|
JP5408878B2
(ja)
*
|
2004-11-24 |
2014-02-05 |
エヌシーシー ナノ， エルエルシー |
ナノ材料組成物の電気的使用、めっき的使用および触媒的使用
|
|
US8945686B2
(en)
*
|
2007-05-24 |
2015-02-03 |
Ncc |
Method for reducing thin films on low temperature substrates
|
|
ATE388826T1
(de)
*
|
2005-12-22 |
2008-03-15 |
Tapematic Spa |
Ein gerät zum trocknen durch strahlung
|
|
US7812726B2
(en)
|
2006-08-07 |
2010-10-12 |
Pliant Corporation |
Tamper event detection films, systems and methods
|
|
US20090014423A1
(en)
*
|
2007-07-10 |
2009-01-15 |
Xuegeng Li |
Concentric flow-through plasma reactor and methods therefor
|
|
DE102007014501A1
(de)
*
|
2007-03-27 |
2008-10-02 |
Robert Bosch Gmbh |
Verfahren zur Herstellung einer elektrisch leitfähigen Bahn auf einem Kunststoffbauteil
|
|
US10231344B2
(en)
*
|
2007-05-18 |
2019-03-12 |
Applied Nanotech Holdings, Inc. |
Metallic ink
|
|
US8404160B2
(en)
*
|
2007-05-18 |
2013-03-26 |
Applied Nanotech Holdings, Inc. |
Metallic ink
|
|
US10537029B2
(en)
*
|
2007-05-24 |
2020-01-14 |
Ncc Nano, Llc |
Method for reducing thin films on low temperature substrates
|
|
US8968438B2
(en)
*
|
2007-07-10 |
2015-03-03 |
Innovalight, Inc. |
Methods and apparatus for the in situ collection of nucleated particles
|
|
US8471170B2
(en)
|
2007-07-10 |
2013-06-25 |
Innovalight, Inc. |
Methods and apparatus for the production of group IV nanoparticles in a flow-through plasma reactor
|
|
US20090053878A1
(en)
*
|
2007-08-21 |
2009-02-26 |
Maxim Kelman |
Method for fabrication of semiconductor thin films using flash lamp processing
|
|
US8530000B2
(en)
|
2007-09-19 |
2013-09-10 |
Micron Technology, Inc. |
Methods of forming charge-trapping regions
|
|
US7780345B2
(en)
|
2007-12-19 |
2010-08-24 |
Motorola, Inc. |
Method and apparatus for a temperature sensor for measuring peak temperatures
|
|
US7888169B2
(en)
*
|
2007-12-26 |
2011-02-15 |
Organicid, Inc. |
Organic semiconductor device and method of manufacturing the same
|
|
US8988756B2
(en)
*
|
2008-01-31 |
2015-03-24 |
Ajjer, Llc |
Conductive busbars and sealants for chromogenic devices
|
|
TWI401205B
(zh)
*
|
2008-01-31 |
2013-07-11 |
Ind Tech Res Inst |
利用光熱效應製作應用基板的方法
|
|
US8506849B2
(en)
|
2008-03-05 |
2013-08-13 |
Applied Nanotech Holdings, Inc. |
Additives and modifiers for solvent- and water-based metallic conductive inks
|
|
US9730333B2
(en)
*
|
2008-05-15 |
2017-08-08 |
Applied Nanotech Holdings, Inc. |
Photo-curing process for metallic inks
|
|
US20090286383A1
(en)
*
|
2008-05-15 |
2009-11-19 |
Applied Nanotech Holdings, Inc. |
Treatment of whiskers
|
|
US20100000762A1
(en)
*
|
2008-07-02 |
2010-01-07 |
Applied Nanotech Holdings, Inc. |
Metallic pastes and inks
|
|
US8410712B2
(en)
*
|
2008-07-09 |
2013-04-02 |
Ncc Nano, Llc |
Method and apparatus for curing thin films on low-temperature substrates at high speeds
|
|
EP2168775A1
(en)
|
2008-09-29 |
2010-03-31 |
Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO |
A device and a method for curing patterns of a substance at a surface of a foil
|
|
JP5922929B2
(ja)
*
|
2008-10-17 |
2016-05-24 |
エヌシーシー ナノ， エルエルシー |
低温基板上の薄膜を還元する方法
|
|
WO2010053923A1
(en)
*
|
2008-11-07 |
2010-05-14 |
