JP2010045353A5 - - Google Patents

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Publication number
JP2010045353A5
JP2010045353A5 JP2009182935A JP2009182935A JP2010045353A5 JP 2010045353 A5 JP2010045353 A5 JP 2010045353A5 JP 2009182935 A JP2009182935 A JP 2009182935A JP 2009182935 A JP2009182935 A JP 2009182935A JP 2010045353 A5 JP2010045353 A5 JP 2010045353A5
Authority
JP
Japan
Prior art keywords
conductive
pattern
electrolyte
seed pattern
conductive seed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009182935A
Other languages
English (en)
Japanese (ja)
Other versions
JP5656311B2 (ja
JP2010045353A (ja
Filing date
Publication date
Priority claimed from US12/210,781 external-priority patent/US8278220B2/en
Application filed filed Critical
Publication of JP2010045353A publication Critical patent/JP2010045353A/ja
Publication of JP2010045353A5 publication Critical patent/JP2010045353A5/ja
Application granted granted Critical
Publication of JP5656311B2 publication Critical patent/JP5656311B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009182935A 2008-08-08 2009-08-06 基板上にパターン金属を誘導する方法 Expired - Fee Related JP5656311B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US8760508P 2008-08-08 2008-08-08
US61/087,605 2008-08-08
US12/210,781 US8278220B2 (en) 2008-08-08 2008-09-15 Method to direct pattern metals on a substrate
US12/210,781 2008-09-15

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2014094902A Division JP2014187370A (ja) 2008-08-08 2014-05-01 微小金属構造の製造方法
JP2014094903A Division JP2014187371A (ja) 2008-08-08 2014-05-01 半導体試験方法

Publications (3)

Publication Number Publication Date
JP2010045353A JP2010045353A (ja) 2010-02-25
JP2010045353A5 true JP2010045353A5 (enExample) 2012-08-30
JP5656311B2 JP5656311B2 (ja) 2015-01-21

Family

ID=41228378

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2009182935A Expired - Fee Related JP5656311B2 (ja) 2008-08-08 2009-08-06 基板上にパターン金属を誘導する方法
JP2014094902A Withdrawn JP2014187370A (ja) 2008-08-08 2014-05-01 微小金属構造の製造方法
JP2014094903A Withdrawn JP2014187371A (ja) 2008-08-08 2014-05-01 半導体試験方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2014094902A Withdrawn JP2014187370A (ja) 2008-08-08 2014-05-01 微小金属構造の製造方法
JP2014094903A Withdrawn JP2014187371A (ja) 2008-08-08 2014-05-01 半導体試験方法

Country Status (3)

Country Link
US (1) US8278220B2 (enExample)
EP (2) EP2151854A3 (enExample)
JP (3) JP5656311B2 (enExample)

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US8859963B2 (en) * 2011-06-03 2014-10-14 Fei Company Methods for preparing thin samples for TEM imaging
JP2013101929A (ja) 2011-11-07 2013-05-23 Fei Co 荷電粒子ビーム・システムの絞り
US9733164B2 (en) 2012-06-11 2017-08-15 Fei Company Lamella creation method and device using fixed-angle beam and rotating sample stage
US8759764B2 (en) 2012-06-29 2014-06-24 Fei Company On-axis detector for charged particle beam system
US9046511B2 (en) 2013-04-18 2015-06-02 International Business Machines Corporation Fabrication of tunneling junction for nanopore DNA sequencing
US9182369B2 (en) 2013-06-19 2015-11-10 Globalfoundries Inc. Manufacturable sub-3 nanometer palladium gap devices for fixed electrode tunneling recognition
US9188578B2 (en) 2013-06-19 2015-11-17 Globalfoundries Inc. Nanogap device with capped nanowire structures
JP6290559B2 (ja) 2013-09-03 2018-03-07 株式会社日立ハイテクサイエンス 断面加工観察方法、断面加工観察装置
KR101565673B1 (ko) * 2014-01-02 2015-11-03 삼성전기주식회사 칩 전자부품의 제조방법
AU2015256331B2 (en) * 2014-05-09 2020-03-12 AuroMedics Pharma LLC Formulations of Cyclophosphamide liquid concentrate
EP3043372B1 (en) 2015-01-12 2017-01-04 Fei Company Method of modifying a sample surface layer from a microscopic sample
US10103008B2 (en) 2016-01-12 2018-10-16 Fei Company Charged particle beam-induced etching
EP3249676B1 (en) 2016-05-27 2018-10-03 FEI Company Dual-beam charged-particle microscope with in situ deposition functionality
ES2738911A1 (es) * 2018-07-25 2020-01-27 Consejo Superior Investigacion Procedimiento para depositar elementos sobre un sustrato de interes y dispositivo
US11298547B2 (en) 2018-07-27 2022-04-12 Medtronic, Inc. Fluid status detection from a cardiac electrical signal and impedance signal
CN111413727B (zh) * 2020-04-15 2021-12-28 中国科学院电工研究所 一种电子束发散角测量装置及其制备方法和测量方法
US20230369211A1 (en) * 2022-05-13 2023-11-16 Intel Corporation Designs to enable inline circuit edit

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GB1062365A (en) 1965-03-01 1967-03-22 Hughes Aircraft Co A method of electroplating an ohmic contact bump upon a semiconductor body
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US5976980A (en) * 1994-11-23 1999-11-02 Intel Corporation Method and apparatus providing a mechanical probe structure in an integrated circuit die
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