 2014-09-12 | 2017-11-07 | Jsr Corporation | Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device |
-
2018
- 2018-07-30 TW TW107126333A patent/TWI856947B/zh active
- 2018-07-31 KR KR1020207005838A patent/KR102643783B1/ko active Active
- 2018-07-31 CN CN201880058165.0A patent/CN111051442B/zh active Active
- 2018-07-31 JP JP2020505466A patent/JP7241734B2/ja active Active
- 2018-07-31 EP EP18841557.4A patent/EP3662027B1/en active Active
- 2018-07-31 FI FIEP18841557.4T patent/FI3662027T3/fi active
- 2018-07-31 WO PCT/IB2018/055727 patent/WO2019025970A1/en not_active Ceased
- 2018-07-31 US US16/634,934 patent/US11505712B2/en active Active
- 2018-07-31 CA CA3071505A patent/CA3071505A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN111051442A (zh) | 2020-04-21 |
| KR20200037821A (ko) | 2020-04-09 |
| WO2019025970A1 (en) | 2019-02-07 |
| JP7241734B2 (ja) | 2023-03-17 |
| TWI856947B (zh) | 2024-10-01 |
| EP3662027B1 (en) | 2023-08-02 |
| CN111051442B (zh) | 2023-10-03 |
| TW201920515A (zh) | 2019-06-01 |
| CA3071505A1 (en) | 2019-02-07 |
| EP3662027A4 (en) | 2021-04-14 |
| EP3662027A1 (en) | 2020-06-10 |
| US20210095153A1 (en) | 2021-04-01 |
| JP2020530049A (ja) | 2020-10-15 |
| US11505712B2 (en) | 2022-11-22 |
| KR102643783B1 (ko) | 2024-03-05 |
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