The Regents Of The University Of California |
Core-shell nanocatalyst for high temperature reactions
|
|
US7843303B2
(en)
*
|
2008-12-08 |
2010-11-30 |
Alpha And Omega Semiconductor Incorporated |
Multilayer inductor
|
|
US8647979B2
(en)
|
2009-03-27 |
2014-02-11 |
Applied Nanotech Holdings, Inc. |
Buffer layer to enhance photo and/or laser sintering
|
|
US8422197B2
(en)
*
|
2009-07-15 |
2013-04-16 |
Applied Nanotech Holdings, Inc. |
Applying optical energy to nanoparticles to produce a specified nanostructure
|
|
CN101634321B
(zh)
*
|
2009-07-31 |
2012-02-01 |
湖南大学 |
一种继电器在液压气动装置中的组合控制方法
|
|
CN101625939B
(zh)
*
|
2009-07-31 |
2012-05-23 |
湖南大学 |
一种继电器的控制方法
|
|
EP2317831A1
(en)
|
2009-10-30 |
2011-05-04 |
Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO |
Method and apparatus for curing a substance comprising a metal complex
|
|
EP2346308A1
(en)
|
2010-01-14 |
2011-07-20 |
Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO |
Apparatus and method for treating a substance at a substrate
|
|
US10000411B2
(en)
|
2010-01-16 |
2018-06-19 |
Cardinal Cg Company |
Insulating glass unit transparent conductivity and low emissivity coating technology
|
|
US10000965B2
(en)
|
2010-01-16 |
2018-06-19 |
Cardinal Cg Company |
Insulating glass unit transparent conductive coating technology
|
|
US10060180B2
(en)
|
2010-01-16 |
2018-08-28 |
Cardinal Cg Company |
Flash-treated indium tin oxide coatings, production methods, and insulating glass unit transparent conductive coating technology
|
|
US20110256383A1
(en)
*
|
2010-04-01 |
2011-10-20 |
Bayer Materialscience Ag |
Polymer material comprising a polymer and silver nanoparticles dispersed herein
|
|
US8907258B2
(en)
*
|
2010-04-08 |
2014-12-09 |
Ncc Nano, Llc |
Apparatus for providing transient thermal profile processing on a moving substrate
|
|
ES2819216T3
(es)
*
|
2010-04-08 |
2021-04-15 |
Ncc Nano Llc |
Aparato para curar películas finas sobre un sustrato en movimiento
|
|
US8911823B2
(en)
*
|
2010-05-03 |
2014-12-16 |
Pen Inc. |
Mechanical sintering of nanoparticle inks and powders
|
|
JP2013544951A
(ja)
*
|
2010-07-21 |
2013-12-19 |
ゼノン・コーポレーション |
焼結の間の迷光の低減
|
|
DE102011106799A1
(de)
*
|
2010-08-04 |
2012-02-09 |
Heidelberger Druckmaschinen Aktiengesellschaft |
Verfahren zum Wiederbebildern einer abgedruckten Druckform
|
|
US8468680B2
(en)
|
2010-08-24 |
2013-06-25 |
Roche Diagnostics Operations, Inc. |
Biosensor test member and method for making the same
|
|
US20120094035A1
(en)
*
|
2010-10-18 |
2012-04-19 |
Chung Shan Institute Of Science And Technology, Armaments Bureau, M.N.D. |
Method for preparing plastic particles coated with metal
|
|
KR101297084B1
(ko)
*
|
2011-02-23 |
2013-08-19 |
한국전기연구원 |
투명 전도성 필름，투명 전도성 필름의 제조 장치，및 투명 전도성 필름의 제조 방법
|
|
WO2012124647A1
(ja)
*
|
2011-03-14 |
2012-09-20 |
コニカミノルタホールディングス株式会社 |
有機電子デバイス用面状電極の製造方法
|
|
CN103597547B
(zh)
|
2011-03-29 |
2016-12-21 |
太阳化学公司 |
含有蜡触变胶的可高纵横比丝网印刷的厚膜糊剂组合物
|
|
US10150230B2
(en)
*
|
2011-04-08 |
2018-12-11 |
Ncc Nano, Llc |
Method for drying thin films in an energy efficient manner
|
|
US9779874B2
(en)
*
|
2011-07-08 |
2017-10-03 |
Kemet Electronics Corporation |
Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materials
|
|
US9256773B2
(en)
|
2011-07-27 |
2016-02-09 |
Féinics Amatech Teoranta |
Capacitive coupling of an RFID tag with a touch screen device acting as a reader
|
|
GB201113919D0
(en)
*
|
2011-08-12 |
2011-09-28 |
Intrinsiq Materials Ltd |
High resolution printing
|
|
US20130043221A1
(en)
*
|
2011-08-16 |
2013-02-21 |
Xenon Corporation |
Sintering Process and Apparatus
|
|
CN104024351B
(zh)
*
|
2011-09-06 |
2016-11-16 |
汉高知识产权控股有限责任公司 |
导电金属和方法
|
|
TWI481326B
(zh)
|
2011-11-24 |
2015-04-11 |
Showa Denko Kk |
A conductive pattern forming method, and a conductive pattern forming composition by light irradiation or microwave heating
|
|
TW201339279A
(zh)
|
2011-11-24 |
2013-10-01 |
Showa Denko Kk |
導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物
|
|
ES2485308T3
(es)
*
|
2011-12-21 |
2014-08-13 |
Agfa-Gevaert |
Dispersión que contiene nanopartículas metálicas, de óxido de metal o de precursor de metal, un dispersante polimérico y un aditivo de sinterización
|
|
JP2013135089A
(ja)
*
|
2011-12-27 |
2013-07-08 |
Ishihara Chem Co Ltd |
導電膜形成方法、銅微粒子分散液及び回路基板
|
|
JP5880100B2
(ja)
*
|
2012-02-10 |
2016-03-08 |
コニカミノルタ株式会社 |
透明電極の製造方法
|
|
US8716053B2
(en)
|
2012-02-16 |
2014-05-06 |
E I Du Pont De Nemours And Company |
Moisture barrier for photovoltaic cells
|
|
US20130218241A1
(en)
|
2012-02-16 |
2013-08-22 |
Nanohmics, Inc. |
Membrane-Supported, Thermoelectric Compositions
|
|
DE102012203166A1
(de)
|
2012-02-29 |
2013-08-29 |
Von Ardenne Anlagentechnik Gmbh |
Verfahren zum Herstellen elektrisch leitfähiger Strukturen
|
|
DE102012101729A1
(de)
*
|
2012-03-01 |
2013-09-05 |
Institut für Energie- und Umwelttechnik e.V. |
"Chemical Looping" - Verbrennungsverfahren
|
|
JP5179677B1
(ja)
*
|
2012-03-14 |
2013-04-10 |
イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー |
太陽電池セルの製造方法
|
|
WO2013142552A1
(en)
|
2012-03-21 |
2013-09-26 |
Bayer Materialscience Ag |
Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices
|
|
JP5849834B2
(ja)
*
|
2012-04-09 |
2016-02-03 |
コニカミノルタ株式会社 |
透明電極、透明電極の製造方法、及び該透明電極を用いた有機電子素子
|
|
KR20150002811A
(ko)
|
2012-04-12 |
2015-01-07 |
바이엘 머티리얼사이언스 아게 |
개선된 성능의 eap 트랜스듀서
|
|
FR2990055B1
(fr)
*
|
2012-04-30 |
2014-12-26 |
Total Sa |
Matrice de depot d'au moins un fluide conducteur sur un substrat, ainsi que dispositif comprenant cette matrice et procede de depot
|
|
GB2516570A
(en)
*
|
2012-05-18 |
2015-01-28 |
Unipixel Displays Inc |
Forming conductive patterns using ink comprising metal nanoparticles and nanowires
|
|
WO2013182896A1
(en)
*
|
2012-06-05 |
2013-12-12 |
Showa Denko K.K. |
Substrate film and sintering method
|
|
WO2013192143A1
(en)
|
2012-06-18 |
2013-12-27 |
Bayer Intellectual Property Gmbh |
Stretch frame for stretching process
|
|
DE102012105765A1
(de)
|
2012-06-19 |
2013-12-19 |
Lpkf Laser & Electronics Ag |
Verfahren zur Herstellung einer dreidimensionalen Leiterbahnstruktur sowie eine nach diesem Verfahren hergestellte Leiterbahnstruktur
|
|
JP5275498B1
(ja)
*
|
2012-07-03 |
2013-08-28 |
石原薬品株式会社 |
導電膜形成方法及び焼結進行剤
|
|
TW201419315A
(zh)
|
2012-07-09 |
2014-05-16 |
