JP2012251241A5 - - Google Patents

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Publication number
JP2012251241A5
JP2012251241A5 JP2012109710A JP2012109710A JP2012251241A5 JP 2012251241 A5 JP2012251241 A5 JP 2012251241A5 JP 2012109710 A JP2012109710 A JP 2012109710A JP 2012109710 A JP2012109710 A JP 2012109710A JP 2012251241 A5 JP2012251241 A5 JP 2012251241A5
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JP
Japan
Prior art keywords
palladium
organoamine
salt
precursor composition
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012109710A
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English (en)
Japanese (ja)
Other versions
JP5856009B2 (ja
JP2012251241A (ja
Filing date
Publication date
Priority claimed from US13/153,856 external-priority patent/US8574665B2/en
Application filed filed Critical
Publication of JP2012251241A publication Critical patent/JP2012251241A/ja
Publication of JP2012251241A5 publication Critical patent/JP2012251241A5/ja
Application granted granted Critical
Publication of JP5856009B2 publication Critical patent/JP5856009B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012109710A 2011-06-06 2012-05-11 パラジウム前駆体組成物 Expired - Fee Related JP5856009B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/153,856 US8574665B2 (en) 2011-06-06 2011-06-06 Palladium precursor composition
US13/153,856 2011-06-06

Publications (3)

Publication Number Publication Date
JP2012251241A JP2012251241A (ja) 2012-12-20
JP2012251241A5 true JP2012251241A5 (enExample) 2015-06-25
JP5856009B2 JP5856009B2 (ja) 2016-02-09

Family

ID=47261883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012109710A Expired - Fee Related JP5856009B2 (ja) 2011-06-06 2012-05-11 パラジウム前駆体組成物

Country Status (6)

Country Link
US (1) US8574665B2 (enExample)
JP (1) JP5856009B2 (enExample)
KR (1) KR20120135478A (enExample)
CN (1) CN102817015B (enExample)
CA (1) CA2778752C (enExample)
TW (1) TWI573801B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8986819B2 (en) 2011-06-06 2015-03-24 Xerox Corporation Palladium precursor composition
US8741036B2 (en) 2012-02-02 2014-06-03 Xerox Corporation Composition of palladium unsaturated organoamine complex and palladium nanoparticles
US8741037B2 (en) * 2012-02-02 2014-06-03 Xerox Corporation Composition of palladium unsaturated carboxylate and palladium nanoparticles
CA2787584A1 (en) 2012-08-22 2014-02-22 Hy-Power Nano Inc. Method for continuous preparation of indium-tin coprecipitates and indium-tin-oxide nanopowders with substantially homogeneous indium/tin composition, controllable shape and particle size
US8613796B1 (en) * 2012-09-17 2013-12-24 Xerox Corporation Palladium precursor composition having a fluorinated component
RU2555283C2 (ru) * 2013-10-18 2015-07-10 Общество с Ограниченной Ответственностью "Мембраны-НЦ" Способ нанесения палладиевого покрытия на подложку
US10043605B2 (en) * 2015-04-21 2018-08-07 Xerox Corporation Sensors comprising palladium complex ink
KR101950465B1 (ko) * 2017-08-11 2019-05-02 주식회사 엘지화학 전해용 전극 및 이의 제조방법
US20190309422A1 (en) * 2018-04-06 2019-10-10 Versum Materials Us, Llc Spin-On Metallization
JP7127407B2 (ja) * 2018-07-25 2022-08-30 昭和電工マテリアルズ株式会社 接合用金属ペースト、接合体及び接合体の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1072673A (ja) 1996-04-30 1998-03-17 Nippon Terupen Kagaku Kk 金属ペースト及び金属膜の製造方法
WO1998050601A1 (fr) 1997-04-30 1998-11-12 Takamatsu Research Laboratory Pate metallique et procede de production d'une couche metallique
US5894038A (en) * 1997-02-28 1999-04-13 The Whitaker Corporation Direct deposition of palladium
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
JP3920802B2 (ja) * 2003-03-28 2007-05-30 Ｊｓｒ株式会社 配線、電極およびそれらの形成方法
US7537799B2 (en) * 2003-07-11 2009-05-26 Hewlett-Packard Development Company, L.P. Methods of forming electrically conductive pathways using palladium aliphatic amine complexes
US7981508B1 (en) * 2006-09-12 2011-07-19 Sri International Flexible circuits
US20080083299A1 (en) * 2006-10-06 2008-04-10 General Electric Company Composition and associated method
CN101285203B (zh) * 2007-04-13 2011-04-20 碧氢科技开发股份有限公司 含钯电镀液及其应用
US8747599B2 (en) * 2008-05-29 2014-06-10 Chidella Krishna Sastry Process for making self-patterning substrates and the product thereof
US20100233361A1 (en) 2009-03-12 2010-09-16 Xerox Corporation Metal nanoparticle composition with improved adhesion
CN102011108A (zh) * 2009-09-08 2011-04-13 中国科学院大连化学物理研究所 一种制备高比表面积超薄钯膜的化学镀方法

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