FR3046020B1 - Procede de realisation d'un composant electronique comportant un boitier en technique d'impression 3d - Google Patents

Procede de realisation d'un composant electronique comportant un boitier en technique d'impression 3d Download PDF

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Publication number
FR3046020B1
FR3046020B1 FR1662970A FR1662970A FR3046020B1 FR 3046020 B1 FR3046020 B1 FR 3046020B1 FR 1662970 A FR1662970 A FR 1662970A FR 1662970 A FR1662970 A FR 1662970A FR 3046020 B1 FR3046020 B1 FR 3046020B1
Authority
FR
France
Prior art keywords
electronic component
housing
producing
component including
printing technique
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1662970A
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English (en)
Other versions
FR3046020A1 (fr
Inventor
Andreas Kugler
Frederik ANTE
Kristina Berschauer
Matthias Mahlich
Ricardo Ehrenpfordt
Ruben Wahl
Thomas Brettschneider
Ulrich Schaaf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR3046020A1 publication Critical patent/FR3046020A1/fr
Application granted granted Critical
Publication of FR3046020B1 publication Critical patent/FR3046020B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Procédé de réalisation d'un composant électronique (1) comportant un substrat (10), muni d'un composant électronique (11). Selon le procédé on réalise un boîtier (12) logeant au moins partiellement le composant électronique (11). On réalise le boîtier (12) par impression en 3D, notamment directement sur le substrat (10).
FR1662970A 2015-12-21 2016-12-21 Procede de realisation d'un composant electronique comportant un boitier en technique d'impression 3d Expired - Fee Related FR3046020B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015226202.2A DE102015226202A1 (de) 2015-12-21 2015-12-21 Verfahren zur Herstellung einer elektronischen Baueinheit mit einem Gehäuse mittels 3D-Drucktechnik
DE102015226202.2 2015-12-21

Publications (2)

Publication Number Publication Date
FR3046020A1 FR3046020A1 (fr) 2017-06-23
FR3046020B1 true FR3046020B1 (fr) 2020-06-19

Family

ID=59021936

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1662970A Expired - Fee Related FR3046020B1 (fr) 2015-12-21 2016-12-21 Procede de realisation d'un composant electronique comportant un boitier en technique d'impression 3d

Country Status (3)

Country Link
DE (1) DE102015226202A1 (fr)
FR (1) FR3046020B1 (fr)
IT (1) IT201600125796A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10828852B1 (en) * 2019-08-20 2020-11-10 Honeywell International Inc. Embedding electronics in housing using additive manufacturing
DE102021112861A1 (de) 2021-05-18 2022-11-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Trägerstruktur, verfahren zur herstellung einer trägerstruktur und vorrichtung und druckkopf zum durchführen eines solchen verfahrens
DE102021206077A1 (de) * 2021-06-15 2022-12-15 Zf Friedrichshafen Ag Gehäuseteil für eine elektromechanische Baugruppe

Also Published As

Publication number Publication date
IT201600125796A1 (it) 2018-06-13
FR3046020A1 (fr) 2017-06-23
DE102015226202A1 (de) 2017-07-06

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