Applied Nanotech Holdings Inc |
微米尺寸銅粒子的光燒結法
|
|
US20150228371A1
(en)
*
|
2012-07-30 |
2015-08-13 |
National Institute Of Advanced Industrial Science And Techmology |
Method for producing electrically conductive thin film, and electrically conductive thin film produced by said method
|
|
JP5983173B2
(ja)
*
|
2012-08-14 |
2016-08-31 |
コニカミノルタ株式会社 |
透明電極の製造方法および有機電子素子の製造方法
|
|
US9954159B2
(en)
|
2012-08-16 |
2018-04-24 |
Parker-Hannifin Corporation |
Electrical interconnect terminals for rolled dielectric elastomer transducers
|
|
US9034417B2
(en)
*
|
2012-08-20 |
2015-05-19 |
E I Du Pont De Nemours And Company |
Photonic sintering of polymer thick film conductor compositions
|
|
US20140054065A1
(en)
|
2012-08-21 |
2014-02-27 |
Abner D. Joseph |
Electrical circuit trace manufacturing for electro-chemical sensors
|
|
JP2014067617A
(ja)
*
|
2012-09-26 |
2014-04-17 |
Fujifilm Corp |
導電膜の製造方法および導電膜形成用組成物
|
|
JP6093136B2
(ja)
*
|
2012-09-26 |
2017-03-08 |
株式会社Ｓｃｒｅｅｎホールディングス |
熱処理方法および熱処理装置
|
|
US9050775B2
(en)
*
|
2012-10-12 |
2015-06-09 |
Nano And Advanced Materials Institute Limited |
Methods of fabricating transparent and nanomaterial-based conductive film
|
|
CN104823248B
(zh)
*
|
2012-12-07 |
2017-05-17 |
富士胶片株式会社 |
导电膜的制造方法
|
|
JP6295025B2
(ja)
*
|
2012-12-25 |
2018-03-14 |
昭和電工株式会社 |
導電パターン形成方法及び光焼成用インク
|
|
KR102292668B1
(ko)
|
2013-03-29 |
2021-08-24 |
다이요 홀딩스 가부시키가이샤 |
광 소성용 열가소성 수지 필름 기재, 이를 사용한 도전 회로 기판 및 그의 제조 방법
|
|
EP2991083B1
(en)
*
|
2013-04-26 |
2021-06-09 |
Showa Denko K.K. |
Method for manufacturing electroconductive pattern and electroconductive pattern-formed substrate
|
|
US9190188B2
(en)
*
|
2013-06-13 |
2015-11-17 |
E I Du Pont De Nemours And Company |
Photonic sintering of polymer thick film copper conductor compositions
|
|
CN103350228B
(zh)
*
|
2013-07-05 |
2015-01-07 |
北京科技大学 |
一种辐照凝胶注模成形方法
|
|
KR101535118B1
(ko)
*
|
2013-10-31 |
2015-07-09 |
에이피시스템 주식회사 |
플렉서블 소자의 제조장치 및 방법
|
|
US20150189761A1
(en)
*
|
2013-12-20 |
2015-07-02 |
Intrinsiq Materials, Inc. |
Method for depositing and curing nanoparticle-based ink
|
|
US20150201504A1
(en)
*
|
2014-01-15 |
2015-07-16 |
Applied Nanotech, Inc. |
Copper particle composition
|
|
CN103745760B
(zh)
*
|
2014-01-16 |
2018-03-23 |
上海交通大学 |
基于全光激光等离子体加速器的γ射线源
|
|
WO2015136900A1
(ja)
|
2014-03-11 |
2015-09-17 |
国立大学法人山形大学 |
配線形成方法
|
|
US20150343564A1
(en)
*
|
2014-06-03 |
2015-12-03 |
Siemens Energy, Inc. |
Method for selective laser processing using electrostatic powder deposition
|
|
CN105472887B
(zh)
*
|
2014-07-31 |
2018-12-21 |
比亚迪股份有限公司 |
一种3d导电线路的制作方法
|
|
KR101595895B1
(ko)
*
|
2014-08-11 |
2016-02-19 |
주식회사 엔앤비 |
광소결로 접합된 은 나노와이어를 포함하는 투명전극용 필름, 광소결을 이용한 은 나노와이어 접합용 분산액 및 은 나노와이어의 접합 방법
|
|
FR3025936B1
(fr)
*
|
2014-09-11 |
2016-12-02 |
Saint Gobain |
Procede de recuit par lampes flash
|
|
CN107210083A
(zh)
|
2015-03-24 |
2017-09-26 |
昭和电工株式会社 |
导电图案形成用组合物和导电图案形成方法
|
|
KR20170014734A
(ko)
*
|
2015-07-31 |
2017-02-08 |
엘지전자 주식회사 |
태양 전지 및 이의 제조 방법
|
|
US9637648B2
(en)
|
2015-08-13 |
2017-05-02 |
E I Du Pont De Nemours And Company |
Photonic sintering of a solderable polymer thick film copper conductor composition
