KR102643783B1 - 구리 잉크 - Google Patents

구리 잉크 Download PDF

Info

Publication number
KR102643783B1
KR102643783B1 KR1020207005838A KR20207005838A KR102643783B1 KR 102643783 B1 KR102643783 B1 KR 102643783B1 KR 1020207005838 A KR1020207005838 A KR 1020207005838A KR 20207005838 A KR20207005838 A KR 20207005838A KR 102643783 B1 KR102643783 B1 KR 102643783B1
Authority
KR
South Korea
Prior art keywords
ink
copper
substrate
traces
sintered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020207005838A
Other languages
English (en)
Korean (ko)
Other versions
KR20200037821A (ko
Inventor
바바나 디오르
샨탈 파퀘
패트릭 말렌판트
Original Assignee
내션얼 리서치 카운슬 오브 캐나다
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 내션얼 리서치 카운슬 오브 캐나다 filed Critical 내션얼 리서치 카운슬 오브 캐나다
Publication of KR20200037821A publication Critical patent/KR20200037821A/ko
Application granted granted Critical
Publication of KR102643783B1 publication Critical patent/KR102643783B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/0081—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C09D11/104—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020207005838A 2017-08-01 2018-07-31 구리 잉크 Active KR102643783B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762539610P 2017-08-01 2017-08-01
US62/539,610 2017-08-01
PCT/IB2018/055727 WO2019025970A1 (en) 2017-08-01 2018-07-31 COPPER INK

Publications (2)

Publication Number Publication Date
KR20200037821A KR20200037821A (ko) 2020-04-09
KR102643783B1 true KR102643783B1 (ko) 2024-03-05

Family

ID=65233440

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207005838A Active KR102643783B1 (ko) 2017-08-01 2018-07-31 구리 잉크

Country Status (9)

Country Link
US (1) US11505712B2 (enExample)
EP (1) EP3662027B1 (enExample)
JP (1) JP7241734B2 (enExample)
KR (1) KR102643783B1 (enExample)
CN (1) CN111051442B (enExample)
CA (1) CA3071505A1 (enExample)
FI (1) FI3662027T3 (enExample)
TW (1) TWI856947B (enExample)
WO (1) WO2019025970A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023097480A1 (zh) * 2021-11-30 2023-06-08 中国科学院深圳先进技术研究院 一种基于金属有机分解油墨的导电织物、制备方法及其应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004277868A (ja) 2003-03-19 2004-10-07 Mitsubishi Paper Mills Ltd 導電性組成物の作製方法
WO2013128449A2 (en) 2012-02-29 2013-09-06 Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd Inks containing metal precursors nanoparticles
JP2014051569A (ja) * 2012-09-06 2014-03-20 Tosoh Corp 導電性銅インク組成物

