GB1062365A - A method of electroplating an ohmic contact bump upon a semiconductor body - Google Patents

A method of electroplating an ohmic contact bump upon a semiconductor body

Info

Publication number
GB1062365A
GB1062365A GB5009/66A GB500966A GB1062365A GB 1062365 A GB1062365 A GB 1062365A GB 5009/66 A GB5009/66 A GB 5009/66A GB 500966 A GB500966 A GB 500966A GB 1062365 A GB1062365 A GB 1062365A
Authority
GB
United Kingdom
Prior art keywords
ohmic contact
electroplating
contact bump
semiconductor body
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5009/66A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of GB1062365A publication Critical patent/GB1062365A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

An ohmic contact bump, e.g. of Ag, Au, Cu, Ni or Co, is electroplated upon a semi-conductor body, e.g. of Si or Ge and preferably through apertures in a protective SiO2 mask thereon, in a plating bath into which ultrasonic energy is introduced. The D.C. may be increased in steps during plating.
GB5009/66A 1965-03-01 1966-02-04 A method of electroplating an ohmic contact bump upon a semiconductor body Expired GB1062365A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43598965A 1965-03-01 1965-03-01

Publications (1)

Publication Number Publication Date
GB1062365A true GB1062365A (en) 1967-03-22

Family

ID=23730652

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5009/66A Expired GB1062365A (en) 1965-03-01 1966-02-04 A method of electroplating an ohmic contact bump upon a semiconductor body

Country Status (2)

Country Link
GB (1) GB1062365A (en)
NL (1) NL6602548A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2151859A3 (en) * 2008-08-08 2011-08-17 Fei Company Method of determining characteristics of a transistor in an integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2151859A3 (en) * 2008-08-08 2011-08-17 Fei Company Method of determining characteristics of a transistor in an integrated circuit
US8278220B2 (en) 2008-08-08 2012-10-02 Fei Company Method to direct pattern metals on a substrate

Also Published As

Publication number Publication date
NL6602548A (en) 1966-09-02

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