|
|
US9637647B2
(en)
|
2015-08-13 |
2017-05-02 |
E I Du Pont De Nemours And Company |
Photonic sintering of a polymer thick film copper conductor composition
|
|
KR102683995B1
(ko)
|
2016-01-21 |
2024-07-12 |
브룩해븐 테크놀로지 그룹, 인크. |
제2세대 초전도성 필라멘트와 케이블
|
|
US10294552B2
(en)
*
|
2016-01-27 |
2019-05-21 |
GM Global Technology Operations LLC |
Rapidly solidified high-temperature aluminum iron silicon alloys
|
|
CN107175929B
(zh)
*
|
2016-03-10 |
2020-02-14 |
塞米西斯科株式会社 |
光烧结装置及利用其的导电膜形成方法
|
|
WO2017162020A1
(en)
*
|
2016-03-22 |
2017-09-28 |
Jun Yang |
Method for solvent-free printing conductors on substrate
|
|
JP6994455B2
(ja)
|
2016-03-23 |
2022-01-14 |
昭和電工株式会社 |
導電性組成物用バインダー樹脂、これを含む導電パターン形成用組成物及びポリウレタン
|
|
EP3287499B1
(en)
*
|
2016-08-26 |
2021-04-07 |
Agfa-Gevaert Nv |
A metallic nanoparticle dispersion
|
|
WO2018048979A1
(en)
*
|
2016-09-07 |
2018-03-15 |
Brookhaven Technology Group, Inc. |
Reel-to-reel exfoliation and processing of second generation superconductors
|
|
EP3532223B1
(en)
|
2016-10-31 |
2024-05-08 |
Hewlett-Packard Development Company, L.P. |
Fusing of metallic particles
|
|
CN110382665A
(zh)
*
|
2017-05-15 |
2019-10-25 |
纳米及先进材料研发院有限公司 |
透明导电膜及其制备方法
|
|
EP3635754B1
(en)
|
2017-06-09 |
2024-11-27 |
Brookhaven Technology Group, Inc. |
Flexible multi-filament high temperature superconducting cable
|
|
US11152556B2
(en)
|
2017-07-29 |
2021-10-19 |
Nanohmics, Inc. |
Flexible and conformable thermoelectric compositions
|
|
WO2019212481A1
(en)
|
2018-04-30 |
2019-11-07 |
Hewlett-Packard Development Company, L.P. |
Additive manufacturing of metals
|
|
CN112351841B
(zh)
*
|
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2023-08-15 |
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|
|
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(en)
|
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|
|
US10493571B1
(en)
*
|
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|
|
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(en)
*
|
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|
|
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(en)
|
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|
|
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(en)
|
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|
|
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(de)
*
|
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|
|
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(en)
|
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|
|
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(en)
|
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|
|
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(ja)
*
|
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|
|
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(zh)
*
|
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|
|
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*
|
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|
|
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(ko)
*
|
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|