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2728465C2 (de) 1977-06-24 1982-04-22 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Gedruckte Schaltung
JPH01168867A (ja) * 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc 銅膜形成物品の製造法
KR960010822B1 (ko) 1987-12-24 1996-08-09 미쓰비시 가스 가가꾸 가부시끼가이샤 구리 필름 발포체의 제조방법
JPH01168868A (ja) * 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc 銅膜形成物品の製造法
JP2619289B2 (ja) 1989-06-20 1997-06-11 三井金属鉱業株式会社 銅導電性組成物
US5882722A (en) 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
JP2004259464A (ja) * 2003-02-24 2004-09-16 Mitsubishi Paper Mills Ltd 銅／アミン組成物
US20060078686A1 (en) 2004-10-08 2006-04-13 Hodge Robert L Penetration of copper-ethanolamine complex in wood
JP4799881B2 (ja) 2004-12-27 2011-10-26 三井金属鉱業株式会社 導電性インク
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
PL1853671T3 (pl) 2005-03-04 2014-01-31 Inktec Co Ltd Tusze przewodzące i sposób ich wytwarzania
KR101145566B1 (ko) 2005-04-20 2012-05-22 피브로-테크, 인코포레이티드 미립자 구리 분말의 제조 방법
US7566375B2 (en) * 2006-01-25 2009-07-28 Ben Huang Panel grip with cut-outs and inserts
JP2008205430A (ja) 2007-01-26 2008-09-04 Konica Minolta Holdings Inc 金属パターン形成方法及び金属塩混合物
US8506849B2 (en) * 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
JP5117420B2 (ja) * 2008-03-27 2013-01-16 古河電気工業株式会社 銅微粒子分散水溶液の製造方法及び銅微粒子分散水溶液の保管方法
KR20100031843A (ko) * 2008-09-16 2010-03-25 (주)창성 전도성 금속 전극 형성용 잉크조성물 및 그 제조방법
JP2010242118A (ja) 2009-04-01 2010-10-28 Adeka Corp 銅薄膜形成用組成物および該組成物を用いた銅薄膜の製造方法
JP5923351B2 (ja) 2012-03-16 2016-05-24 株式会社Adeka 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法
KR101401571B1 (ko) 2012-08-27 2014-06-05 한국과학기술연구원 전도성 이온 잉크 조성물, 그 제조방법 및 이를 이용한 고전도성 패턴 또는 막의 형성방법
CN103084581B (zh) 2013-01-08 2015-02-04 河南大学 一种铜纳米线的制备方法
JP2014148732A (ja) 2013-02-04 2014-08-21 Yamagata Univ 新規被覆銅微粒子及びその製造方法
JP2014182913A (ja) * 2013-03-19 2014-09-29 Fujifilm Corp 導電膜形成用組成物およびこれを用いる導電膜の製造方法
JP6156991B2 (ja) * 2013-07-25 2017-07-05 株式会社Adeka 銅膜形成用組成物及びそれを用いた銅膜の製造方法
JP6254025B2 (ja) * 2014-03-12 2017-12-27 株式会社Adeka 銅膜形成用組成物及びそれを用いた銅膜の製造方法
US9809489B2 (en) 2014-09-12 2017-11-07 Jsr Corporation Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004277868A (ja) 2003-03-19 2004-10-07 Mitsubishi Paper Mills Ltd 導電性組成物の作製方法
WO2013128449A2 (en) 2012-02-29 2013-09-06 Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd Inks containing metal precursors nanoparticles
JP2014051569A (ja) * 2012-09-06 2014-03-20 Tosoh Corp 導電性銅インク組成物

Also Published As

Publication number Publication date
CN111051442A (zh) 2020-04-21
KR20200037821A (ko) 2020-04-09
WO2019025970A1 (en) 2019-02-07
JP7241734B2 (ja) 2023-03-17
TWI856947B (zh) 2024-10-01
EP3662027B1 (en) 2023-08-02
CN111051442B (zh) 2023-10-03
TW201920515A (zh) 2019-06-01
FI3662027T3 (fi) 2023-09-29
CA3071505A1 (en) 2019-02-07
EP3662027A4 (en) 2021-04-14
EP3662027A1 (en) 2020-06-10
US20210095153A1 (en) 2021-04-01
JP2020530049A (ja) 2020-10-15
US11505712B2 (en) 2022-11-22

Similar Documents

Publication Publication Date Title
JP6901549B2 (ja) 銅インク及びそれから製造された導電性のはんだ付け可能な銅トレース
EP1594929A2 (en) High conductivity inks with low minimum curing temperatures
CN112789331B (zh) Uv可烧结分子油墨以及使用广谱uv光对其加工
TW201432726A (zh) 導電膜的製造方法、印刷配線基板
KR102643783B1 (ko) 구리 잉크
KR102681330B1 (ko) 고전도성 미세한 인쇄를 위한 구리 잉크
TW201415489A (zh) 導電膜形成用組成物及導電膜的製造方法
HK40038080A (en) Copper ink for high conductivity fine printing
HK40038080B (en) Copper ink for high conductivity fine printing
HK1145901A (zh) 導電圖形和使用方法

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20200227

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20210722

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20230818

Patent event code: PE09021S01D

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

Comment text: Final Notice of Reason for Refusal

Patent event date: 20231107

Patent event code: PE09021S02D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20240112

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20240229

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20240229

End annual number: 3

Start annual number: 1

PG1601 Publication of registration